SMW3225S601HTE

SMW3225S601HTE PACKING DIMENSIONS (mm) B A Epoxy C D Termination Wires E 3225 Dimensions A B C D E F 3.2 ± 0.2 2.5 ± 0.2 2.2 ± 0.2 0.2 ± 0.1 0.80 Typ 0.65 Typ E F F EXPLANATION OF PART NUMBERS 1 2 3 4 5 6 7 8 9 10 11 12 S W (1) M 3 2 2 5 S 6 0 (3) 1 H (2) (1) Product name (2) Shapes and dimensions (3) Impedance【 at 100MHz】 601:600Ω ELECTRICAL CHARACTERISTICS Z(Ω) P/N Common Mode Impedance at 100MHz SMW3225S601HTE 600 DCR (Ω) [ Max ] 0.25 Rated current Idc(A) [ Max ] 1 Rated Voltage Vdc (V)Typical 50 Insulation Resistance IR (MΩ)Min. 10 Operating temperature : -25 to +85℃ Storage temp. and humidity : -40 to +85℃ ,70%RH max Typical Heat Rating DC Current would cause an approximately △T of 40℃ Recommended Footprint(mm) 3.7 2.55 0.75 0.9 Rev.01 Page 1 of 5 1.9 www. sunltech.com SMW3225S601HTE PERFORMANCE CURVES SWM3225S601HTE 10000 Impedance(Ω) 1000 100 10 1 0.1 1 10 100 1000 10000 Frequency(MHz) Rev.01 Page 2 of 5 www. sunltech.com SMW3225S601HTE Test Equipment Impedance Measured by using Agilent 4291A RF Impedance Analyzer. Measurement terminal ① ④ ② ③ DC Resistance Measurement terminal Measured by using Chroma 16502 mill ohm meter. Measurement terminal ① ④ ② ③ Measurement terminal Insulation Resistance Measured by using Chroma 19073 Measurement voltage : 50v ,Measurement time : 60 sec. Measurement terminal Rev.01 ① ④ ② ③ Page 3 of 5 www. sunltech.com SMW3225S601HTE RECOMMENDED SOLDERING TEMP. GRAPH 10sec. Max. Preheat 100sec. Max. 255℃ ℃ 200℃ ℃ Natural cooling 150℃ ℃ 20sec. 60sec. Min. MECHANICAL RELIABILITY TEST Solderability Specification & Requirement Method Used The surface of terminal/pin tested shall Solder heat proof: be covered with new solder by 90% Preheating: 150 ±10℃ 60 seconds Soldering: 245 ±5℃ for 4 ±1 sec Solder Heat Resistance Components should have not evidence of Preheating:150℃ 60secs electrical and mechannical damage Solder temperature: 260±5℃ Impedance:within ±15% of initial value Flux:rosin Dip time:10±0.5 secs Series No. F（Kg） 1608 0.5 2012 0.5 3216 1.0 3225 1.0 Terminal strength Solder a chip to test substrate and then laterally apply a force in the arrow direction φ1.0 Test Board ENDURANCE RELIABILITY TEST Specification & Requirement Impedance change within ± 15% Without Thermal Shock mechanical damage Method Used -65℃, (30 mins) -> room temp. (2 mins) -> 125℃, (30 mins) -> room temp. (2 mins) 50 cycles Humidity Resistance Low Temp. Storing High Temp. Storing Rev.01 Impedance change within ± 15% Without Apply IDC current @ 60℃ ambient mechanical damage Humidity: 90％ Duration: 168 hrs Impedance change within ± 15% Without Storing Temp. mechanical damage -40 ±2 ℃ for total 168 +5/-0 hours Impedance change within ± 15% Without Storing Temp. mechanical damage 125 ±2 ℃ for total 168 +5/-0 hours Page 4 of 5 www. sunltech.com SMW3225S601HTE Reel Dimension & Tape Dimension A 13 .5 C B D R1 .9 7"x8mm A(mm) 9.0±0.5 13.5±0.5 R1 5 R0. 120 Type 7”x8mm 7”x12mm ∮ 0.5 0. 5 ∮ 2 0.5  7"x12mm B(mm) 60±2 60±2 Size Ao(mm) Bo(mm) Ko(mm) W(mm) 1608 1.65±0.10 1.00±0.10 1.18±0.10 2012 2.35±0.10 1.50±0.10 3216 3.50±0.10 3225 3.60±0.10 C(mm) 13.5±0.5 13.5±0.5 D(mm) 178±2 178±2 E(mm) F(mm) Po(mm) P1(mm) Do(mm) 8.00±0.20 1.75±0.10 3.50±0.05 4.0±0.05 4.0±0.10 none 1.45±0.10 8.00±0.20 1.75±0.10 3.50±0.05 4.0±0.05 4.0±0.10 1.0±0.1 1.88±0.10 2.10±0.10 8.00±0.20 1.75±0.10 3.50±0.05 4.0±0.05 4.0±0.10 1.0±0.1 2.80±0.10 2.20±0.10 8.00±0.20 1.75±0.10 3.50±0.05 4.0±0.05 4.0±0.10 1.0±0.1 Packaging Quantity Chip Size 8mm/ Reel Rev.01 3225 1000 Page 5 of 5 www. sunltech.com