FP0708R1-R19-R

Technical Data 4334 Effective January 2016 Supersedes January 2010 FP0708 High frequency, high current power inductors Applications • Multi-phase and Vcore regulators • Voltage Regulator Modules (VRMs) • Server and desktop • Central processing unit (CPU) • Graphics processing unit (GPU) • Application specific integrated circuit (ASIC) • High power density • Data networking and storage systems • Graphics cards and battery power systems • Portable electronics • Point-of-Load modules Product description • High current carrying capacity Environmental data • Low core loss • • Frequency range up to 2 MHz Storage temperature range (Component): -40 °C to +125 °C • Inductance Range from 72 nH to 200 nH • • Current range from 36 A to 90 A Operating temperature range: -40 °C to +125 °C (ambient plus self-temperature rise) 7.0 mm x 8.5 mm footprint surface mount package in a 7.2 mm height • • Solder reflow temperature: J-STD-020D compliant • Ferrite core material • Halogen free, lead free, RoHS compliant HALOGEN Pb HF FREE FP0708 High frequency, high current power inductors  Technical Data 4334 Effective January 2016 Product specifications Part Number7 OCL1 (nH) ±10% FLL2 (nH) minimum Irms3 (A) Isat14 (A) Isat25 (A) DCR (mΩ) ± 8.6% @ 20°C K-factor6 FP0708R1-R07-R 72 52 44 90 72 0.35 557 FP0708R1-R09-R 90 64 44 75 60 0.35 557 FP0708R1-R10-R 105 75 44 68 54 0.35 557 FP0708R1-R12-R 120 86 44 59 47 0.35 557 FP0708R1-R15-R 150 108 44 47 37 0.35 557 FP0708R1-R19-R 190 135 44 37 29 0.35 557 FP0708R1-R20-R 200 144 44 36 27 0.35 557 1. Open Circuit Inductance (OCL) Test Parameters: 100 kHz, 0. 1Vrms, 0.0 Adc, +25 °C 2. Full Load Inductance (FLL) Test Parameters: 100 kHz, 0.1 Vrms, Isat1, +25 °C 3. Irms: DC current for an approximate temperature rise of 40 °C without core loss. Derating is necessary for AC currents. PCB layout, trace thickness and width, air-flow, and proximity of other heat generating components will affect the temperature rise. It is recommended that the temperature of the part not exceed 125 °C under worst case operating conditions verified in the end application. 4. Isat1: Peak current for approximately 20% rolloff @ +25 °C 5. Isat2: Peak current for approximately 20% rolloff @ +125 °C 6. K-factor: Used to determine Bp-p for core loss (see graph). Bp-p = K * L * ∆I * 10-3. Bp-p:(Gauss), K: (K-factor from table), L: (Inductance in nH), ∆I (Peak to peak ripple current in Amps). 7. Part Number Definition: FP0708Rx-Rxx-R FP0708= Product code and size Rx= Version indicator -Rxx= Inductance value in μH, R= decimal point -R suffix = RoHS compliant Dimensions (mm) Part marking: 0708Rx (Rx = version indicator), Rxx = Inductance value in uH, R = decimal point, wwllyy = date code, R = revision level Tolerances are ±0.15 millimeters unless stated otherwise PCB tolerances are ±0.1 millimeters unless stated otherwise All soldering surface to be coplanar within 0.1016 millimeters DCR measured between point “a” and point “b” Do not route traces or vias underneath the inductor Packaging information (mm) Supplied in tape and reel packaging , 640 parts per 13” diameter reel 2 www.eaton.com/elx FP0708 High frequency, high current power inductors Technical Data 4334 Effective January 2016  Temperature rise vs. total loss Core loss vs. Bp-p www.eaton.com/elx 3 Technical Data 4334 Effective January 2016 Inductance characteristics 4 www.eaton.com/elx FP0708 High frequency, high current power inductors  FP0708 High frequency, high current power inductors Technical Data 4334 Effective January 2016  Solder reflow profile TP TC -5°C tP Max. Ramp Up Rate = 3°C/s Max. Ramp Down Rate = 6°C/s Temperature TL Preheat A T smax t Table 1 - Standard SnPb Solder (Tc) Package Thickness Volume mm3