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FP1008R1-R270-R

FP1008R1-R270-R

  • 厂商:

    EATON(伊顿)

  • 封装:

    非标准

  • 描述:

    固定电感器 Nonstandard 270nH ±10% 79A 0.17mΩ

  • 数据手册
  • 价格&库存
FP1008R1-R270-R 数据手册
Technical Data 10408 Effective June 2015 FP1008R1 and FP1008R2 High frequency, high current power inductors N FP ot r re 10 ec FP pla 08 om re 10 ce R1 me pa 0 m nd r e 8 e lc R n c e e m 2 t i om d en rec s F m for t i om P1 en ne s FP me 008 ded w d es 10 nd R5 ig 08 ed . ns R 6 Applications • Servers • Multi-phase and Vcore regulators • Voltage Regulator Modules (VRMs) • Desktop VRMs and EVRDs • Data networking and storage systems • Graphics cards and battery power systems • Point-of-Load modules • DCR Sensing circuits Environmental data Product description • High current carrying capacity • Low core loss • Controlled DCR for sensing circuits • Inductance range from 120nH to 300nH • Current range from 38 to 112 amps • 10.8 x 8.0 mm footprint surface mount package in an 8.0 mm height • Ferrite core material • Halogen free, lead free, RoHS compliant • Storage temperature range (Component): -40°C to +125 °C • Operating temperature range: -40°C to +125°C (ambient + self-temperature rise) • Solder reflow temperature: J-STD-020D compliant HALOGEN Pb HF FREE FP1008R1 and FP1008R2 High frequency, high current power inductors  Technical Data 10408 Effective June 2015 Product specifications OCL1 (nH)±10% FLL2 (nH) minimum Irms3 (amps) Isat14 (amps) Isat25 (amps) Isat36 (amps) DCR (mΩ) ±5% @ 20°C K-factor7 FP1008R1-R120-R 120 86 79 112 92 84 0.17 342 FP1008R1-R150-R 150 108 79 90 72 67 0.17 342 FP1008R1-R180-R 180 130 79 74 60 54 0.17 342 FP1008R1-R220-R 220 158 79 56 44 42 0.17 342 FP1008R1-R270-R 270 194 79 44 34 32 0.17 342 FP1008R1-R300-R 300 216 79 38 30 28 0.17 342 FP1008R2-R120-R 120 86 74 112 92 84 0.18 342 FP1008R2-R150-R 150 108 74 90 72 67 0.18 342 FP1008R2-R180-R 180 130 74 74 60 54 0.18 342 Part Number9 N FP ot r re 10 ec FP pla 08 om re 10 ce R1 me pa 0 m nd r e 8 e lc R n c e e m 2 t i om d en rec s F m for t i om P1 en ne s FP me 008 ded w d es 10 n d R5 ig 08 ed . ns R 6 R1 version R2 version FP1008R2-R220-R 220 158 74 56 44 42 0.18 342 FP1008R2-R270-R 270 194 74 44 34 32 0.18 342 FP1008R2-R300-R 300 216 74 38 30 28 0.18 342 1. Open Circuit Inductance (OCL) Test Parameters: 100kHz, 0.1Vrms, 0.0Adc, +25°C 2. Full Load Inductance (FLL) Test Parameters: 100kHz, 0.1Vrms, Isat1, +25°C 3. Irms: DC current for an approximate temperature rise of 40ºC without core loss. Derating is necessary for AC currents. PCB layout, trace thickness and width, air-flow, and proximity of other heat generating components will affect the temperature rise. It is recommended that the temperature of the part not exceed 125°C under worst case operating conditions verified in the end application. 4. Isat1: Peak current for approximately 20% rolloff @ +25ºC 5. Isat2: Peak current for approximately 20% rolloff @ +100ºC 6. Isat3: Peak current for approximately 20% rolloff @ +125ºC 7. K-factor: Used to determine Bp-p for core loss (see graph). Bp-p = K * L * ∆I * 10-3. Bp-p:(Gauss), K: (K-factor from table), L: (Inductance in nH), ∆I (Peak-to-peak ripple current in Amps). 