BRCS10N15DP

BRCS10N15DP Rev.B Dec.-2018 描述 / DATA SHEET Descriptions N 沟道 TO-252 塑封封装场效应管。N-CHANNEL MOSFET in a TO-252 Plastic Package. 特征 / Features RDS(on) 小，门电荷低，Crss 小，开关速度快。 无卤产品。 Low RDS(on) ,low gate charge, low Crss , fast switching. HF Product. 用途 / Applications 用于低压电路如：汽车电路、DC/DC 转换、便携式产品的电源高效转换、TV/Monitor 电源板卡。 Suited for low voltage applications such as automotive, DC/DC Converters, high efficiency switching for power management in portable and battery operated products,and power management interface card for TV or Monitor. 内部等效电路 引脚排列 / Equivalent Circuit / Pinning PIN1：G 放大及印章代码 PIN 2：D PIN 3：S PIN 4：D / hFE Classifications & Marking 见印章说明。See Marking Instructions. http://www.fsbrec.com 1/8 BRCS10N15DP Rev.B Dec.-2018 极限参数 / DATA SHEET Absolute Maximum Ratings(Ta=25℃) 参数 Parameter 符号 Symbol 数值 Rating 单位 Unit Drain-Source Voltage VDS 150 V Gate-Source Voltage Continuous Drain Current Pulsed Drain Current C VGS ±20 V ID 10 IDM 25 Avalanche Current C IAS 10.8 A Avalanche energy L=0.1 mH C EAS 7 mJ PD 54 W TJ, TSTG -55 to 150 °C 44 ℃/W 110 ℃/W 2.8 ℃/W Power Dissipation B TC=25°C TC=25°C Junction and Storage Temperature Range Maximum Junction-to-Ambient A t ≤ 10s RθJA Maximum Junction-to-Ambient AD Steady-State Maximum Junction-to-Case 电性能参数 Steady-State RθJC A / Electrical Characteristics(Ta=25℃) 参数 Parameter Drain-Source Breakdown Voltage 符号 Symbol BVDSS Zero Gate Voltage Drain Current IDSS Gate-Body leakage current IGSS Gate Threshold Voltage Static Drain-Source On-Resistance Diode Forward Voltage http://www.fsbrec.com VGS(th) RDS(ON) VSD 测试条件 Test Conditions ID=250μA, VGS=0V 最小值 典型值 最大值 Min Typ Max 150 155 VDS=150V, VGS=0V 5 VDS=0V, VGS=±20V VDS=VGS，ID=250μA V 1 TJ=125°C 1 A ±100 nA 3 V VGS=10V, ID=7A 182 300 VGS=4.5V, ID=6A 183 450 IS=1A,VGS=0V 单位 Unit 1 m V 2/8 BRCS10N15DP Rev.B Dec.-2018 电性能参数 DATA SHEET / Electrical Characteristics(Ta=25℃) 参数 Parameter Input Capacitance 符号 Symbol 测试条件 Test Conditions Ciss Output Capacitance Coss Reverse Transfer Capacitance Crss Gate resistance Rg Turn-On Delay Time tD(on) Turn-On Rise Time tr Turn-Off Delay Time tD(off) 最小值 典型值 最大值 Min Typ Max 单位 Unit 660 VGS=0V, f=1MHz VDS=25V, 74 pF 17 VGS=0V, f=1MHz VDS=0V, 2.6 Ω 60 VGS=10V, VDS=75V, ID=5A, RL=14.7Ω, RGEN=50Ω 250 135 ns Turn-Off Fall Time tf 135 Body Diode Reverse Recovery ISD=4A, trr 200 ns Time dI/dt=100A/ms A. The value of RθJA is measured with the device mounted on 1in2 FR-4 board with 2oz. Copper, in a still air environment with TA =25°C. The Power dissipation PDSM is based on R qJA and the maximum allowed junction temperature of 150°C. The value in any given application depends on the user's specific board design, and the maximum temperature of 150°C may be used if the PCB allows it. B. The power dissipation PD is based on TJ(MAX)=150°C, using junction-to-case thermal resistance, and is more useful in setting the upper dissipation limit for cases where additional heatsinking is used. C. Repetitive rating, pulse width limited by junction temperature TJ(MAX)=150°C. Ratings are based on low frequency and duty cycles to keep initial TJ =25°C. D. The RθJA is the sum of the thermal impedance from junction to case RθJC and case to ambient. http://www.fsbrec.com 3/8 BRCS10N15DP Rev.B Dec.-2018 电参数曲线图 DATA SHEET / Electrical Characteristic Curve http://www.fsbrec.com 4/8 BRCS10N15DP Rev.B Dec.-2018 电参数曲线图 DATA SHEET / Electrical Characteristic Curve http://www.fsbrec.com 5/8 BRCS10N15DP Rev.B Dec.-2018 外形尺寸图 DATA SHEET / Package Dimensions http://www.fsbrec.com 6/8 BRCS10N15DP Rev.B Dec.-2018 印章说明 / DATA SHEET Marking Instructions BR 10N15 **** 说明： 为公司代码 BR： 10N15  为型号代码 ****：  为生产批号代码，随生产批号变化。 BR:    Company Code 10N15 : ****:  Note: http://www.fsbrec.com Product Type Code. Lot No. Code, code change with Lot No. 7/8 BRCS10N15DP Rev.B Dec.-2018 DATA SHEET 回流焊温度曲线图(无铅) / Temperature Profile for IR Reflow Soldering(Pb-Free) 说明： Note: 1、预热温度 150～180℃，时间 60～90sec; 1.Preheating:150~180℃, Time:60~90sec. 2、峰值温度 245±5℃，时间持续为 5±0.5sec; 2.Peak Temp.:245±5℃, Duration:5±0.5sec. 3、焊接制程冷却速度为 2～10℃/sec. 3. Cooling Speed: 2~10℃/sec. 耐焊接热试验条件 / Resistance to Soldering Heat Test Conditions 温度：260±5℃ 包装规格 Package Type 封装形式 TO-252 套管包装 Package Type 封装形式 使用说明 Temp.:260±5℃ Time:10±1 sec / Packaging SPEC. 卷盘包装 TO-251/252 时间：10±1 sec. / REEL Units 包装数量 Dimension Units/Reel 只/卷盘 Reels/Inner Box 卷盘/盒 Units/Inner Box 只/盒 Inner Boxes/Outer Box 盒/箱 Units/Outer Box 只/箱 2,500 2 5,000 6 30,000 包装尺寸 3 (unit：mm ) Reel Inner Box 盒 Outer Box 箱 13〞×16 360×360×50 380×335×366 / TUBE Units 包装数量 Dimension 包装尺寸 3 (unit：mm ) Units/Tube 只/套管 Tubes/Inner Box 套管/盒 Units/Inner Box 只/盒 Inner Boxes/Outer Box 盒/箱 Units/Outer Box 只/箱 Tube 套管 Inner Box 盒 Outer Box 箱 75 48 3,600 5 18,000 526×20.5×5.25 555×164×50 575×290×180 / Notices http://www.fsbrec.com 8/8