SD3118-471-R

Technical Data 4084 Effective September 2015 Supersedes November 2009 SD3118 Low profile power inductors Applications • Mobile/smart phones • Tablets/e-readers • Media players • Digital cameras • Small LED driver and LCD displays • Handheld/mobile equipment Environmental Data Description • Low profile shielded drum core • Compact footprint utilizes less board space • Inductance Range from 1.0μH to 1,000μH • Current range from 0.083 to 2.94 amps • 3.2 x 3.2mm footprint surface mount package in a 1.8mm height • Ferrite core material • Halogen free, lead free, RoHS compliant • Storage temperature range (Component): -40°C to +125°C • Operating temperature range: -40°C to +125°C (ambient + self-temperature rise) • Solder reflow temperature: J-STD-020D compliant HALOGEN Pb HF FREE SD3118 Low profile power inductors  Technical Data 4084 Effective September 2015 Product Specifications Part Number6 OCL1 (μH) Part marking designator Irms2 (amps) Isat3 (amps) DCR (Ω) typical @ +20°C K-factor4 SD3118-1R0-R 1.04±30% A 2.01 3.07 0.041 84 SD3118-1R5-R 1.44±30% B 1.81 2.42 0.051 68 SD3118-2R2-R 2.12±30% C 1.50 2.00 0.074 57 SD3118-3R3-R 3.36±30% D 1.22 1.59 0.11 56 SD3118-4R7-R 4.90±30% E 1.02 1.31 0.16 39 SD3118-6R8-R 6.72±30% F 0.85 1.12 0.23 32 SD3118- 8R2-R 8.10±30% G 0.81 1.02 0.26 29 SD3118- 100-R 10.4±30% H 0.75 0.90 0.30 26 SD3118-150-R 14.9±30% I 0.62 0.75 0.44 21 SD3118-220-R 22.5±30% J 0.50 0.61 0.68 18 SD3118-330-R 33.1±30% K 0.41 0.51 0.99 14 SD3118-470-R 47.5±30% L 0.37 0.42 1.2 12 SD3118-221-R 222±20% M 0.182 0.177 4.8 6 SD3118-331-R 330±20% N 0.146 0.145 7.4 5 SD3118-471-R 470±20% O 0.130 0.122 9.2 4 SD3118-681-R 680±20% P 0.107 0.101 14 3 SD3118-102-R 999±20% Q 0.087 0.083 21 3 1. Open Circuit Inductance (OCL) Test Parameters: 100kHz, 0.1Vrms, 0.0Adc, @ +25°C 2. Irms: DC current for an approximate temperature rise of 40°C without core loss. Derating is necessary for AC currents. PCB layout, trace thickness and width, air-flow, and proximity of other heat generating components will affect the temperature rise. It is recommended that the temperature of the part not exceed 125°C under worst case operating conditions verified in the end application. 3. Isat: Peak current for approximately 30% rolloff @ +20°C 4. K-factor: Used to determine Bp-p for core loss (see graph). Bp-p = K * L * ΔI. Bp-p: (mTesla), K: (K-factor from table), L: (Inductance in μH), ΔI (Peak to peak ripple current in Amps). 5. Part Number Definition: SD3118-xxx-R SD3118 = Product code and size xxx= Inductance value in uH, R= decimal point, if no R is present then last character equals number of zeros -R suffix = RoHS compliant Dimensions (mm) Pin #1 indicator 1.8 max Recommended Pad Layout 3.9 max 1.5 typ 2.40 Schematic 1 1.70 3.2 max 3.2 max Part marking: dot for pin 1 indicator (orientation purposes only) xxx = 3 digit marking (first digit indicates inductance value per letter in Part marking designator, second digit is bi-weekly date code, third digit is last digit of year produced) All soldering surfaces to be coplanar within 0.10 millimeters PCB tolerances are ±0.1 millimeters unless stated otherwise Do not route traces or vias underneath the inductor 2 www.eaton.com/elx 0.8 2 SD3118 Low profile power inductors Technical Data 4084 Effective September 2015  Packaging information (mm) Supplied in tape and reel packaging, 4,100 parts per 13” diameter reel 4.00 1.2 Dia. min. 1.5 Dia. +0.1/-0.0 2.00 1.75 A Ao = 4.0mm A1 = 0.93mm Bo = 4.20mm B1 = 1.25mm Ko = 2.00mm 1 B1 10.25 Bo 5.50 12.0 ±0.3 2 3.4 Ko A1 SECTION A-A Ao 3.4 A 8.0 Direction of feed Temperature Rise (°C) Temperature rise vs. total loss 90 80 70 60 50 40 30 20 10 0 0 0.05 0.1 0.15 0.2 0.25 0.3 0.35 0.4 0.45 Total Loss(W) www.eaton.com/elx 3 SD3118 Low profile power inductors  Technical Data 4084 Effective September 2015 Core loss vs. Bp-p 10 Core Loss (W) 1MHz 1 500kHz 0.1 300kHz 200kHz 100kHz 50kHz 0.01 0.001 0.0001 0.00001 10 10 100 1000 Bp-p (mT) Inductance characteristics OCL vs. lsat 120% 110% 100% % of L initial 90% 80% 70% -40°C 60% 50% 40% 25°C 30% 85°C 20% 10% 0% 0% 10% 20% 30% 40% 50% 60% 70% 80% % of lsat 4 www.eaton.com/elx 90% 100% 110% 120% 130% 140% SD3118 Low profile power inductors Technical Data 4084 Effective September 2015  Solder reflow profile TP TC -5°C tP Max. Ramp Up Rate = 3°C/s Max. Ramp Down Rate = 6°C/s Temperature TL Preheat A T smax t Table 1 - Standard SnPb Solder (Tc) Package Thickness Volume mm3