FP1108R1-R18-R

Technical Data 10227 Effective September 2017 Supersedes April 2014 FP1108R High frequency, high current power inductors Applications • • • • • • • • Multi-phase regulators Voltage Regulator Modules (VRMs) Desktop and server VRMs and EVRDs Notebook and laptop regulators Data networking and storage systems Graphics cards and battery power systems Point-of-Load modules DCR Sensing circuits Environmental data • Product features • • • • • 11.0 mm x 8.0 mm x 7.5 mm surface mount package Ferrite core material Tight tolerance DCR for sensing circuits Inductance range from 100 nH to 210 nH Current range from 55 A to 100+ A • • Storage temperature range (component): -40 °C to +125 °C Operating temperature range: -40 °C to +125 °C (ambient plus self-temperature rise) Solder reflow temperature: J-STD-020 (latest revision) compliant Pb HF FREE HALOGEN  Technical Data 10227 Effective September 2017 Product specifications OCL1 (nH) ±10% FLL min.2 (nH) FP1108R1-R10-R 100 81 FP1108R1-R15-R 150 110 Part Number9 FP1108R1-R18-R 180 132 FP1108R1-R21-R 210 151 Irms3 (A) Isat14 (A) 100+ Isat25 (A) Isat36 (A) Isat47 (A) 96 94 90 77 72 66 63 65 65 61 58 50 55 51 48 45 1. Open Circuit Inductance (OCL) Test Parameters: 100 kHz, 0.1 Vrms, 0.0 Adc, +25 °C 2. Full Load Inductance (FLL) Test Parameters: 100 kHz, 0.1 Vrms, Isat1, +25 °C 3. Irms: DC current for an approximate temperature rise of 40 °C without core loss. Derating is necessary for AC currents. PCB layout, trace thickness and width, air-flow, and proximity of other heat generating components will affect the temperature rise. It is recommended that the temperature of the part not exceed +125 °C under worst case operating conditions verified in the end application. 4. Isat1 : Peak current for approximately 20% (R10 10%) rolloff @ +25 °C (R10 10%) 5. Isat2: Peak current for approximately 20% (R10 10%) rolloff @ +85 °C DCR (mΩ) @ +20 °C 330 0.29±5% FP1108R1 xxx wwllyy R 0.2 typ. 10.7 ±0.3 A Front View 7.5 max Schematic 2.1 ±0.2 B 6.7 typ. 11.4 2.0 ±0.2 3.10 (2x) 2.50 (2x) DCR measured from point “A” to point “B” Part marking: FP1108R1 (Product code and size), xxx = Inductance value in µH, wwllyy= date code, R= revision level Tolerances are ±0.15 millimeters unless stated otherwise PCB tolerances are ±0.1millimeters unless otherwise specified. All soldering surfaces to be be coplanar within 0.1 millimeters. Termination finish: matte Sn with Ni underplate Do not route traces or vias underneath inductor Packaging information - mm 1.5 dia 1.75 A 4.0 11.5 2.0 24 ±0.3 FP1108R1 xxx 11.2 wwllyy R 16.0 A 1.5 dia User Direction of Feed Supplied in tape and reel packaging, 500 parts per 13” diameter reel, 2 www.eaton.com/electronics 330 6. Isat3 : Peak current for approximately 20% (R10 10%) rolloff @ +100 °C 7. Isat4: Peak current for approximately 20% (R10 10%) rolloff @ +125 °C 8. K-factor: Used to determine Bp-p for core loss (see graph). Bp-p = K * L * ∆I. Bp-p:(Gauss), K: (K-factor from table), L: (Inductance in µH), ∆I (peak to peak ripple current in amps). 9. Part Number Definition: FP1108Rx-yyy-R - FP1108Rx = Product code and size - Rx = DCR indicator - yyy= Inductance value in µH - “-R” suffix = RoHS compliant Recommended Pad Layout Bottom View Side View 330 330 Dimensions - mm Top View 7.7 +0.3/-0.2 K-factor8 8.2 7.7 Section A-A FP1108R High frequency, high current power inductor Technical Data 10227 Effective September 2017 Temperature rise vs total loss 60 Temperature Rise (°C) 50 40 30 20 10 0 0.0 0.5 1.0 1.5 2.0 2.5 Total Loss (W) Core loss vs Bp-p Core Loss vs. Bp-p 10 Core Loss (W) 1 0.1 0.01 0.001 100 10,000 1000 B p-p (Gauss) Inductance characteristics % of OCL vs % of Isat1 100% % of OCL 80% -40° C 60% +125° C 40% +100° C +85° C +25° C 20% 0% 0% 20% 40% 60% 80% 100% 120% 140% % of Isat1 www.eaton.com/electronics 3 FP1108R High frequency, high current power inductor Technical Data 10227 Effective September 2017 Solder Reflow Profile TP tP Max. Ramp Up Rate = 3°C/s Max. Ramp Down Rate = 6°C/s Temperature TL 25°C Preheat A T smax t TC -5°C Table 1 - Standard SnPb Solder (Tc) Volume mm3 220°C 220°C Table 2 - Lead (Pb) Free Solder (T c) Tsmin ts Package Thickness 2.5mm Time 25°C to Peak Volume mm3 2000 260°C 245°C 245°C Time Reference JDEC J-STD-020 Profile Feature Preheat and Soak • Temperature min. (Tsmin) • Temperature max. (Tsmax) • Time (Tsmin to Tsmax) (ts) Average ramp up rate Tsmax to Tp Liquidous temperature (TL) Time at liquidous (tL) Peak package body temperature (TP)* Time (tp)** within 5 °C of the specified classification temperature (Tc) Average ramp-down rate (Tp to Tsmax) Time 25°C to Peak Temperature Standard SnPb Solder 100°C Lead (Pb) Free Solder 150°C 150°C 200°C 60-120 Seconds 60-120 Seconds 3°C/ Second Max. 3°C/ Second Max. 183°C 60-150 Seconds 217°C 60-150 Seconds Table 1 Table 2 20 Seconds** 30 Seconds** 6°C/ Second Max. 6°C/ Second Max. 6 Minutes Max. 8 Minutes Max. * Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum. ** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum. Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also reserves the right to change or update, without notice, any technical information contained in this bulletin. Eaton Electronics Division 1000 Eaton Boulevard Cleveland, OH 44122 United States www.eaton.com/electronics © 2017 Eaton All Rights Reserved Printed in USA Publication No. 10224 BU-SB14230 September 2017 Eaton is a registered trademark. All other trademarks are property of their respective owners.