UAD8C05L01-TIP

UAD8C05L01 ElectroStatic Discharged Protection Devices (ESD) Data Sheet Description The UAD8C05L01 includes back-to-back TVS diodes fabricated in a proprietary silicon avalanche technology to provide protection for electronic equipment that may experience destructive electrostatic discharge (ESD). These robust diodes can safely absorb repetitive ESD strikes up to the maximum level specified in the IEC61000-4-2 international standard without performance degradation. The back-to-back configuration provides symmetrical ESD protection for data lines when AC signals are present. Features ● ● ● ● ● ● ● ● ● IEC61000-4-2 ESD 20KV Air, 20KV contact compliance SOD882 surface mount package Working voltage: 5V Low leakage current Low operating and clamping voltages Lead Free/RoHS compliant Flammability rating UL 94V-0 Meets MSL level 1, per J-STD-020 Marking: B1 1 2 Applications Pin Configuration ● ● ● ● ● ● ● ● USB 3.0/USB 2.0 MHL/MIPI/MDDI HDMI, Video Port, eSATA Set Top Boxes, Game Consoles Smart Phones External Storage Ultrabooks, Notebooks Tablets, eReaders Maximum Ratings Rating Symbol ESD voltage (Contact discharge) Value Unit ±20 VESD ESD voltage (Air discharge) Storage & operating temperature range Revision:ESD-UAD8C05L01-001(A3) kV ±20 TSTG ,TJ 1/4 -55~+150 ℃ http://brightking.yageo.com UAD8C05L01 Electrical Characteristics (TJ=25℃) Parameter Symbol Reverse stand-off voltage Condition Min. Typ. Max. Unit 5 V VRWM Reverse breakdown voltage VBR IBR=1mA 7 V Reverse leakage current IR VR=5V Clamping voltage (tp=8/20μs) VC IPP=1A 13 V Clamping voltage (tp=8/20μs) VC IPP=3A 20 V Peak pulse current (tp=8/20μs) IPP Off state junction capacitance CJ μA 1 3 0Vdc,f=1MHz A 0.4 pF Typical Characteristics Curves Figure 2. Insertion Loss (S21) I/O to GND 1 5 0.9 0 0.8 -5 0.7 Attenuation (dB) Capacitance (pF) Figure 1. Capacitance vs. Bias Voltage 0.6 0.5 0.4 0.3 -15 -20 -25 0.2 -30 0.1 -35 0 0 1 2 3 4 -40 5 10 DC Bias (V) Figure 3. Pulse Waveform 110 100 tr Peak value Ipp Waveform Parameters: tr=8µs td=20µs 90 80 70 60 50 40 td=t|PP/2 30 20 10 0 0 5 10 100 1000 Frequency (MHz) Figure 4. Transmission Line Pulsing (TLP) Plot TLP Current (A) % of Peak Power Current -10 15 20 25 30 Time (μs) Revision:ESD-UAD8C05L01-001(A3) 18 16 14 12 10 8 6 4 2 0 -2 -4 -6 -8 -10 -12 -14 -16 -18 -25 -20 -15 -10 -5 0 5 10 15 20 25 TLP Voltage (V) 2/4 http://brightking.yageo.com UAD8C05L01 Recommended Soldering Conditions Reflow Soldering Critical Zone TL to TP tP TP Ramp-up TL tL Temperature TS max TS min Ramp-down tS Preheat 25 t 25℃ to Peak Time Recommended Conditions Profile Feature Pb-Free Assembly Average ramp-up rate (TL to TP) 3℃/second max. Preheat -Temperature Min (TS min) -Temperature Max (TS max) -Time (min to max) (tS) 150℃ 200℃ 60-180 seconds TS max to TL -Ramp-up Rate 3℃/second max. Time maintained above: -Temperature (TL) -Time (tL) 217℃ 60-150 seconds Peak Temperature (TP) 260℃ Time within 5℃ of actual Peak Temperature (tP) Ramp-down Rate 6℃/second max. Time 25℃ to Peak Temperature Revision:ESD-UAD8C05L01-001(A3) 20-40 seconds 8 minutes max. 3/4 http://brightking.yageo.com UAD8C05L01 Dimensions (SOD882) Dimension (mm) A Symbol B C Side View Top View D E 0.30 0.60 0.05 Recommended Soldering Pad Layout Bottom View Min. Max. Min. Max. A 0.95 1.05 0.037 0.041 B 0.55 0.65 0.022 0.026 C 0.32 0.55 0.013 0.022 D 1.40 0.125 Inches 0.55 F 45° Millimeters 0.45 0.018 E 0.20 0.30 0.008 0.012 F 0.45 0.55 0.018 0.022 Packaging Tape P0 P1 P2 K B W F E øD0 øD1 t A Symbol Dimension (mm) W 8.00±0.30 P0 4.00±0.10 P1 2.00±0.10 P2 2.00±0.10 D0 Φ1.55±0.10 D1 Φ0.40±0.05 E 1.75±0.10 F 3.50±0.10 A 0.75±0.10 B 1.15±0.10 K 0.60±0.05 t 0.20±0.05 D Φ178.0±2.0 D2 Φ13.00. W1 9.50 Reel D2 D Revision:ESD-UAD8C05L01-001(A3) W1 Quantity: 10000PCS 4/4 http://brightking.yageo.com