PART CODE:
MSA75152K0S001
SPECIFICATION SHEET
SPECIFICATION SHEET NO.
N0511- MSA75152K0S001
DATE
May 11, 2021
REVISION
A0
DESCRIPITION
SMD Power Inductor, MSA series
Inductance (L) 1.50mH, Tolerance 10%
Operating Temp. Range -55°C ~+125°C,
Package in Tape/Reel, 1000pcs/Reel
RoHS/RoHS III compliant
CUSTOMER
CUSTOMER PART NUMBER
CROSS REF. PART NUMBER
ORIGINAL PART NUMBER
MSA75-152K
PART CODE
MSA75152K0S001
VENDOR APPROVE
Issued/Checked/Approved
DATE: May 11, 2021
CUSTOMER APPROVE
DATE:
NextGen Components, Inc.
sales@NextGenComponent.com
www.NextGenComponent.com
PART CODE:
MSA75152K0S001
SMD POWER INDUCTORS MSA SERIES
APPLICATION
MAIN FEATURE
• RoHS Compliant
• Low Profile and High current power Supplies
• Super Low Resistance, Ultra High Current Rating
• Battery power device
• High Performance (Isat) Realized by metal dust core
• DC/DC converters in distributed power system
• Frequency Range : up to 1.0MHz
• DC/DC converters for Field programmable gate array
RFQ
PART CODE GUIDE
Request For Quotation
MSA75
152K0
S
001
1
2
3
4
1) MSA75: Series code for SMD Power Inductor, MSA series, Dimension 7.8*7.0*5.0mm
2) 152K0: Specification code: Inductance (L) 1.5mH, Tolerance 10%
3) S: Package code, Tape/reel, 1000pcs/reel.
4) 001: Internal Control Code or special code required by customer- 3 letter or digits
DIMENSION (Unit: mm)
Tope View
Item
Side View
Bottom View
Image for Ref.
Dimension
A
7.8+/-0.3
B
7.0+/-0.3
C
5.0+/-0.3
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PART CODE:
MSA75152K0S001
SMD POWER INDUCTORS MSA SERIES
ELECTRONICAL CHARACTERISTICS
Parameter
Specification
Condition
Test Instruments
L (mH)
S-F
1.5+/-10%
100KHz/0.25V
MICROTEST 6377
DCR (Ω)
S-F
6.0Max.
25 °C
TH16502
I sat (A) S-F
S-F
0.25A Max.70%
100KHz/0.25V
MICROTEST 6377+6220
ELECTRICAL SCHEMATIC CIRCUIT
Start (S)
●
Finish (F)
N1
CHARACTERISTICS
1) All test data is based on 25 °C ambient.
2) DC current (A) that will cause an approximate ∆T40 °C
3) DC current (A) that will cause L0 to drop approximately 30% Typical.
4) Operating temperature range : -55°C~+125 °C
5) The part temperature(ambient + temp. rise) should not exceed 125 °C under worst case operating conditions. Circuit design,
component. PWB trace size and thickness, airflow and other cooling provision all affect the part temperature. Part temperature
should be verified in the den application
REFLOW SOLDERING PROFILE
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PART CODE:
MSA75152K0S001
SMD POWER INDUCTORS MSA SERIES
REEL DIMENSION (Unit: mm, 1000pcs/Reel)
Code
Dimension
A
330.0+/-2.0
B
100.0+/-10
C
13.0+/-1.0
G
24.4+/-1.0
T
30.4 Max.
Code
Dimension
W
16.0+/-0.30
A0
7.2+/-0.10
B0
8.2+/-0.10
K0
5.3+/-0.1
P
12.0+/-0.1
F
7.5+/-0.1
E
1.75+/-0.1
D0
1.5+/-0.1
P0
4.0+/-0.1
T
0.35+/-0.05
TAPE DIMENSION (UNIT: MM)
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PART CODE:
MSA75152K0S001
SMD POWER INDUCTORS MSA SERIES
ENVIRONMENTAL TEST
Items
Required Characteristics
Test Method/Condition
High Temp. Storage Test
Ref. Document:
MIL-STD-202G Method 108A
1.
2.
3.
4.
No case deformation or change in appearance
∆ L/L ≤ 10% or 15%
∆ Q/Q ≤ 30%
∆ DCR/DCR ≤ 10%
Temperature: N+/-2 °C
Time: 96+/-2 hours
Test not less than 1 hour and no more
than 2 h at 25 °C (See Table 1- Fig. 1)
Low Temp. Storage Test
Ref. Document:
IEC 68-2-1A 6.1 & 6.2
1.
