UP2C-1R5-R

Technical Data 4111 Effective August 2017 Supersedes March 2007 UP2C UNI-PAC™ drum core power inductors Applications • • • • • • • • Desktop computer Workstations/servers DVD Players Portable power devices Base stations Industrial power supplies Output filter chokes Test equipment instrumentation Environmental data Product features • • • • • Miniature surface mount design with rugged case to eliminate core breakage Inductance range from 0.470 uH to 1000 uH Current range up to 18.6 A peak Meets UL94V-0 flammability standard Ferrite core material • • • Storage temperature range (component): -40 °C to +125 °C Operating temperature range: -40 °C to +125 °C (ambient plus self-temperature rise) Solder reflow temperature: J-STD-020 (latest revision) compliant Technical Data 4111 UP2C UNI-PAC™ drum core power inductors Effective August 2017 Product specifications Part Number Inductance µH (rated) 0.470 1.0 1.5 2.2 3.3 4.7 6.8 10.0 15.0 22.0 33.0 47.0 68.0 100.0 150.0 220.0 330.0 470.0 680.0 1000.0 UP2C-R47-R UP2C-1R0-R UP2C-1R5-R UP2C-2R2-R UP2C-3R3-R UP2C-4R7-R UP2C-6R8-R UP2C-100-R UP2C-150-R UP2C-220-R UP2C-330-R UP2C-470-R UP2C-680-R UP2C-101-R UP2C-151-R UP2C-221-R UP2C-331-R UP2C-471-R UP2C-681-R UP2C-102-R OCL(1) µH±20% I RMS(2) (A) I SAT(3) (A) 0.48 1.03 1.45 2.00 3.30 4.41 7.16 10.56 15.97 22.33 32.11 47.90 65.03 97.85 141.9 207.8 318.2 470.8 689.7 1080.0 12.2 9.80 8.10 7.50 5.90 5.62 4.42 3.61 3.17 2.61 2.16 1.77 1.57 1.26 1.04 0.82 0.67 0.56 0.46 0.38 18.6 11.8 10.0 8.67 6.84 6.20 4.82 3.94 3.17 2.65 2.20 1.83 1.53 1.24 1.02 0.85 0.70 0.58 0.48 0.40 DCR(4) mΩ typ. 2.5 3.9 5.6 6.6 10.5 11.7 18.0 28.3 36.9 54.0 79.7 118.5 151.7 233.1 351.4 545.0 824.3 1191.4 1774.2 2657.1 Volts(5) µs (typ) 4.15 7.0 8.3 9.6 12.1 13.4 17.3 21.1 26.2 31.3 37.7 45.4 54.3 67.1 81.2 97.8 120 144 173 209 (4) DCR limits +20 °C. (5) Applied volt-time product (V-us) across the inductor. This value represents the applied v-us at 300 kHz necessary to generate a core loss equal to 10% of the total losses for a 40 °C temperature rise. Notes: (1) Open Circuit Inductance Test Parameters: 100 kHz, .250 Vrms, 0.0 Adc. (2) RMS current for an approximate ∆T of 40 °C without core loss, at an ambient temperature of +85 ˚C. (3) Peak current for approximately 30% rolloff @ +20 °C. Dimensions-mm TOP VIEW FRONT VIEW PCB PAD LAYOUT 5.2 12.90 Max. 1 UP2C xxx wwllyy R SIDE VIEW 1 SCHEMATIC 7.37 2.79 3.0ref 9.40 Max. 2.92 2 2 COMPONENT VIEW 2.5max* see note A (A) 2.5mm max is width of copper at seating plane. The width above the seating plane may exceed 2.5mm. Dimensions in Millimeters. wwllyy = (date code) R = revision level xxx = Inductance value per family chart Do not route traces or vias underneath the inductor Packaging information-mm 4.0 1.5 dia +0.1/-0.0 2.0 1.5 dia min A 1.7 1 11.5 24.0 +/-0.3 B0 ACTUAL SIZE UNIPAC 2C 2 Ao=9.50mm Bo=13.0mm Ko=5.7mm 2 K0 SECTION A-A www.eaton.com/electronics A A0 12.0 User direction of feed Supplied in tape and reel packaging, 900 parts per reel UP2C UNI-PAC™ drum core power inductors Technical Data 4111 Effective August 2017 Inductance characteristics Core loss I RMS DERATING WITH CORE LOSS 0 40 50 60 70 Hz 10 0K 50 0K Hz 30 0K Hz 20 0K Hz Hz 80 1M % of Losses from Irms (maximum) 20 90 92 94 95 96 97 98 99 10 20 30 40 50 60 80 100 200 300 400 500 600 800 1000 % of Applied Volt-µ-seconds www.eaton.com/electronics 3 UP2C UNI-PAC™ drum core power inductors Technical Data 4111 Effective August 2017 Solder Reflow Profile TP tP Max. Ramp Up Rate = 3°C/s Max. Ramp Down Rate = 6°C/s Temperature TL 25°C Preheat A T smax t TC -5°C Table 1 - Standard SnPb Solder (Tc) Volume mm3 220°C 220°C Table 2 - Lead (Pb) Free Solder (T c) Tsmin ts Package Thickness 2.5mm Time 25°C to Peak Volume mm3 2000 260°C 245°C 245°C Time Reference JDEC J-STD-020 Profile Feature Preheat and Soak • Temperature min. (Tsmin) • Temperature max. (Tsmax) • Time (Tsmin to Tsmax) (ts) Average ramp up rate Tsmax to Tp Liquidous temperature (TL) Time at liquidous (tL) Peak package body temperature (TP)* Time (tp)** within 5 °C of the specified classification temperature (Tc) Average ramp-down rate (Tp to Tsmax) Time 25°C to Peak Temperature Standard SnPb Solder 100°C Lead (Pb) Free Solder 150°C 150°C 200°C 60-120 Seconds 60-120 Seconds 3°C/ Second Max. 3°C/ Second Max. 183°C 60-150 Seconds 217°C 60-150 Seconds Table 1 Table 2 20 Seconds** 30 Seconds** 6°C/ Second Max. 6°C/ Second Max. 6 Minutes Max. 8 Minutes Max. * Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum. ** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum. Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also reserves the right to change or update, without notice, any technical information contained in this bulletin. Eaton Electronics Division 1000 Eaton Boulevard Cleveland, OH 44122 United States www.eaton.com/electronics © 2017 Eaton All Rights Reserved Printed in USA Publication No. 4111 August 2017 Eaton is a registered trademark. All other trademarks are property of their respective owners.