BRCS9926SC

BRCS9926SC Rev.I Mar.-2019 DATA SHEET  描述 / Descriptions SOP-8 塑封封装 N 沟道 PowerTrenchMOS 双场效应管。 Dual N-Channel Power Trench MOSFET in a SOP-8 Plastic Package.  特征   / Features 优化电池保护电路，允许工作电压范围宽：±10VGSS，低栅极电荷。内置双 MOSFET。无卤产品。  Optimized for use in battery protection circuits, ±10 VGSS allows for wide operating voltage range, Low gate charge. Built-in dual MOSFET. Halogen-free Product.  用途 / Applications 电池保护，负载开关，电源管理。 Battery protection, Load Switch, Power management.  内部等效电路 引脚排列 / Equivalent Circuit / Pinning 8 7 1 2 6 5 3 4 PIN1:S2 PIN 2:G2 PIN5、PIN 6:D1 放大及印章代码 PIN 3：S1 PIN 4：G1 PIN 7、PIN 8：D2 / hFE Classifications & Marking 见印章说明。See Marking Instructions. http://www.fsbrec.com 1/8 BRCS9926SC Rev.I Mar.-2019 极限参数 / DATA SHEET Absolute Maximum Ratings(Ta=25℃) 参数 Parameter Drain-Source Voltage 符号 Symbol VDSS 数值 Rating 20 单位 Unit V VGS ±10 V 6.5 A 20 A 2.0 W 1.6 W 1.0 W 0.9 W RθJA 78 ℃/ W RθJC 40 ℃/ W -55～150 ℃ Gate-Source Voltage Drain Current– Continuous (note 1a) ID Drain Current–Pulsed Power Dissipation for Dual Operation Power Dissipation for Single Operation (note 1a) PD (note 1b) Power Dissipation for Dual Operation Power Dissipation for Single Operation (note 1c) Thermal Resistance, Junction-to-Ambient (note 1a) (note 1) Thermal Resistance, Junction-to case Operating and Junction Temperature Range 电性能参数 Tj Tstg / Electrical Characteristics(Ta=25℃) 参数 Parameter Drain-Source Breakdown Voltage 符号 Symbol BVDSS Breakdown Voltage Temperature Coefficient BVDSS/ TJ 测试条件 最小值 典型值 最大值 单位 Test Conditions Min Typ Max Unit VGS=0V ID=250μA 20 V ID=250μA Referenced to 25℃ 14 mV/℃ Zero Gate Voltage Drain Current IDSS VDS=16V VGS=0V 1.0 μA Gate-Body Leakage Current Forward IGSS VGS=8.0V VDS=0V 100 nA VDS=VGS ID=250μA 1.5 V Gate Threshold Voltage VGS(th) Gate Threshold Voltage Temperature Coefficient  VGS(th)/ TJ Static Drain-Source On-Resistance RDS(on) ID=250μA Referenced to 25℃ 1.0 -3.0 mV/℃ VGS=4.5V VGS=4.5V TJ=125℃ VGS=2.5V ID=6.5A ID=6.5A 19 24 27 34 ID=5.4A 23 30 On-State Drain Current ID(on) VDS=5.0V VGS=5.0V Forward Transconductance gFS VDS=5.0V ID=3.0A http://www.fsbrec.com 0.5 15 mΩ A 11 S 2/8 BRCS9926SC Rev.I Mar.-2019 电性能参数 DATA SHEET / Electrical Characteristics(Ta=25℃) 参数 Parameter Input Capacitance 符号 Symbol Ciss 测试条件 Test Conditions VDS=10V f=1.0MHz VGS=0V 最小值 Min 典型值 Typ 700 最大值 Max pF Output Capacitance Coss Reverse Transfer Capacitance Crss 85 Turn-On Delay Time td(on) 8 16 Turn-On Rise Time tr 10 18 Turn-Off Delay Time td(off) 18 29 5.0 10 7.0 10 Turn-Off Fall Time tf Total Gate Charge Qg Gate-Source Charge Qgs Gate-Drain Charge Qgd Maximum Continuous Drain-Source Diode Forward Current Drain-Source Diode Forward Voltage VDD=10V RGEN=6Ω VGS=4.5V VDD=10V VGS=4.5 ID=1.0A ID=3.0A 175 ns nC 1.2 1.9 IS VSD 单位 Unit IS=1.3A (note2) VGS=0V 0.65 1.3 A 1.2 V Notes: 1. RθJA is the sum of the junction-to-case and case-to-ambient resistance where the case thermal reference is defined as the solder mounting surface of the drain pins. RθJC is guaranteed by design while RθJA is determined by the user's board design. a) 78℃/W when mounted on a 0.5 in2 pad of 2 oz. copper. b) 125℃/W when mounted on a 0.02 in2 pad of 2 oz. copper. c) 135℃/W when mounted on a minimum pad. Scale 1 : 1 on letter size paper 2. Pulse Test: Pulse Width ≤ 300 μs, Duty Cycle ≤ 2.0% http://www.fsbrec.com 3/8 BRCS9926SC Rev.I Mar.-2019 电参数曲线图 DATA SHEET / Electrical Characteristic Curve http://www.fsbrec.com 4/8 BRCS9926SC Rev.I Mar.-2019 电参数曲线图 DATA SHEET / Electrical Characteristic Curve http://www.fsbrec.com 5/8 BRCS9926SC Rev.I Mar.-2019 外形尺寸图 DATA SHEET / Package Dimensions http://www.fsbrec.com 6/8 BRCS9926SC Rev.I Mar.-2019 印章说明 / DATA SHEET Marking Instructions BR 9926 **** 说明： 为公司代码 BR： 9926：  为型号代码 ****：  为生产批号代码，随生产批号变化  Company Code. Note: BR:   9926： ****: http://www.fsbrec.com Product Type.  Lot No. Code, code change with Lot No. 7/8 BRCS9926SC Rev.I Mar.-2019 DATA SHEET 回流焊温度曲线图(无铅) / Temperature Profile for IR Reflow Soldering(Pb-Free) 说明： Note: 1、预热温度 150～180℃，时间 60～90sec; 1.Preheating:150~180℃, Time:60~90sec. 2、峰值温度 245±5℃，时间持续为 5±0.5sec; 2.Peak Temp.:245±5℃, Duration:5±0.5sec. 3、焊接制程冷却速度为 2～10℃/sec. 3. Cooling Speed: 2~10℃/sec. 耐焊接热试验条件 / Resistance to Soldering Heat Test Conditions 温度：260±5℃ 包装规格 Package Type 封装形式 使用说明 Temp.:260±5℃ Time:10±1 sec / Packaging SPEC. 卷盘包装 SOP/ESOP-8 时间：10±1 sec. / REEL Units 包装数量 Dimension 包装尺寸 3 (unit：mm ) Units/Reel 只/卷盘 Reels/Inner Box 卷盘/盒 Units/Inner Box 只/盒 Inner Boxes/Outer Box 盒/箱 Units/Outer Box 只/箱 Reel Inner Box 盒 Outer Box 箱 4,000 2 8,000 6 48,000 13〞×12 360×360×50 380×335×366 / Notices http://www.fsbrec.com 8/8