BRCS4484SC
Rev.E Nov.-2019
DATA SHEET
描述 / Descriptions
SOP-8 塑封封装 N 沟道增强型场效应管。
N-Channel Enhancement Mode Field Effect Transistor in a SOP-8 Plastic Package.
特征 / Features
采用先进的沟槽技术,提供优良的 RDS(ON)和低栅电荷。无卤产品。
Uses advanced trench technology to provide excellent RDS(ON) with low gate charge. Halogen-free
Product.
用途 /
Applications
适用于广泛的功率转换应用。
Suitable for use in a wide range of power conversion applications.
内部等效电路 / Equivalent Circuit
引脚排列 / Pinning
8
7
6
1
2
5
3
4
PIN1、PIN 2、PIN 3:S
PIN 4:G
PIN5、PIN 6、PIN 7、PIN 8:D
放大及印章代码 / hFE Classifications & Marking
见印章说明。See Marking Instructions.
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BRCS4484SC
Rev.E Nov.-2019
极限参数 /
DATA SHEET
Absolute Maximum Ratings(Ta=25℃)
参数
Parameter
符号
Symbol
Drain-Source Voltage
VDSS
Gate-Source Voltage
VGS
Drain Current –Continuous A
TA=25℃
ID
TA=70℃
Pulsed Drain Current B
Avalanche Current
G
Repetitive avalanche energy L=0.3mH
G
数值
Rating
Steady
10Sec
State
40
单位
Unit
V
±20
V
13.5
10
A
10.8
8.0
A
IDM
120
A
IAR
23
A
EAR
79
mJ
3.1
1.7
2.0
1.1
Power Dissipation for Single
Operation A
TA=25℃
Thermal Resistance,
Junction-to-Ambient A
t≤10S
RθJA
40
℃/ W
Steady State
RθJA
75
℃/ W
RθJl
24
℃/ W
Tj Tstg
-55~150
℃
PD
TA=70℃
Thermal Resistance, Junction-to Lead A (Steady State)
Operating and Junction Temperature Range
W
电性能参数 / Electrical Characteristics(Ta=25℃)
参数
Parameter
Drain-Source Breakdown
Voltage
Zero Gate Voltage Drain
Current
Gate-Body Leakage Current
Forward
Gate Threshold Voltage
Static Drain-Source
On-Resistance
符号
Symbol
测试条件
Test Conditions
BVDSS
VGS=0V
ID=250μA
VDS=40V
VDS=40V
TJ=55°C
VGS=0V
VGS=0V
1.0
μA
IDSS
5.0
μA
IGSS
VGS=20V
VDS=0V
100
nA
VGS(th)
VDS=VGS
ID=250μA
1.4
2.0
V
ID=10A
ID=10A
8.2
10
RDS(on)
VGS=10V
VGS=10 V
TJ=125°C
VGS=4.5 V
12.5
16
ID=8.0A
12
15
0.72
1.0
Diode Forward Voltage
VSD
IS=1A
VGS=0V
Forward Transconductance
gFS
VDS=5V
ID=5A
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最小值 典型值 最大值 单位
Min
Typ
Max
Unit
40
1.0
V
10
mΩ
V
S
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BRCS4484SC
Rev.E Nov.-2019
DATA SHEET
电性能参数 / Electrical Characteristics(Ta=25℃)
参数
Parameter
Input Capacitance
符号
Symbol
Coss
Reverse Transfer Capacitance
Crss
Total Gate Charge(4.5V)
最小值 典型值
Min
Typ
Ciss
Output Capacitance
Total Gate Charge(10V)
测试条件
Test Conditions
1500
VDS=15V
f =1.0MHz
VGS=0V
Qgs
Gate-Drain Charge
Qgd
Gate resistance
Rg
VDS=20V
VGS=10V
ID=10A
27.2
37
13.6
18
4.5
VGS=0V
f=1MHz
VDS=0V
2.0
3.5
Turn-On Rise Time
tr
VDS=20V
RL=2Ω
17.2
Turn-Off Delay Time
td(off)
VGS=10V
RGEN=3Ω
29.6
Ω
ns
16.8
IS
Qrr
5.0
6.4
tf
trr
nC
6.4
td(on)
Continuous Drain-Source Diode
Forward Current
Body Diode Reverse Recovery
Time
Body Diode Reverse Recovery
Charge
pF
135
Turn-On Delay Time
Turn-Off Fall Time
单位
Unit
1950
215
Qg
Gate-Source Charge
最大值
Max
IF=10A
dI/dt=100A/μs
2.5
A
40
ns
30
19
nC
Notes:
A:The value of RθJA is measured with the device mounted on 1in2 FR-4 board with 2oz. Copper, in a still air
environment with TA= 25°C. The value in any given application depends on the user's specific board design.
B: Repetitive rating, pulse width limited by junction temperature.
C. The RθJA is the sum of the thermal impedance from junction to lead RθJL and lead to ambient.
D. The static characteristics in Figures 1 to 6 are obtained using t ≤ 300μs pulses, duty cycle 0.5% max.
E. These tests are performed with the device mounted on 1 in2 FR-4 board with 2oz. Copper, in a still air environment
with TA=25°C. The SOA curve provides a single pulse rating.
F. The current rating is based on the t ≤ 10s thermal resistance rating.
G. EAR and IAR ratings are based on low frequency and duty cycles to keep Tj=25℃.
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BRCS4484SC
Rev.E Nov.-2019
DATA SHEET
电参数曲线图 / Electrical Characteristic Curve
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BRCS4484SC
Rev.E Nov.-2019
DATA SHEET
电参数曲线图 / Electrical Characteristic Curve
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BRCS4484SC
Rev.E Nov.-2019
DATA SHEET
外形尺寸图 / Package Dimensions
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BRCS4484SC
Rev.E Nov.-2019
DATA SHEET
印章说明 / Marking Instructions
BR
4484
****
说明:
BR:
为公司代码
4484:
为型号代码
****:
为生产批号代码,随生产批号变化
Note:
BR:
Company Code.
4484:
Product Type.
****:
Lot No. Code, code change with Lot No.
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BRCS4484SC
Rev.E Nov.-2019
DATA SHEET
回流焊温度曲线图(无铅) / Temperature Profile for IR Reflow Soldering(Pb-Free)
说明:
Note:
1、预热温度 150~180℃,时间 60~90sec;
1.Preheating:150~180℃, Time:60~90sec.
2、峰值温度 245±5℃,时间持续为 5±0.5sec;
2.Peak Temp.:245±5℃, Duration:5±0.5sec.
3、焊接制程冷却速度为 2~10℃/sec.
3. Cooling Speed: 2~10℃/sec.
耐焊接热试验条件 /
Resistance to Soldering Heat Test Conditions
温度:260±5℃
时间:10±1 sec.
Temp.:260±5℃
Time:10±1 sec
包装规格 / Packaging SPEC.
卷盘包装 / REEL
Package Type
封装形式
SOP/ESOP-8
Dimension 包装尺寸 (unit:mm3)
Units 包装数量
Units/Reel
只/卷盘
Reels/Inner Box
卷盘/盒
Units/Inner Box
只/盒
Inner Boxes/Outer Box
盒/箱
Units/Outer Box
只/箱
Reel
Inner Box 盒
Outer Box 箱
4,000
2
8,000
6
48,000
13〞×12
360×360×50
380×335×366
使用说明 / Notices
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