BRCS3415MC

BRCS3415MC Rev.A .Oct.-2018 描述 / DATA SHEET Descriptions SOT23-3 塑封封装 P 道 MOS 场效应管。 P- CHANNEL MOSFET in a SOT23-3 Plastic Package. 特征 / Features RDS(ON)< 41 mΩ,VGS= -4.5V RDS(ON)< 53 mΩ,VGS= -2.5V 无卤产品。HF Product. 用途 / Applications 负载开关，电池保护。 Load switch，Battery protection. 内部等效电路 引脚排列 PIN1：G 印章代码 / Equivalent Circuit / Pinning PIN 2：S PIN 3：D / Marking Marking http://www.fsbrec.com AFH 1/6 BRCS3415MC Rev.A .Oct.-2018 极限参数 / DATA SHEET Absolute Maximum Ratings(Ta=25℃) 参数 Parameter Drain-Source Voltage 符号 Symbol VDS 数值 Rating -20 单位 Unit V VGS ±8 V Drain Current-Continuous @ TC =25°C ID -4 A Drain Current-Pulsed Note1 @ TC =25°C IDM -30 A Maximum Power Dissipation PD 1.5 W Storage Temperature Range TSTG -55 to +150 °C TJ -55 to +150 °C RθJA 100 °C/W Gate-Source Voltage Operating Junction Temperature Range Thermal Resistance, Junction-to-Ambient Note2 电性能参数 / Electrical Characteristics(Ta=25℃) 参数 Parameter Drain-Source Breakdown Voltage 符号 Symbol BVDSS Zero Gate Voltage Drain Current IDSS VDS=-20V Gate-Body Leakage IGSS VGS=±8V Gate Threshold Voltage VTH Drain-Source On-State Resistance RDS VDS=VGS VGS=-4.5V IDS=-250μA IDS=-4A VGS=-2.5V IDS=-4A Input Capacitance Ciss Output Capacitance Coss VGS=0V Reverse Transfer Capacitance Crss VDS=-10V f=1MHz Turn-On Delay Time td(on) Rise Time tr td(off) Turn-Off Delay Time Fall Time Total Gate Charge at 10V Gate to Source Gate Charge tf Qg Qgs 测试条件 最小值 典型值 Test Conditions Min Typ VGS=0V IDS =-250μA -20 最大值 Max 单位 Unit V VGS=0V -1 uA VDS=0V ±10 uA -0.6 -0.9 V 35 41 45 53 mΩ 750 110 pF 80 15.6 VDS=-10V VGS=-4.5V RG=3 RL=2.5 VDS=-10V VGS=-4.5V -0.3 11.2 IDS=-4A ns 23.1 32.7 10 1.5 nC Gate to Drain “Miller” Charge Qgd 2.2 Drain-Source Diode Forward VGS=0V IDS=-1A -0.7 V VSD Voltage Notes: 1. Pulse Test: Pulse Width 300μs, Duty Cycle 2%. 2. RθJA is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of the drain pins.RθJC is guaranteed by design while RθCA is determined by the user's board design. RθJA shown below for single device operation on FR-4 in still air. http://www.fsbrec.com 2/6 BRCS3415MC Rev.A .Oct.-2018 电参数曲线图 DATA SHEET / Electrical Characteristic Curve http://www.fsbrec.com 3/6 BRCS3415MC Rev.A .Oct.-2018 外形尺寸图 DATA SHEET / Package Dimensions http://www.fsbrec.com 4/6 BRCS3415MC Rev.A .Oct.-2018 印章说明 / DATA SHEET Marking Instructions AFH 说明： H: 为公司代码 AF: 为型号代码 Note: H: Company Code. AF： Product Type http://www.fsbrec.com 5/6 BRCS3415MC Rev.A .Oct.-2018 DATA SHEET 回流焊温度曲线图(无铅) / Temperature Profile for IR Reflow Soldering(Pb-Free) 说明： Note: 1、预热温度 150～180℃，时间 60～90sec; 1.Preheating: 150～180℃, Time:60~90sec. 2、峰值温度 245±5℃，时间持续为 5±0.5sec; 2.Peak Temp.:245±5℃, Duration:5±0.5sec. 3、焊接制程冷却速度为 2～10℃/sec. 3. Cooling Speed: 2~10℃/sec. 耐焊接热试验条件 / Resistance to Soldering Heat Test Conditions 温度：260±5℃ 包装规格 Time:10±1 sec / REEL Package Type 封装形式 使用说明 Temp.:260±5℃ / Packaging SPEC. 卷盘包装 SOT23-3 时间：10±1 sec. Units 包装数量 Dimension 包装尺寸 3 (unit：mm ) Units/Reel 只/卷盘 Reels/Inner Box 卷盘/盒 Units/Inner Box 只/盒 Inner Boxes/Outer Box 盒/箱 Units/Outer Box 只/箱 Reel Inner Box 盒 Outer Box 箱 3,000 10 30,000 4 120,000 7〞×8 210×205×205 445×230×435 / Notices http://www.fsbrec.com 6/6