2.
3.
4.
No case deformation or change in appearance
∆ L/L ≤ 10% or 15%
∆ Q/Q ≤ 30%
∆ DCR ≤ 10%
Temperature: M+/-2 °C
Time: 96+/-2 hours
Test not less than 1 h and no more than
2 hours at 25 °C (See Table 1- Fig. 2)
Humidity test
Ref. Document:
MIL-STD-202G Method 103A
1.
2.
3.
4.
No case deformation or change in appearance
∆ L/L ≤ 10% or 15%
∆ Q/Q ≤ 30%
∆ DCR ≤ 10%
Temperature: 40+/-2 °C
Humidity: 93+/-3% RH
Time: 96+/-2 Hours
Test not less than 1 hour and no more
than 2 hours at 25 °C
Thermal shock Test
Ref. Document:
MIL-STD-202G Method 107G
1. No case deformation or change in appearance
2. ∆ L/L ≤ 10% or 15%
3. ∆ Q/Q ≤ 30%
4. ∆ DCR ≤ 10%
For T: Weight ≤28g; 15 Min. M: low temp.
28g≤weight≤136g: 30 min N high temperature
First M for T time, last N °C time as 1
cycle. GO through 20 cycles.
(See Table 1- Fig. 3)
PHYSICAL CHARACTERISTICS TEST
Items
Required Characteristics
Test Method/Condition
Solderability Test
Ref. Documents
MIL-STD-202G Method 208H
IPC-J-STD-002C
Terminate area must have 95% Min.
1.
Heat endurance of Reflow
Soldering
Ref. Documents
IPC-J-STD-020D
1.
2.
3.
4.
No case deformation or change in appearance
∆ L/L ≤ 10% or 15%
∆ Q/Q ≤ 30%
∆ DCR/DCR ≤ 10%
1.
Vibration Test
Ref. Documents
MIL-STD-202G Method 201A
1.
2.
3.
4.
No case deformation or change in appearance
∆ L/L ≤ 10% or 15%
∆ Q/Q ≤ 30%
∆ DCR/DCR ≤ 10%
Apply frequency 10-55Hz 1.5mm
amplitude in each of perpendicular
direction X, Y Z for 2 hours (total: 6
hours) (See Table 1-Fig. 4)
Drop Test
Ref. Documents
MIL-STD-202G Method 203C
1.
2.
3.
4.
No case deformation or change in appearance
∆ L/L ≤ 10% or 15%
∆ Q/Q ≤ 30%
∆ DCR/DCR ≤ 10%
Packaged & Drop down from 1m with
981m/s² (100G) attitude in 1 angle and
2 surfaces orientations
Terminal strength push Test
Ref. Documents
JIS C 5321:1997
Pulling test: Define A: sectional area of terminal
0.5mm² < A ≤ 1.2mm²; Force≥20N time: 10 sec.
1.2mm²< A ; force≥20N time: 10 sec.
Bending Test: Soldering the product on PCB, after
the pulling test and bending test, terminal should
not pull off.
Bend the testing PCB at middle point
the deflection shall be 2mm
(See Table 1-Fig. 5)
Resistance to Solvent Test
Ref. Document
IEC 68-2-45: 1993
No case deformation or change in appearance or
obliteration of marking
To dip parts IPA solvent for 5+/-0.5
minute then drying them at room
temperature for 5 minute, at last to
brushing marking 10 times
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2.
3.
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2.
Dip pads in flus then dip in solder
at 260 +/-5 °C for 5 second
Solder: Lead free
Flux: rosin flux
Refer to the mentioned Reflow
Curve and go through 3 times
The peak temperature: 260 +/-5 °C
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PART CODE:
MSA75152K0S001
SMD POWER INDUCTORS MSA SERIES
ELECTRICAL CHARACTERISTIC TEST
Items
Required Characteristics
Test Method/Condition
Electronic Characteristic test
of major products
Refer to catalogue of specific products
Refer to catalogue of specific products
Overload Test
Ref. Document:
JIS C5311-6.13
1.
2.
During the test no smoke, no peculiar, smell,
no fire
The characteristic is normal after tested
Apply twice rated current for 5 minutes
(It’s not application to some special
design)
Voltage resistance test
Ref. Document:
MIL-STD-202G Method 301
1.
2.
During the test no breakdown
The characteristic is normal after tested
1.
2.
For parts with no coils
DC 100V; Current: 1 mA, 1 minute
CURVE OF HEAT ENDURANCE OF REFLOW SOLDERING TEST
1.
2.
3.
