FP1105R1-R20-R

Technical Data 4324 Effective June 2017 Supersedes June 2008 FP1105 High current power inductors Applications • • • • • • • SMD Device • Multi-phase regulators Voltage Regulator Module (VRM) Portable electronics Servers and workstations Data networking and storage systems Notebook and desktop computers Graphics cards and battery power systems DCR sensing Environmental data • Product features • • • • • • • • • 11.0 x 8.0 x 4.90mm surface mount package Ferrite core material High current carrying capacity Low core losses Controlled DCR tolerance for sensing circuits Inductance range from 101nH to 226nH Current range from 39 to 81Amps Frequency range up to 2MHz Halogen free, lead free, RoHS compliant • • Storage temperature range (component): -40 °C to +125 °C Operating temperature range: -40 °C to +125 °C (ambient plus self-temperature rise) Solder reflow temperature: J-STD-020 (latest revision) compliant Pb HF FREE HALOGEN  Technical Data 4324 Effective June 2017  Product Specifications Part Number FP1105R1-R10-R FP1105R1-R12-R FP1105R1-R15-R FP1105R1-R20-R FP1105R1-R22-R OCL1 ± 10% (nH) FLL2 Min. (nH) 100 72 120 86 150 109 192 138 226 163 Irms3 (Amps) Isat14 @ 25°C (Amps) Isat25 @ 125°C (Amps) DCR (mΩ) @ 20°C K-factor6 81 63 467 66 50 467 46 54 42 0.35 ± 8.6% 467 42 34 467 39 28 467 1 Open Circuit Inductance (OCL) Test Parameters: 100kHz, 0.10Vrms, 0.0Adc 2 Full Load Inductance (FLL) Test Parameters: 100kHz, 0.1Vrms, Isat1 4 Isat1: Peak current for approximately 20% rolloff at +25°C. 5 Isat2: Peak current for approximately 20% rolloff at +125°C. 3 Irms: DC current for an approximate temperature rise of 40°C without core loss. Derating is necessary for AC currents. PCB pad layout, trace thickness and width, air-flow and proximity of other heat generating components will affect the temperature rise. It is recommended the part temperature not exceed 125°C under worst case operating conditions verified in the end application. 6 K-factor: Used to determine Bp-p for core loss (see graph). Bp-p = K * L * ΔI * 10-3, Bp-p : (Gauss), K: (K-factor from table), L: (inductance in nH), ΔI (peak-to-peak ripple current in amps). 7 Part Number Definition: FP1105Rx-Rxx-R • FP1105 = Product code and size • Rx is the DCR indicator • Rxx= Inductance value in μH, R = decimal point • “-R” suffix = RoHS compliant Dimensions- mm A = 11.0 Max. B = 8.0 Max. Top View Left View B C 1 C = 4.9 Max. Bottom View D = 2.4 ± 0.2 Recommended Pad Layout D b E = 2.3 ± 0.3 F = 6.2 Typ. Schematic 2.8 E 1 2.8 1105Rx A Rxx wwllyy R F 5.8 2 2 Nominal DCR is measured from point “a” to point “b.” Part Marking: 1105Rx (Rx = DCR indicator) a Rxx = inductance value in μH (R = decimal point) wwllyy = date code R = revision level Packaging information - mm Packaging Information - mm 1.5 dia 1.5 dia 4.0 2.0 A 1.75 SECTION A-A 1 11.5 24.0 +/-0.3 1105Rx Rxx wwllyy R 11.3 2 8.2 12.0 Supplied in tape-and-reel packaging, 900 parts per reel, 13” diameter reel. 2 www.eaton.com/electronics A User direction of feed 5.2 Technical Data 4324 FP1105 High current power inductors Effective June 2017 Temperature rise vs. total loss 50 Temperature rise(°C ) 40 30 20 10 0 0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 Total loss (W) Core Loss vs Bp-p 1MHz 10 500kHz 300kHz 200kHz Core Loss (W) 1 100kHz 0.1 0.01 0.001 0.0001 100 1000 10000 Bp-p (Gauss) Inductance characteristics OCL vs. I sat1 100% % of OCL 80% 60% 40% +125°C 20% +25°C -40°C 0% 0% 20% 40% 60% % of I s at1 80% 100% 120% www.eaton.com/electronics 3 FP1105 High current power inductors Technical Data 4324 Effective June 2017 Solder Reflow Profile TP TC -5°C Temperature TL 25°C Preheat A T smax Table 1 - Standard SnPb Solder (Tc) tP Max. Ramp Up Rate = 3°C/s Max. Ramp Down Rate = 6°C/s t Volume mm3 220°C 220°C Table 2 - Lead (Pb) Free Solder (T c) Tsmin Package Thickness 2.5mm ts Time 25°C to Peak Volume mm3 2000 260°C 245°C 245°C Time Reference JDEC J-STD-020 Profile Feature Preheat and Soak • Temperature min. (Tsmin) • Temperature max. (Tsmax) • Time (Tsmin to Tsmax) (ts) Average ramp up rate Tsmax to Tp Liquidous temperature (TL) Time at liquidous (tL) Peak package body temperature (TP)* Time (tp)** within 5 °C of the specified classification temperature (Tc) Average ramp-down rate (Tp to Tsmax) Time 25°C to Peak Temperature Standard SnPb Solder 100°C Lead (Pb) Free Solder 150°C 150°C 200°C 60-120 Seconds 60-120 Seconds 3°C/ Second Max. 3°C/ Second Max. 183°C 60-150 Seconds 217°C 60-150 Seconds Table 1 Table 2 20 Seconds** 30 Seconds** 6°C/ Second Max. 6°C/ Second Max. 6 Minutes Max. 8 Minutes Max. * Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum. ** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum. Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also reserves the right to change or update, without notice, any technical information contained in this bulletin. Eaton Electronics Division 1000 Eaton Boulevard Cleveland, OH 44122 United States www.eaton.com/electronics © 2017 Eaton All Rights Reserved Printed in USA Publication No. 4324 BU-SB08211 May 2017 Eaton is a registered trademark. All other trademarks are property of their respective owners.