FP0906R1-R30-R

Technical Data 4407 Effective June 2015 Supersedes March 2014 FP0906 High frequency, high current power inductors Applications • Multi-phase and Vcore regulators • Voltage Regulator Modules (VRMs) • Desktop and server VRMs and EVRDs • Data networking and storage systems • Graphics cards and battery power systems • Point-of-Load modules • DCR Sensing circuits Environmental Data • Storage temperature range (Component): -40°C to +125°C • Operating temperature range: -40°C to +125°C (ambient + self-temperature rise) • Solder reflow temperature: J-STD-020D compliant Product Description • High current carrying capacity • Low core loss • Controlled DCR for sensing circuits • Frequency range up to 2MHz • Inductance Range from 100nH to 300nH • Current range from 32.5 to 94 amps • 9.6x6.45mm footprint surface mount package in a 8.0mm height • Ferrite core material • Halogen free, lead free, RoHS compliant HALOGEN Pb HF FREE FP0906 High frequency, high current power inductors  Technical Data 4407 Effective June 2015 Product specifications Part Number7 OCL1 (nH) ±10% FLL2 (nH) minimum Irms3 (amps) Isat14 (amps) Isat25 (amps) DCR (mΩ) ±5% @ 20°C K-factor6 FP0906R1-R10-R 100 72 51 94 81 0.29 451 FP0906R1-R12-R 120 86 51 79 68 0.29 451 FP0906R1-R15-R 150 108 51 65 55 0.29 451 FP0906R1-R18-R 180 129 51 55 45 0.29 451 FP0906R1-R22-R 220 155 51 44 37.5 0.29 451 FP0906R1-R28-R 280 200 51 34 29 0.29 451 FP0906R1-R30-R 300 216 51 32.5 27.5 0.29 451 1 Open Circuit Inductance (OCL) Test Parameters: 100kHz, 1.0Vrms, 0.0Adc, +25°C 2. Full Load Inductance (FLL) Test Parameters: 100kHz, 1.0Vrms, Isat1, +25°C 3. Irms: DC current for an approximate temperature rise of 40°C without core loss. Derating is necessary for AC currents. PCB layout, trace thickness and width, air-flow, and proximity of other heat generating components will affect the temperature rise. It is recommended that the temperature of the part not exceed 125°C under worst case operating conditions verified in the end application. 4. Isat1 : Peak current for approximately 20% rolloff @ +25°C 5. Isat2: Peak current for approximately 20% rolloff @ +125°C 6. K-factor: Used to determine Bp-p for core loss (see graph). Bp-p = K * L * I * 10-3. Bpp :(Gauss), K: (Kfactor from table), L: (Inductance in nH), I (Peak to peak ripple current in Amps). 7. Part Number Definition: FP0906Rx-Rxx-R FP0906 = Product code and size Rx= DCR indicator Rxx= Inductance value in uH, R= decimal point -R suffix = RoHS compliant Dimensions–mm Recommended Pad Layout 6.2 ±0.2 8.0 max a 2.54 2.3 ±0.2 1 Schematic 1 0.3 ref 10.40 0906Rx Rxx wwllyy R 4.00 2 2 2.14 ±0.2 b Part marking: 0906Rx (Rx=DCR indicator), Rxx=Inductance value in uH (R=decimal point), www=date code R=revision level The nominal DCR is measured between point “a” and point “b” Soldering surfaces to be coplanar within 0.1 millimeters Do not route traces or vias underneath the inductor Packaging–mm Supplied in tape and reel packaging , 600 parts per 13” diameter reel 4.0 1.75 2.0 1.5 dia 9.7 24.00 ±0.3 11.5 12.0 1.5 dia 6.5 8.0 User direction of feed 2 www.eaton.com/elx FP0906 High frequency, high current power inductors Technical Data 4407 Effective June 2015  Temperature rise vs. total loss 50 45 40 Temperature Rise (°C) 35 30 25 20 15 10 1.4 1.3 1.2 1.1 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 0.0 5 Total Loss (W) Core loss vs Bp-p 1.0MHz 500kHz 300kHz 100kHz 10 1 Core Loss (W) 0.1 0.01 0.001 1000 100 0.00001 10000 0.0001 B p-p (Gauss) Inductance characteristics % of OCL vs. % of Isat1 FP0906R1-R10 to R18 110% 110% 100% 100% 90% -40C 60% +25C www.eaton.com/elx 140% 130% % of Isat1 120% 70% 60% 50% 40% 30% 20% 140% 130% 30% +85C 110% +125C 40% 100% 50% 90% +85C 120% % of Isat1 100% 80% 70% 60% 50% 40% 30% 20% 0% 40% 90% +125C 110% 50% 70% 80% +25C 60% 80% 0% 70% % of OCL -40C 10% 80% 10% % of OCL 90% 30% % of OCL vs. % of I sat1 FP0906R1-R22 to R30 3 FP0906 High frequency, high current power inductors  Technical Data 4407 Effective June 2015 Solder reflow profile TP TC -5°C tP Max. Ramp Up Rate = 3°C/s Max. Ramp Down Rate = 6°C/s Temperature TL Preheat A T smax t Table 1 - Standard SnPb Solder (Tc) Package Thickness Volume mm3