FP1308R1-R32-R

Technical Data 4355 Effective June 2017 Supersedes March 2012 FP1308R High frequency, high current power inductors Applications • • • • • • • SMD Device Environmental data • Product features • • • • • • • 13.4 x 12.7 x 8.0mm surface mount package Ferrite core material High current carrying capacity, Low core losses Controlled DCR tolerance for sensing circuits Inductance range from 110nH to 440nH Current range from 37 to 120 Amps Frequency range up to 2MHz Multi-phase regulators Voltage Regulator Module (VRM) Desktop and server VRMs and EVRDs Data networking and storage systems Graphics cards and battery power systems Point-of-load modules DCR sensing • • Storage temperature range (component): -40 °C to +125 °C Operating temperature range: -40 °C to +125 °C (ambient plus self-temperature rise) Solder reflow temperature: J-STD-020 (latest revision) compliant Pb HF FREE HALOGEN  Technical Data 4355 Effective June 2017 Product Specifications Part Number R1 Version FP1308R1-R11-R FP1308R1-R21-R FP1308R1-R26-R FP1308R1-R32-R FP1308R1-R44-R R2 Version FP1308R2-R11-R FP1308R2-R21-R FP1308R2-R26-R FP1308R2-R32-R FP1308R2-R44-R R3 Version FP1308R3-R11-R FP1308R3-R21-R FP1308R3-R26-R FP1308R3-R32-R FP1308R3-R44-R 7 OCL1 FLL2 ± 10% (nH) (nH) 110 210 260 320 440 79 152 187 230 317 110 210 260 320 440 79 152 187 230 317 110 210 260 320 440 79 152 187 230 317 Irms3 (Amps) Isat14 @ 25°C (Amps) Isat25 @ 125°C (Amps) 57 120 80 64 52 37 105 68 52 40 28 45 120 80 64 52 37 105 68 52 40 28 68 120 80 64 52 37 105 68 52 40 28 1 Open Circuit Inductance (OCL) Test Parameters: 100kHz, 1.0Vrms, 0.0Adc 2 Full Load Inductance (FLL) Test Parameters: 100kHz, 1.0Vrms, Isat1. 3 Irms: DC current for an approximate temperature rise of 40°C without core loss. Derating is DCR (mΩ) @ 20°C K-factor6 0.32 ± 9.4% 233 233 233 233 233 0.53 ± 10% 233 233 233 233 233 0.18 ± 20% 233 233 233 233 233 5 Isat2: Peak current for approximately 20% rolloff at +125°C. 6 K-factor: Used to determine Bp-p for core loss (see graph). Bp-p = K * L * ΔI * 10-3. Bp-p (Gauss), K: (K-factor from table), L: (inductance in nH), ΔI (peak-to-peak ripple current in amps). 7 Part Number Definition: FP1308Rx-Rxx-R necessary for AC currents. PCB pad layout, trace thickness and width, air-flow and proximity of other heat generating components will affect the temperature rise. It is recommended the part temperature not exceed 125°C under worst case operating conditions verified in the end application. • FP1308 = Product code and size • Rx = DCR indicator • Rxx = Inductance value in μH, R = decimal point. • “-R” suffix = RoHS compliant 4 Isat: Peak current for approximately 20% rolloff at +25°C. Dimensions- mm T op V iew S ide V iew 12.7 m ax 8.0 m ax 1 1308R x R xx w w llyy R B ottom V iew R ecom m ended P ad Layout 5.08 ±0.15 b S chem atic 7.62 1 1 3.18 2.54 ±0.3 7.2 7.5 typ. 13.4 m ax 2 2 2 a The nominal DCR is measured from point “a” to point “b” All soldering surfaces to be coplanar within 0.1016mm. Part Marking: FP1308R (Rx = DRC indicator) Rxx = Inductance value in μH. (R = Decimal point). wwllyy = Date code R = Revision level Packaging information - mm 4.0 1.5 dia 2.0 Section A-A 1.5 dia min A 1 13.9 11.5 24.0 ±0.3 1308Rx R xx w w llyy R 2 13.2 8.2 Supplied in tape-and-reel packaging, 400 parts per reel, 13” diameter reel. 2 www.eaton.com/electronics 1.75 A 20.0 User direction of feed FP1308R High frequency, high current power inductor Technical Data 4355 Effective June 2017 Temperature rise vs total loss 60 T e m p e ra tu re R is e (°C ) 50 F P1 3 0 8 R 2 F P1 3 0 8 R 1 40 30 F P1 3 0 8 R 3 20 10 0 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 500kH z 300kH z T o ta l L o s s (W ) Core loss vs Bp-p 1M H z 200kH z 10 C o re L o s s (W ) 100kH z 1 0 .1 0 .0 1 100 1000 10000 B p -p (G a u s s ) Inductance characteristics % o f O C L vs % o f I s a t 1 100% 80% % o f O CL -4 0 °C 60% 40% +2 5 °C 20% +1 2 5 °C 0% 0% 20% 40% 60% 80% 100% 120% 140% % o f Is a t 1 www.eaton.com/electronics 3 FP1308R High frequency, high current power inductor Technical Data 4355 Effective June 2017 Solder Reflow Profile TP TC -5°C Temperature TL 25°C Preheat A T smax Table 1 - Standard SnPb Solder (Tc) tP Max. Ramp Up Rate = 3°C/s Max. Ramp Down Rate = 6°C/s t Volume mm3 220°C 220°C Table 2 - Lead (Pb) Free Solder (T c) Tsmin Package Thickness 2.5mm ts Time 25°C to Peak Volume mm3 2000 260°C 245°C 245°C Time Reference JDEC J-STD-020 Profile Feature Preheat and Soak • Temperature min. (Tsmin) • Temperature max. (Tsmax) • Time (Tsmin to Tsmax) (ts) Average ramp up rate Tsmax to Tp Liquidous temperature (TL) Time at liquidous (tL) Peak package body temperature (TP)* Time (tp)** within 5 °C of the specified classification temperature (Tc) Average ramp-down rate (Tp to Tsmax) Time 25°C to Peak Temperature Standard SnPb Solder 100°C Lead (Pb) Free Solder 150°C 150°C 200°C 60-120 Seconds 60-120 Seconds 3°C/ Second Max. 3°C/ Second Max. 183°C 60-150 Seconds 217°C 60-150 Seconds Table 1 Table 2 20 Seconds** 30 Seconds** 6°C/ Second Max. 6°C/ Second Max. 6 Minutes Max. 8 Minutes Max. * Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum. ** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum. Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also reserves the right to change or update, without notice, any technical information contained in this bulletin. Eaton Electronics Division 1000 Eaton Boulevard Cleveland, OH 44122 United States www.eaton.com/electronics © 2017 Eaton All Rights Reserved Printed in USA Publication No. 4355 BU-SB12178 June 2017 Eaton is a registered trademark. All other trademarks are property of their respective owners.