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SDT23C712L02

SDT23C712L02

  • 厂商:

    BRIGHTKING(君耀)

  • 封装:

    SOT23

  • 描述:

    ESD抑制器/TVS二极管 VRWM=12V VBR(min)=13.3V VC=20V@IPP=5A SOT23

  • 数据手册
  • 价格&库存
SDT23C712L02 数据手册
SDT23C712L02 Electrostatic Discharged Protection Devices (ESD) Data Sheet Description Brightking’s SDT23C712L02 component is designed for asymmetrical (12V to -7V) protection in muti-point data transmission standard RS-485 applications. It may be used to protect devices from transient voltages resulting from electrostatic discharge (ESD), electrical fast transients (EFT), and lightning. It features 400W (tp=8/20μs) of power handing capability to accommodate the higher transient voltage levels which may be expected in extended common mode applications. Features ● ● ● ● ● ● ● ● ● ● ● ● IEC61000-4-2 ESD 30KV Air, 30KV contact compliance SOT-23 surface mount package Protects two +12V to -7V lines Peak power dissipation of 400W under 8/20μs waveform Low leakage current Low clamping voltage Solid-state silicon avalanche technology Lead Free/RoHS compliant Solder reflow temperature: Pure Tin-Sn, 260~270℃ Flammability rating UL 94V-0 Meets MSL level 1, per J-STD-020 Marking: B 712 3 1 2 Pin Configuration Applications ±5V ● Protection of RS-485 transceiver with extended Common-mode range ● Security Systems ● Automatic Teller Machines ● HFC Systems ● Networks X 100O SET23A05L02 D INPUT R OUTPUT SDT23C712L02 Revision:ESD-SDT23C712L02-001(A2) 1/5 http://brightking.yageo.com SDT23C712L02 Maximum Ratings Rating Peak pulse power (tp=8/20μs waveform) Symbol Value Unit PPP 400 W ESD voltage (Contact discharge) ±30 VESD kV ESD voltage (Air discharge) ±30 Storage & operating temperature range TSTG ,TJ ℃ -55~+150 Electrical Characteristics (TJ=25℃) Pin 1 to Pin3 and Pin2 to Pin3 Parameter Reverse stand-off voltage Reverse breakdown voltage Symbol Condition Min. Typ. VRWM Max. Unit 12 V VBR IBR=1mA 13.3 V Reverse leakage current IR VR=12V 1 μA Clamping voltage (tp=8/20μs) VC IPP=5A 20 V Peak Pulse Current(tp=8/20μs) IPP 15 A Off state junction capacitance CJ 0Vdc,f=1MHz Between I/O pins and GND 75 pF Symbol Condition Max. Unit 7 V Pin 3 to Pin1 and Pin3 to Pin2 Parameter Reverse stand-off voltage Reverse breakdown voltage Min. VRWM Typ. VBR IBR=1mA Reverse leakage current IR VR=7V 20 μA Clamping voltage (tp=8/20μs) VC IPP=5A 10 V Peak Pulse Current(tp=8/20μs) IPP 15 A Off state junction capacitance CJ 75 pF Revision:ESD-SDT23C712L02-001(A2) 0Vdc,f=1MHz Between I/O pins and GND 2/5 7.5 V http://brightking.yageo.com SDT23C712L02 Typical Characteristics Curves Figure 1. Power Derating Curve Figure 2. Pulse Waveforms 110 100 100 % of Peak Power Current Peak Power Dissipation (%) 90 80 70 60 50 40 30 20 10 0 tr Peak value Ipp Waveform Parameters: tr=8µs td=20µs 90 80 70 60 50 40 30 td=t|IPP/2 20 10 0 25 50 75 100 125 150 0 175 0 5 10 15 20 25 30 t-Time (μs) TA-Ambient Temperature (℃) Figure 3. Non-Repetitive Peak Pulse vs. Pulse Time Figure 4. Clamping Voltage vs. Peak Pulse Current 10000 20 Clamping Voltage (V) PPP - Peak Pulse Power (W) 18 1000 100 16 pin1/pin2 to pin3 14 12 pin3 to pin1/pin2 10 8 6 Waveform Parameters: tr=8µs tb=20µs 4 2 10 0.1 0 1 10 100 1000 tP-Pulse Duration (µs) Revision:ESD-SDT23C712L02-001(A2) 10000 0 1 2 3 4 5 IPP-Peak Pulse Current (A) 3/5 http://brightking.yageo.com SDT23C712L02 Recommended Soldering Conditions Reflow Soldering Critical Zone TL to TP tP TP Ramp-up TL tL Temperature TS max TS min Ramp-down tS Preheat 25 t 25℃ to Peak Time Recommended Conditions Profile Feature Pb-Free Assembly Average ramp-up rate (TL to TP) 3℃/second max. Preheat -Temperature Min (TS min) -Temperature Max (TS max) -Time (min to max) (ts) 150℃ 200℃ 60-180 seconds TS max to TL -Ramp-up Rate 3℃/second max. Time maintained above: -Temperature (TL) -Time (tL) 217℃ 60-150 seconds Peak Temperature (TP) 260℃ Time within 5℃ of actual Peak Temperature (tP) Ramp-down Rate 6℃/second max. Time 25℃ to Peak Temperature Revision:ESD-SDT23C712L02-001(A2) 20-40 seconds 8 minutes max. 4/5 http://brightking.yageo.com SDT23C712L02 Dimensions (SOT-23) Dimension E F A G 2 Symbol 1 B C H I 3 J D 0.8 (3X) 0.9 (3X) 1.9 0.95 1.8 Recommended Soldering Pad Layout Millimeters Inches Min. Max. Min. Max. A 0.08 0.18 0.003 0.007 B 0.15 - 0.006 - C - 0.13 - 0.005 D 0.89 1.09 0.035 0.043 E 2.80 3.05 0.110 0.120 F 1.90 0.075 G 0.95 0.037 H 1.19 1.40 0.047 0.055 I 2.10 2.49 0.083 0.098 J 0.35 0.50 0.014 0.020 Packaging Tape P0 P1 P2 K F B W E øD0 B0 A0 øD1 t A Reel D2 D Revision:ESD-SDT23C712L02-001(A2) W1 Symbol Dimension (mm) W 8.00±0.30 P0 4.00±0.10 P1 4.00±0.10 P2 2.00±0.10 D0 Φ1.55±0.10 D1 Φ1.00±0.05 E 1.75±0.10 F 3.50±0.10 A 3.10±0.10 A0 2.10±0.10 B 2.75±0.10 B0 0.65±0.10 K 1.10±0.10 t 0.20±0.05 D Φ178.0±2.0 D2 Φ13.0 W1 9.5 Quantity: 3000PCS 5/5 http://brightking.yageo.com
SDT23C712L02 价格&库存

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SDT23C712L02
  •  国内价格
  • 5+0.67576
  • 20+0.61635
  • 100+0.55694
  • 500+0.49753
  • 1000+0.46980
  • 2000+0.45000

库存:388

SDT23C712L02
    •  国内价格
    • 3000+0.47856

    库存:3000