MPI5451R3-6R8-R

Technical Data 10247 Effective June 2014 MPI5451 High current, low profile power inductors Applications • Handheld/mobile devices • Portable media players • MP3 Players • Battery operated devices • Notebook/netbook • Tablets/smartbooks • LCD Displays • LED Drivers e v i t c e l f i f t E n , u d r e o u 6 n i 1 t 0 . n 2 d o , e c t 1 s i e l y D r p a e u d r s b i d y e Fe r d o e n t l e n b e a m l i v a n m Pb HF i v o a c t e r n No ceme a l p re Environmental data Product description • Halogen free, lead free, RoHS compliant • 125°C maximum total temperature operation • 5.74 x 5.43 footprint surface mount package with either 1.2 or 2.0mm heights • Magnetically shielded, low EMI • Rugged construction • Inductance range from 0.33µH to 15µH • Current range from 1.1 to 11.5 amps • Storage temperature range (Component): -40°C to +125°C • Operating temperature range: -40°C to +125°C (ambient + self-temperature rise) • Solder reflow temperature: J-STD-020D compliant Packaging • Supplied in tape and reel packaging on a 13” diameter reel HALOGEN FREE Technical Data 10247 MPI5451 High current, low profile power inductors Effective June 2014 Product specifications OCL1 (μH) ± 20% Part Number5 Irms2 (Amps) Isat3 (Amps) DCR (mΩ) @ 25°C ± 20% K-Factor4 R1 - 1.2mm height MPI5451R1-R33-R 0.33 6.5 11.5 13 1244 MPI5451R1-R47-R 0.47 6.1 10.9 18 995 MPI5451R1-1R0-R 1.0 4.2 7.2 30 622 MPI5451R1-1R5-R 1.5 3.4 6.1 48 498 MPI5451R1-2R2-R 2.2 ± 15% 2.6 4.8 70 452 MPI5451R1-3R3-R 3.3 ± 15% 2.3 3.8 95 355 MPI5451R1-4R7-R 4.7 ± 15% 2.1 3.5 120 293 MPI5451R1-5R6-R 5.6 ± 15% 1.9 3.1 145 249 MPI5451R1-6R8-R 6.8 ± 15% 1.7 2.8 175 237 MPI5451R1-100-R 10.0 ± 15% 1.3 2.5 290 199 MPI5451R1-150-R 15.0 ± 15% 1.1 2.2 400 155 MPI5451R3-R47-R 0.47 6.0 9.0 8.8 1244 MPI5451R3-R68-R 0.68 5.9 8.0 9.5 995 MPI5451R3-1R0-R 1.0 5.1 6.6 14 711 MPI5451R3-1R5-R 1.5 5.0 5.8 16 553 MPI5451R3-2R2-R 2.2 4.1 5.0 24 452 MPI5451R3-3R3-R 3.3 3.7 4.2 33 383 MPI5451R3-4R7-R 4.7 3.0 3.8 50 293 MPI5451R3-6R8-R 6.8 2.6 3.0 70 249 MPI5451R3-100-R 10.0 2.1 2.4 110 207 e v i t c e l f i f t E n , u d r e o u 6 n i 1 t 0 . n 2 d o , e c t 1 s i e l y D r p a e u d r s b i d y e Fe r d o e n t l e n b e a m l i v a n m i v o a c t re n e o N m e c a l rep R3 - 2.0mm height 1. Open Circuit Inductance (OCL) Test Parameters: 100kHz, 0.1Vrms, 0.0Adc, 25°C 2. Irms: DC current for an approximate temperature rise of 40°C without core loss. Derating is necessary for AC currents. PCB layout, trace thickness and width, air-flow, and proximity of other heat generating components will affect the temperature rise. It is recommended that the temperature of the part not exceed 125°C under worst case operating conditions verified in the end application. 3. Isat: Peak current for approximately 20% rolloff at +25°C Dimensions - mm 2 4. K-factor: Used to determine Bp-p for core loss (see graph). Bp-p = K * L * ∆I. Bp-p:(Gauss), K: (K-factor from table), L: (Inductance in µH), ∆I (Peak to peak ripple current in Amps). 