1.6*1.6*0.6mm SMD CHIP LED
E6C0606RQBC2UDA
Features:
●Long operating life
●Low Power Consumption
●Wide Viewing Angle
●Low voltage DC operated
●RoHS Compliant
●Moisture sensitivity level: 3
Application:
●Backlight
●Decoration lighting
●motormeter
●Indicator
Part Number
E6C0606RQBC2UDA
Dice Material
AlGaInP-InGaN
Emitted Color
Red-Blue
Lens Color
Water Clear or Diffused
Electro-Optical Characteristics(Ta=25℃, @20mA)
Parameter
Luminous Intensity
Radiation Bandwidth
Forward Voltage
Dominant Wavelength
Viewing Angle
Reverse Current
Color
■
■
■
■
■
■
■
■
-
Symbol
Min.
70
70
1.90
2.90
617
460
-
IV
△λ
VF
λd
2θ1/2
IR
Typ.
15
20
2.00
3.00
625
465
120
-
Max.
150
150
2.40
3.40
630
470
10
Unit
mcd
nm
v
nm
deg
uA
Absolute Maximum Ratings(Ta=25℃)
Parameter
Peak Forward Current(1/10 Duty Cycle, 0.1ms Pulse Width)
Forward Current
Reverse Voltage
Electrostatic Discharge
Operating Temperature Range
Storage Temperature Range
Reflow Soldering
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Symbol
IPF
IF
VR
ESD
Topr
Tstg
Tsld
Max.
Unit
100
mA
30
mA
5
v
2000
v
o
-40to+90
C
o
-40to+90
C
260℃for 10secs
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1
1.6*1.6*0.6mm SMD CHIP LED
E6C0606RQBC2UDA
Optical & Electrical Characteristics
Spectrum Distribution
Relative Luminous lntensity(%)
100
75
50
25
0
400
450
500
550
Wavelength (nm)
50
50
40
40
30
20
10
0
1.6
2.0
2.4
2.8
3.2
650
700
Forward Current vs.Ambient Temperature
Forward Current (mA)
Forward Current (mA)
Forward Current vs.Forward Voltage
600
30
20
10
0 0
3.6
20
40
60
80
100
Ambient Temperature
Forward Voltage (V )-volts
Relative Luminous lntensity vs.Forward Currenr
20° 10° 0°
Relative Luminous lntensity
2.5
30°
2.0
40°
1.5
1.0
0.9
0.8
50°
1.0
60°
70°
80°
90°
0.6 0.4 0.2
0.5
0
0
10
20
30
40
Forward Currenr(mA)
50
0.7
0
0.1 0.3 0.5
Radiation Diagram
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1.6*1.6*0.6mm SMD CHIP LED
E6C0606RQBC2UDA
Reliability Test Items And Conditions
Test Items
Reference
Thermal Shock
Test Conditions
Time
-40℃(30min)
100
-100℃(30min) Cycles
-10℃~65℃;
10cycles
0%~90%RH
MIL-STD-202G
Temperature And Humidity
Cyclic
High Temperature Storage
Low Temperature Storage
High Temperature High
Humidity Storage
High Temperature Life Test
JEITA ED-4701 200
203
JEITA ED -4071 200
201
JEITA ED -4071 200
202
JEITA ED -4071 100
103
JESD22-A108D
Life Test
Resistance to Sodering
Heat
GB/T 4937,Ⅱ,
2.2&2.3
Criterion
22
0/22
22
0/22
Ta=100℃
1000H
22
0/22
Ta=-40℃
1000H
22
0/22
1000H
22
0/22
1000H
22
0/22
1000H
22
0/22
2 times
22
0/22
Ta=60℃;
RH=90%
Ta=80℃
Ta=25℃
IF=20mA
Tsol*=(240±5)
℃10secs
JESD22-A108D
Quantity
Criteria For Judging Damage
Test Items
Forward Voltage
Recerse Current
Symbol
VF
IR
Test Conditions
IF=IFT
VR=5V
Luminous Intensity
IV
IF=IFT
Resistance to
Soldering Heat
-
-
Criteria For Judging Damage
Initial Data±10%
IR≤10uA
Average IV degradation≤30%;Single LED IV
degradation≤50%
Meterial without internal cracks,no meterial
between stripped,no deaded light
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1.6*1.6*0.6mm SMD CHIP LED
E6C0606RQBC2UDA
Product size (Unit:mm)
NOTES:
1. All dimensions are in millimeters (inches)
2. Tolerances are 0.2mm (0.008inch) unless otherwise noted
Recommended Soldering Pad Design (Unit:mm)
Taping and package Spec
●Tape Specification:4,000pcs Per Reel
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1.6*1.6*0.6mm SMD CHIP LED
E6C0606RQBC2UDA
Packaging
LabelStyle
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desling@ekingluxs.com
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1.6*1.6*0.6mm SMD CHIP LED
E6C0606RQBC2UDA
Useful hint
Reflow Soldering Instructions
1. Don't cause stress to the LEDs while it is exposed to high temperature.
2. The maximum number of reflow soldering passes is 2 times.
3. Reflow soldering is recommended. Other soldering methods are not recommended as they might cause damage to the product.
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1.6*1.6*0.6mm SMD CHIP LED
E6C0606RQBC2UDA
Precautions
1. Storage:
●Moisture proof and anti-electrostatic package with moisture absorbent material is used, to keep
moisture to
aminimum.
●Before opening the package, the product should be kept at 30℃ or less and humidity less than 60% RH, and beused
within a year.
●After opening the package, the product should be stored at 30℃ or less and humidity less than 10%RH, and besoldered
within 24 hours (1day). It is recommended that the product be operated at the workshop condition of 30℃ or less and
humidity less than 60%RH.
●If the moisture absorbent material has fade away or the LEDs have exceeded the storage time, baking treatment should
be performed based on the following condition: (70±5)℃ for 24 hours.
2. Static Electricity:
Static electricity or surge voltage damages the LEDs. Damaged LEDs will show some unusual characteristic such as the
forward voltage becomes lower, or the LEDs do not light at the low current. even not light.
All devices, equipment and machinery must be properly grounded. At the same time, it is recommended that wrist bands
or anti-electrostatic gloves, anti-electrostatic containers be used when dealing with the LEDs.
3. Vulcanization:
LED curing is due to sulfur being in bracket and the +1 price of silver in the chemical reaction generated Ag2S in the
process. It will lead to the capacity of reflecting of silver layer reducing, light color temperature drift and serious
decline ,seriously affecting the performance of the product.So we should take corresponding measures to avioding
vulcanization, such as to avoid using sulphur volatile substances and keeping away from high sulphur content of the
material.
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