SET23A03L02

SET23AXXL02 SERIES Electrostatic Discharged Protection Devices (ESD) Data Sheet Description Brightking’s SET23AXXL02 siries are designed to protect components which are connected to data and transmission lines from voltage surges caused by electrostatic discharge (ESD), electrical fast transients (EFT) and lightning. TVS diodes are characterized by their high surge capability, low operating and clamping voltages, and fast response time. This makes them ideal for use as board level protection of sensitive semiconductor components. The low profile SOT-23 package allows flexibility in the design of crowded circuit boards. Features ● IEC61000-4-2 ESD 30KV Air, 30KV contact compliance ESD 15KV Air, 8KV contact compliance for SET23A36L02 ● SOT-23 surface mount package ● Protects one bidirectional line or two unidirectional lines ● Working voltage: 3.3V, 5V, 12V, 15V, 24V and 36V ● Low leakage current ● Low operating and clamping voltages ● Solid-state silicon avalanche technology ● Lead Free/RoHS compliant ● Solder reflow temperature: Pure Tin-Sn, 260~270℃ ● Flammability rating UL 94V-0 ● Meets MSL level 1, per J-STD-020 3 1 2 Pin Configuration LINE 1 LINE 1 X SET23AXXL02 Applications LINE 2 LINE 2 Bidirectional Protect Line ● ● ● ● ● ● ● Cellular handsets and accessories Personal digital assistants (PDA’s) Portable instrumentation Set Top Box (STB) Servers, notebook, and desktop PC Wireless bus protection RS-232, RS-422, RS-423 protection LINE 1 LINE 1 LINE 2 LINE 2 SET23AXXL02 Unidirectional Protect Lines Maximum Ratings Rating Symbol ESD voltage (Contact discharge) Value Unit ±8 VESD ESD voltage (Air discharge) Storage & operating temperature range Revision:ESD-SET23AXXL02 SERIES-001(A2) kV ±15 TSTG ,TJ 1/6 -55~+150 ℃ http://brightking.yageo.com SET23AXXL02 SERIES Electrical Characteristics (TJ=25℃) SET23A03L02 (Marking: B 03C) Parameter Reverse stand-off voltage Reverse breakdown voltage Symbol Condition Min. Typ. VRWM Max. Unit 3.3 V VBR IBR=1mA 4 V Reverse leakage current IR VR=3.3V each I/O pin 125 μA Clamping voltage (tp=8/20μs) VC IPP=1A 7 V Clamping voltage (tp=8/20μs) VC IPP=15A 15 V Peak Pulse Current(tp=8/20μs) IPP 15 A Off state junction capacitance CJ 0Vdc,f=1MHz Between I/O pins and GND Symbol Condition 300 pF SET23A05L02 (Marking: B 05C) Parameter Reverse stand-off voltage Reverse breakdown voltage Min. Typ. VRWM Max. Unit 5 V VBR IBR=1mA 6 V Reverse leakage current IR VR=5V each I/O pin 5 μA Clamping voltage (tp=8/20μs) VC IPP=1A 9.8 V Clamping voltage (tp=8/20μs) VC IPP=15A 20 V Peak Pulse Current(tp=8/20μs) IPP 15 A Off state junction capacitance CJ 0Vdc,f=1MHz Between I/O pins and GND Symbol Condition 220 pF SET23A12L02-E18 (Marking: B 12C) Parameter Reverse stand-off voltage Reverse breakdown voltage Min. Typ. VRWM Max. Unit 12 V VBR IBR=1mA Reverse leakage current IR VR=12V Each I/O pin 1 μA Clamping voltage (tp=8/20μs) VC IPP=1A 19 V Clamping voltage (tp=8/20μs) VC IPP=10A 27 V Peak Pulse Current(tp=8/20μs) IPP 18 A Off state junction capacitance CJ Revision:ESD-SET23AXXL02 SERIES-001(A2) 0Vdc,f=1MHz Between I/O pins and GND 2/6 13.3 V 100 pF http://brightking.yageo.com SET23AXXL02 SERIES Electrical Characteristics (TJ=25℃) SET23A15L02 (Marking: B 15C) Parameter Reverse stand-off voltage Reverse breakdown voltage Symbol Condition Min. Typ. VRWM Max. Unit 15 V