8. Part Number Definition: FP1008Rx-Rxxx-R FP1008 R= Product code and size x = DCR indicator Rxxx = Inductance value in μH, R = decimal point - R suffix = RoHS compliant Dimensions (mm) Recommended Pad Layout a FP1008Rx Rxxx wwllyy R 10.8 max 3.0 2.5 2.5 b 8.0 max 2 www.eaton.com/elx 4.06 5.0 0.2 min 3.56 8.0 max Part marking: FP1008Rx (x= DCR indicator), Rxxx (xxx=inductance value in uH, R=decimal point), wwllyy = date code, R = revision level Tolerances are ±0.15 millimeters unless stated otherwise PCB tolerances are ±0.1 millimeters unless stated otherwise All soldering surfaces to be coplanar within 0.1 millimeter DCR measured from point “a” to point “b” Do not route traces or vias underneath the inductor Schematic FP1008R1 and FP1008R2 High frequency, high current power inductors Technical Data 10408 Effective June 2015  Packaging information (mm) Supplied in tape and reel packaging, 500 parts per 13” diameter reel. 1.5 dia 4.0 1.5 dia 2.0 N FP ot r re 10 ec FP pla 08 om re 10 ce R1 me pa 0 m nd r e 8 e lc R n c e e m 2 t i om d en rec s F m for t i om P1 en ne s FP me 008 ded w d es 10 n d R5 ig 08 ed . ns R 6 1.75 8.3 11.5 24 ±0.3 FP1008Rx Rxxx wwllyy R 11.0 8.2 16.0 User direction of feed Temperature rise vs. total loss FP1008R2 60 50 50 Temperature Rise (°C) Temperature Rise (°C) FP1008R1 60 40 30 20 10 0 0.0 0.2 0.4 0.6 0.8 1.0 Total Loss (W) 1.2 1.4 1.6 40 30 20 10 0 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 Total Loss (W) www.eaton.com/elx 3 FP1008R1 and FP1008R2 High frequency, high current power inductors  Technical Data 10408 Effective June 2015 Core loss vs. Bp-p 1 Core Loss (W) N FP ot r re 10 ec FP pla 08 om re 10 ce R1 me pa 0 m nd r e 8 e lc R n c e e m 2 t i om d en rec s F m for t i om P1 en ne s FP me 008 ded w d es 10 n d R5 ig 08 ed . ns R 6 0.1 0.01 0.001 0.0001 100 1000 10000 Bp-p (Gauss) Inductance characteristics FP1008R1/R2-R120-R 100% 100% 80% 80% 60% 25°C 40% FP1008R1/R2-R150-R 120% % of OCL % of OCL 120% 60% 25°C 40% -40°C -40°C 20% 100°C 20% 100°C 125°C 0% 125°C 0% 0 20 40 60 80 IDC (A) 4 www.eaton.com/elx 100 120 140 0 20 40 60 IDC (A) 80 100 120 FP1008R1 and FP1008R2 High frequency, high current power inductors Technical Data 10408 Effective June 2015  Inductance characteristics FP1008R1/R2-R180-R FP1008R1/R2-R220-R 120% 100% 100% 80% 80% % of OCL N FP ot r re 10 ec FP pla 08 om re 10 ce R1 me pa 0 m nd r e 8 e lc R n c e e m 2 t i om d en rec s F m for t i om P1 en ne s FP me 008 ded w d es 10 n d R5 ig 08 ed . ns R 6 % of OCL 120% 60% 25°C 40% 100°C 0 -40°C 100°C 20% 125°C 0% 25°C 40% -40°C 20% 60% 20 40 IDC (A) 60 80 0% 100 125°C 0 10 20 120% 100% 100% 80% 80% 60% 25°C 40% 100°C 0 10 20 30 40 IDC (A) 50 60 70 80 25°C -40°C 100°C 20% 125°C 0% 50 60% 40% -40°C 20% 40 IDC (A) FP1008R1/R2-300-R 120% % of OCL % of OCL FP1008R1/R2-R270-R 30 60 70 0% 125°C 0 10 20 30 IDC (A) 40 50 www.eaton.com/elx 60 5 FP1008R1 and FP1008R2 High frequency, high current power inductors  Technical Data 10408 Effective June 2015 Solder reflow profile TP TC -5°C tP Max. Ramp Up Rate = 3°C/s Max. Ramp Down Rate = 6°C/s 25°C Preheat A T smax t Package Thickness Volume mm3
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