5. Part Number Definition: MPI5451Rx-yyy-R - MPI5451Rx = Product code and size - yyy= Inductance value in uH, R = decimal point, if no R is present then third character = number of zeros - “-R” suffix = RoHS compliant MPI5451 High current, low profile power inductors Technical Data 10247 Effective June 2014 Packaging information - mm e v i t c e l f i f t E n , u d r e o u 6 n i 1 t 0 . n 2 d o , e c t 1 s i e l y D r p a e u d r s b i d y e Fe r d o e n t l e n b e a m l i v a n m i v o a c t re n e o N m e c a l rep Supplied in tape and reel packaging, MPI5451R1 4000 parts per 13” diameter reel MPI5451R3 3000 parts per 13” diameter reel Core loss www.eaton.com/elx 3 Technical Data 10247 Effective June 2014 MPI5451 High current, low profile power inductors Inductance characteristics / temperature rise e v i t c e l f i f t E n , u d r e o u 6 n i 1 t 0 . n 2 d o , e c t 1 s i e l y D r p a e u d r s b i d y e Fe r d o e n t l e n b e a m l i v a n m i v o a c t re n e o N m e c a l rep 4 MPI5451 High current, low profile power inductors Technical Data 10247 Effective June 2014 Inductance characteristics / temperature rise e v i t c e l f i f t E n , u d r e o u 6 n i 1 t 0 . n 2 d o , e c t 1 s i e l y D r p a e u d r s b i d y e Fe r d o e n t l e n b e a m l i v a n m i v o a c t re n e o N m e c a l rep www.eaton.com/elx 5 Technical Data 10247 Effective June 2014 MPI5451 High current, low profile power inductors Inductance characteristics / temperature rise e v i t c e l f i f t E n , u d r e o u 6 n i 1 t 0 . n 2 d o , e c t 1 s i e l y D r p a e u d r s b i d y e Fe r d o e n t l e n b e a m l i v a n m i v o a c t re n e o N m e c a l rep 6 MPI5451 High current, low profile power inductors Technical Data 10247 Effective June 2014 Inductance characteristics / temperature rise e v i t c e l f i f t E n , u d r e o u 6 n i 1 t 0 . n 2 d o , e c t 1 s i e l y D r p a e u d r s b i d y e Fe r d o e n t l e n b e a m l i v a n m i v o a c t re n e o N m e c a l rep www.eaton.com/elx 7 Technical Data 10247 MPI5451 High current, low profile power inductors Effective June 2014 Solder reflow profile TP TC -5°C tP Max. Ramp Up Rate = 3°C/s Max. Ramp Down Rate = 6°C/s Package Thickness Temperature TL 25°C Preheat A T smax Table 1 - Standard SnPb Solder (T c) t Volume mm3 220°C 220°C Table 2 - Lead (Pb) Free Solder (T c) Tsmin Package Thickness 2.5mm ts Volume mm3 2000 260°C 245°C 245°C Time Reference JDEC J-STD-020D Profile Feature Preheat and Soak Standard SnPb Solder 100°C • Temperature min. (Tsmin) • Temperature max. (Tsmax) • Time (Tsmin to Tsmax) (ts) Average ramp up rate Tsmax to Tp Liquidous temperature (TL) Time at liquidous (tL) Peak package body temperature (TP)* Time (tp)** within 5 °C of the specified classification temperature (Tc) Average ramp-down rate (Tp to Tsmax) Time 25°C to Peak Temperature Lead (Pb) Free Solder 150°C 150°C 200°C 60-120 Seconds 60-120 Seconds 3°C/ Second Max. 3°C/ Second Max. 183°C 60-150 Seconds 217°C 60-150 Seconds Table 1 Table 2 20 Seconds** 30 Seconds** 6°C/ Second Max. 6°C/ Second Max. 6 Minutes Max. 8 Minutes Max. * Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum. ** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum. Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also reserves the right to change or update, without notice, any technical information contained in this bulletin. Eaton Electronics Division 1000 Eaton Boulevard Cleveland, OH 44122 United States www.eaton.com/elx © 2014 Eaton All Rights Reserved Publication No. 10247 — BU-SB14346 June 2014 Eaton is a registered trademark. All other trademarks are property of their respective owners.