HC2LP-R68-R

Technical Data 4114 Effective October 2015 Supersedes March 2007 HC2LP Low profile, high current power inductors Applications Product description • Distributed power systems DC-DC converters • General-purpose low voltage supplies • Computer systems • Servers • Point of Load (POL) converters • Industrial Equipment • Networking/Telecom power supplies Environmental data • Storage temperature range (component): -40°C to +125°C Designed for high density, high current/low voltage applications • Operating temperature range: -40°C to +125°C (ambient + self-temperature rise). • Foil technology that adds higher reliability factor over the traditional magnet wire used for higher frequency circuit designs • Solder reflow temperature: J-STD-020D compliant. • Frequency Range up to 1MHz • Ferrite core material • Compact footprint • Pb HALOGEN HF FREE HC2LP Low profile, high current power inductors  Technical Data 4114 Effective October 2015 Product specifications Part number OCL1 (μH) ±20% lrms2 amps (approx.) lsat3 amps (approx.) DCR4 (Ω) maximum @ 20°C Volt-μsec5 (V-μs) HC2LP-R47-R .52 52.9 63.75 .0006 6.87 HC2LP-R68-R .63 52.9 50.00 .0006 6.87 HC2LP-1R0-R 1.15 33.0 42.50 .0013 10.31 HC2LP-2R2-R 2.00 24.3 31.90 .0023 13.75 HC2LP-4R7-R 4.55 17.0 21.25 .0046 20.62 HC2LP-6R0-R 6.00 17.0 16.50 .0046 20.62 1. Open Circuit Inductance Test Parameters: 300kHz, 0.250 Vrms, 0.0 Adc 2. DC current for an approximate temperature change of 40°C without core loss. Derating is necessary for AC currents. PCB layout, trace thickness and width, air-flow and proximity of other heat generating components will affect the temperature rise. It is recommended that the temperature of the part not exceed 125°C under worst case operating conditions verified in the end application. 3. Peak current for approximately 30% rolloff. 4. Values @ 20°C 5. Applied Volt-Time product (V-μs) across the inductor. This value represents the applied V-μs at 300KHz neccessary to generate a core loss equal to 10% of the total losses for 40°C temperature rise. Dimensions–mm RECOMMENDED PCB PAD LAYOUT TOP VIEW 19.2 max 9.5 typ 1 HC2LP-xxx wwllyy R FRONT VIEW 10.00 2 11.18 max 19.00 19.2 max 2.8 typ 5.50 SCHEMATIC 2 2.3 typ 5.50 xxx = Inductance value wwllyy = Date code R = Revision level Packaging information (mm) Supplied in tape and reel packaging, 130 parts per 13” reel. 1.5Dia +0.10 -0.00 4.0 2.0 A 1.7 20.2 19.3 11.3 SECTION A-A 2 www.eaton.com/elx 1 40.4 +/-0.1 19.3 A 32 User direction of feed 1 44.0 +/-0.3 HC2LP Low profile, high current power inductors Technical Data 4114 Effective October 2015  Core loss IRMS DERATING WITH CORE LOSS 20 40 50 60 Hz 0K 80 10 50 z 50 0K H z 80 30 0K Hz 20 0K Hz 70 1M H % of Losses from Irms (maximum) 0 90 92 94 95 96 97 98 99 10 20 30 40 60 100 200 300 % of Applied Volt-μ-Seconds 400 500 600 800 1000 Inductance Characteristics OCL vs. Isat 100 90 80 % of OCL 70 60 50 40 30 20 10 0 0 20 40 60 80 100 % of ISAT 120 140 160 180 200 www.eaton.com/elx 3 HC2LP Low profile, high current power inductors  Technical Data 4114 Effective October 2015 Solder reflow profile TP TC -5°C tP Max. Ramp Up Rate = 3°C/s Max. Ramp Down Rate = 6°C/s Temperature TL Preheat A T smax t Table 1 - Standard SnPb Solder (Tc) Package Thickness Volume mm3