HCP0704-1R0-R

Technical Data 4348 Effective July 2017 Supersedes February 2009 HCP0704 High current power inductors Applications Product features • 6.8 x 6.8 x 4.2 mm surface mount package • Iron powder core material • • • High current carrying capacity, low core losses • Tight DCR tolerance for sensing circuits • Inductance range from 0.40 µH to 4.7 µH • Current range from 5.0 A to 27 A • Frequency range up to 2 MHz • Halogen free, lead free, RoHS compliant • Voltage Regulator Module (VRM) • Multi-phase regulators • Desktop and servers • Base station equipment • Notebook and laptop regulators • Data networking and storage systems • Point-of-load modules (POL) • Battery power systems • DCR sensing circuits Environmental Data • Storage temperature range (Component): -40 °C to +155 °C Magnetically shielded, low EMI • High temperature core material eliminates thermal aging issues Operating temperature range: -40 °C to +155 °C (ambient plus self-temperature rise) • Solder reflow temperature: J-STD-020 (latest revision) compliant HALOGEN Pb HF FREE  Technical Data 4348 Effective July 2017  Product Specifications Part Number6 OCL1 ± 25% (μH) FLL2 Min. (μH) 0.40 0.60 1.00 1.80 2.30 3.30 4.70 0.28 0.42 0.7 1.26 1.56 2.31 3.29 HCP0704-R40-R HCP0704-R60-R HCP0704-1R0-R HCP0704-1R8-R HCP0704-2R3-R HCP0704-3R3-R HCP0704-4R7-R Isat4 @ +25 °C (A) 27 21 17 13 11.5 9.5 8.0 Irms3 (A) 17 14 12 8.5 7.5 6.0 5.0 1 Open Circuit Inductance (OCL) Test Parameters: 100 kHz, 0.10 Vrms, 0.0 Adc 2 Full Load Inductance (FLL) Test Parameters: 100 kHz, 0.1 Vrms, Isat1 DCR (mΩ) @ +20 °C 3.2 ±10% 4.5 ±10% 6.2 ±10% 11.0 ±10% 16.5 ±10% 25.0 ±10% 29.5 ±10% K-factor5 383.1 313.5 265.3 202.8 164.2 149.9 127.7 4 Isat: Peak current for approximately 20% rolloff at +25 °C. 5 K-factor: Used to determine Bp-p for core loss (see graph). Bp-p = K * L * ΔI : (Gauss), K: (K-factor 3 Irms: DC current for an approximate temperature rise of 40 °C without core loss. Derating from table), L: (inductance in μH), ΔI (peak-to-peak ripple current in amps). 6 Part Number Definition: HCP0704-xxx-R • HCP0704 = Product code and size • xxx= Inductance value in μH, R = decimal point. If no “R” is present, then third character = # of zeros • “-R” suffix = RoHS compliant is necessary for AC currents. PCB pad layout, trace thickness and width, air-flow and proximity of other heat generating components will affect the temperature rise. It is recommended the part temperature not exceed +125 °C under worst case operating conditions verified in the end application. Dimensions (mm) T op V iew R ecom m ended P ad Layout B ottom V iew S ide V iew H C P 0704-R 40 to 2R 3= 1.20 +/- 0.2 H C P 0704-3R 3 to 4R 7= 1.00 +/- 0.2 H C P 0704-R 40 to 1R 0= 4.20 m ax H C P 0704-1R 8 to 4R 7= 4.00 m ax 7.60 6.80 M ax 2.50(2x) 1 w w llyy R H C P0704 xxx 3.3±0.3 6.80 M ax 1 S chem atic 2 2 4.00(2x) 1 2 The nominal DCR test point is in the middle of the terminal Part Marking: HCP0704 xxx = Inductance value in μH. (R = Decimal point). If no “R” is present, then last character is # of zeros wwllyy = Date code R = Revision level Do not route traces or vias underneath the inductor Packaging information (mm) Supplied in tape and reel packaging, 1000 parts per 13” diameter reel. 1.5 Dia min. 4.0 2.0 1.5 Dia. +0.1/-0.0 1.75 A Section A-A 1 7.50 HCP0704 xxx wwllyy R 6.8 2 HCP0704-R40 to 1R0= 4.2 HCP0704-1R8 to 4R7= 4.0 2 www.eaton.com/electronics A 6.9 12.0 User direction of feed 7.5 16.0 ±0.3 HCP0704 High current power inductors Technical Data 4348 Effective July 2017 Temperature rise vs. total loss 60 Te mpe ta ture R is e (°C) 50 40 30 20 10 0 0 0.2 0.4 0.6 0.8 1 1.2 1.4 Tota l Los s (W) Core loss vs. Bp-p 5 0 0 kHz 1 MHz C ore L os s ( W ) 10 1 0 0 kHz 2 5 0 kHz 1 0. 1 0. 01 0. 001 10 100 1000 10000 B p-p ( G aus s ) www.eaton.com/electronics 3  Technical Data 4348 Effective July 2017  Inductance characteristics % o f O C L v s % o f I sat 100% 80% % o f O CL 25°C 60% 40% 20% 0% 0% 20% 40% 60% 80% % o f I sat 4 www.eaton.com/electronics 100% 120% 140% 160%  Technical Data 4348 Effective July 2017  Solder reflow profile TP TC -5°C tP Max. Ramp Up Rate = 3°C/s Max. Ramp Down Rate = 6°C/s Temperature TL Preheat A T smax t Table 1 - Standard SnPb Solder (Tc) Package Thickness Volume mm3