VBR IBR=1mA 16.7 V Reverse leakage current IR VR=15V each I/O pin 1 μA Clamping voltage (tp=8/20μs) VC IPP=1A 24 V Clamping voltage (tp=8/20μs) VC IPP=10A 30 V Peak Pulse Current(tp=8/20μs) IPP 10 A Off state junction capacitance CJ 0Vdc,f=1MHz Between I/O pins and GND Symbol Condition 90 pF SET23A24L02 (Marking: B 24C) Parameter Reverse stand-off voltage Reverse breakdown voltage Min. Typ. VRWM Max. Unit 24 V VBR IBR=1mA 26.7 V Reverse leakage current IR VR=24V each I/O pin 1 μA Clamping voltage (tp=8/20μs) VC IPP=1A 43 V Clamping voltage (tp=8/20μs) VC IPP=5A 49 V Peak Pulse Current(tp=8/20μs) IPP 6 A Off state junction capacitance CJ 0Vdc,f=1MHz Between I/O pins and GND Symbol Condition 80 pF SET23A36L02 (Marking: B 36C) Parameter Reverse stand-off voltage Reverse breakdown voltage Min. Typ. VRWM Max. Unit 36 V VBR IBR=1mA Reverse leakage current IR VR=36V each I/O pin 1 μA Clamping voltage (tp=8/20μs) VC IPP=1A 51 V Clamping voltage (tp=8/20μs) VC IPP=5A 76.8 V Peak Pulse Current(tp=8/20μs) IPP 5 A Off state junction capacitance CJ Revision:ESD-SET23AXXL02 SERIES-001(A2) 0Vdc,f=1MHz Between I/O pins and GND 3/6 40 V 70 pF http://brightking.yageo.com SET23AXXL02 SERIES Typical Characteristics Curves Figure 1. Power Derating Curve Figure 2. Pulse Waveforms 110 100 90 % of Peak Power Current Peak Power Dissipation (%) 100 80 70 60 50 40 30 20 10 0 tr Peak value Ipp Waveform Parameters: tr=8µs td=20µs 90 80 70 60 50 40 30 td=t|IPP/2 20 10 0 25 50 75 100 125 150 0 175 0 5 10 15 20 25 30 t-Time (μs) TA-Ambient Temperature (℃) Figure 3. Forward Voltage vs. Forward Current Figure 4. ESD Clamping(8kV Contact IEC61000-4-2) 3.5 Forward Voltage (V) 3.0 2.5 2.0 1.5 Waveform Parameters: tr=8µs tb=20µs 1.0 0.5 0 0 1 2 4 3 5 Peak Pulse Current (A) Revision:ESD-SET23AXXL02 SERIES-001(A2) 6 7 4/6 http://brightking.yageo.com SET23AXXL02 SERIES Recommended Soldering Conditions Reflow Soldering Critical Zone TL to TP tP TP Ramp-up TL tL Temperature TS max TS min Ramp-down tS Preheat 25 t 25℃ to Peak Time Recommended Conditions Profile Feature Pb-Free Assembly Average ramp-up rate (TL to TP) 3℃/second max. Preheat -Temperature Min (TS min) -Temperature Max (TS max) -Time (min to max) (ts) 150℃ 200℃ 60-180 seconds TS max to TL -Ramp-up Rate 3℃/second max. Time maintained above: -Temperature (TL) -Time (tL) 217℃ 60-150 seconds Peak Temperature (TP) 260℃ Time within 5℃ of actual Peak Temperature (tP) Ramp-down Rate 6℃/second max. Time 25℃ to Peak Temperature Revision:ESD-SET23AXXL02 SERIES-001(A2) 20-40 seconds 8 minutes max. 5/6 http://brightking.yageo.com SET23AXXL02 SERIES Dimensions (SOT-23) Dimension E F A G 2 Symbol 1 B C H I 3 J D 0.8 (3X) 0.9 (3X) 1.9 0.95 1.8 Millimeters Inches Min. Max. Min. Max. A 0.08 0.18 0.003 0.007 B 0.15 - 0.006 - C - 0.13 - 0.005 D 0.89 1.09 0.035 0.043 E 2.80 3.05 0.110 0.120 F 1.90 0.075 G 0.95 0.037 H 1.19 1.40 0.047 0.055 I 2.10 2.49 0.083 0.098 J 0.35 0.50 0.014 0.020 Recommended Soldering Pad Layout Packaging Tape P0 P1 P2 K F B W E øD0 B0 A0 øD1 t A Reel D2 D Revision:ESD-SET23AXXL02 SERIES-001(A2) W1 Symbol Dimension (mm) W 8.00±0.30 P0 4.00±0.10 P1 4.00±0.10 P2 2.00±0.10 D0 Φ1.55±0.10 D1 Φ1.00±0.05 E 1.75±0.10 F 3.50±0.10 A 3.10±0.10 A0 2.10±0.10 B 2.75±0.10 B0 0.65±0.10 K 1.10±0.10 t 0.20±0.05 D Φ178.0±2.0 D2 Φ13.0 W1 9.5 Quantity: 3000PCS 6/6 http://brightking.yageo.com