4.
This peak temperature only applicable to some specific parts. The operating parameter may be different according to the pay type.
A test made under the conditions mentioned above and it is left 1 hour in the normal temperature.
The reflow condition is according to the machine used by own company.
The above specification are only for reference, follow confirmation documents for the specific test condition.
Fig. 1
Table 1
Fig. 2
Fig. 5
Fig. 4
Fig. 3
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PART CODE:
MSA75152K0S001
SMD POWER INDUCTORS MSA SERIES
Item
Application Notice
Storage
Condition
To maintain the solderability of terminal electrodes
1. Temperature and humidity conditions: less than 30% and 60% RH.
2. Recommended ceramic chip inductors should be used within 6 month after delivery.
3. The package material should be kept where no chlorine or sulfur exists in the air.
Handling
1.
2.
3.
Design of
Land Pattern
Component pads should be designed to achieve good solder filets and minimize component movement
during reflow soldering. Pads designs are given below for the most common sizes of multilayer ceramic
inductors for both wave and reflow soldering. The basis of these designs are:
1. Pad width equal to component width it is permissible to decease this to as low 85% of components
width but it is not advisable to go below this.
2. Pad overlap 0.5mm beneath component.
3. Pad extension 0.5mm beyond components for reflow and 1.0mm for wave soldering.
4. Example of good and band solder application.(see table 2)
5. Components space: For wave soldering component, must be spaced sufficiently far apart to avoid
bridging or shadowing (inability of solder to penetrate properly into small space) and ensure space must
be allowed to enable rework should it be required. (see table 2)
Preheat
It is important to avoid possibility of thermal shock during soldering and carefully controlled preheat is
therefore required. The rate of preheat should no exceed 4°C/sec. and a target figure 2°C/sec.is
recommended. Although an 80°C to 120°C temperature differential is preferred, recent test result allow a
temperature of 150°C Max. for components of 1.2*1.0mm size and below with a Max. thickness of 1.25mm.
The users is cautioned that the risk thermal shock increases as chip size or temperature differential increases.
Solderability
Terminations to be well soldered after immersion in a Sn(96.5), Ag (3.5) tin/lead solder bath at 260+/-50°C
for 5+/-1 seconds.
Selection of
Flux
Since flus may have a signification effect on the performance of components, it is necessary to verify
following conditions prior to use.
1. Flux used should be with less than or equal to 0.1 wt% (equivalent to Chlorine) of halogenated content,
Flus having a strong acidity content should not be applied.
2. When soldering component on the PCB, the amount of Flux applied should be controlled at optimum
level
3. When using water should be flux, special care should be taken to properly clean the PCB.
Soldering
Mildly activated rosin fluxes are preferred. The minimum amount of solder for give a good joint should be
used excessive solder can lead to damage from the stresses caused by the difference in coefficients of
expansion between solder, ship and substrate, 3L terminations are suitable for all wave and reflow soldering
system. If hand soldering can’t be avoided, the preferred technique is the utilization of hot air soldering tool.
(see table 3)
1. Solder Reflow: Recommended temperature profile.
2. Solder Wave: Wave soldering is perhaps the most rigorous of SMT soldering processes due to the steep
rise in temperature seen by the circuit when immersed in the molten solder wave typically at 240°C.
Wave soldering of ceramic chip inductors larger then 1.8*1.2mm size is discouraged due to the risk of
thermal damage to the inductors Recommended temperature profile.
3. Soldering Iron:
(1) Preheat circuit and inductor to 150°C.
(2) Never contact the ceramic with the iron tip
(3) Use a 20 watt soldering iron with tip diameter of 1.0mm.
(4) 280 °C tip temperature Max.
(5) 1.0mm tip temperature Max.
(6) Limited soldering time is less than 3 seconds
The use of tweezers or vacuum pick ups is strongly recommended for individual components.
Bulk handling should ensure that abrasion and mechanical shock are minimized.
Chip multilayer ceramic inductors should be handled with care to avoid damage or contamination from
perspiration and skin oils.
NextGen Components, Inc.
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PART CODE:
MSA75152K0S001
SMD POWER INDUCTORS MSA SERIES
Table 2
Item
Mixed mounting of
SMD and leaded
inductors
Inductors placement
close to the chassis
Hand-soldering of
leaded inductors
near mounted
components
Bad
Horizontal
Inductors
placement
Inductors
space
N/A
Good
Table 3
Recommended Temperature
Profile for Reflow Soldering
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Recommended Temperature
Profile for Wave Soldering
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Recommended Temperature
Profile for Hand Soldering
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