SLO1050H470MTT

SLO1050H Series SMD Molding Power Inductor ◆ Features Pb 、Magnetically shielded construction, low DC resistance； 、The use of magnetic iron powder ensure capability for large current； 3、Low audible core noise； 4、Ideal for DC-DC converter applications in hand held personal computer and etc； 5、Frequency Range: up to 3.0MHz； 6、RoHS compliant。 1 2 ◆ Applications 、Smart phone、MID； 、Next-generation mobile devices with multifunction such as adding color TV and digital movie cameras； 3、Flat-screen TVs, blue-ray disc recorders, set top box； 4、Notebooks, desktop computers, servers, graphic cards； 5、Portable gaming devices, personal navigation systems, personal multimedia devices； 6、Automotive systems； 7、Telecomm base stations。 1 2 ◆ Lead Free Part Numbering SLO 1050 H 100 M T T (1) (2) (3) (4) (5) (6) (7) ： ： (1) (2) (3) (4) Series Type Dimension A X C Material Code Inductance 2R2=2.2μH 100=10μH 101=100μH (5) Inductance Tolerance M= 20%, Y= 30% (6) Company Code (7) Packaging packed in embossed carrier tape ； ； ： ± ： ± ◆ Dimensions Series SLO1050H Rev.01 A±0.2(mm) B±0.2 (mm) C (mm) D±0.1 (mm) E±0.1 (mm) 11.15 10.0 5.0 Max 3.0 2.0 Page 1 of 7 www.sunltech.com SLO1050H Series ◆ Specification Test a condition SATURATION CURRENT(Isat) DC AMPS2 (Typ.) HEAT RATING CURRENT(Idc) DC AMPS1 (Typ.) 0.7 100KHz/1V 65 42 1.0 3.0 100KHz/1V 30 24 SLO1050H1R5MTT 1.5 3.8 100KHz/1V 25 21 SLO1050H2R2MTT 2.2 6.0 100KHz/1V 19 15 SLO1050H3R3MTT 3.3 10 100KHz/1V 16 13 SLO1050H4R7MTT 4.7 14 100KHz/1V 15 11 SLO1050H5R6MTT 5.6 17 100KHz/1V 14 9.5 SLO1050H6R8MTT 6.8 18.5 100KHz/1V 14 9.0 SLO1050H100MTT 10 28 100KHz/1V 10 8.0 SLO1050H150MTT 15 42 100KHz/1V 7.5 6.5 SLO1050H220MTT 22 50 100KHz/1V 6.0 5.5 SLO1050H330MTT 33 86 100KHz/1V 5.2 4.8 SLO1050H470MTT 47 127 100KHz/1V 4.5 3.7 SLO1050H101MTT 100 290 100KHz/1V 2.8 2.1 Ω INDUCTAN CE Lo( H) Rdc (m ) SLO1050HR22MTT 0.22 SLO1050H1R0MTT Part Number μ Max SLO1050H Series NOTES: △ ℃ 1. DC current (Idc) that will cause an approximate T of 40 2. DC current (Isat) that will cause Lo to drop approximately 20% 3. All test data is referenced to 25 ambient 4. Operating Temperature Range -55 to +150 5. The part temperature (ambient + temp rise) should not exceed 150 under the worst operating conditions. Circuit design, component placement, PWB trace size and thickness, airflow and other cooling provisions all affect the part temperature. Part temperature should be verified in the end application. ℃ Rev.01 ℃ ℃ Page 2 of 7 ℃ www.sunltech.com SLO1050H Series Item Specification and Requirement 1. No case deformation or change in Solderability apperarance 1. No case deformation or change in shock apperarance 2. 1.Preheat ：155℃±5℃ ，60S±2S 2.Tin: lead-free. 2. New solder coverage More than 90% Mechanical Test Method △L/Lo≦±10% ℃±5℃，flux 3.0S±0.5S. 3.Temperature:245 ： 100G 2. Pulse time:：6ms 1. Acceleration 3. 3 times in each positive and negative direction of 3 mutual perpendicular directions 1. No case deformation or change in apperarance 2. 1. The test samples shall be soldered to the board. Then it shall be submitted to below test conditions. △L/Lo≦±10% Mechanical vibration Fre. Range 10~55Hz Total Amplitude 1.5mm Sweeping Method 10Hz to 55Hz to 10Hz Time For 2 hours on each X,Y,Z axis. 2. Recovery: At least 2 hours of recovery under the standard condition after the test, followed by the measurement within 24 ±2 hours. ℃ for 30 minutes，last 125℃ for 30 Inductance change: 1. First -55 Within ± 10% Without distinct damage Thermal Shock in appearance minutes as 1 cycle. Go through 1000 cycles. 2. Max transfer time is 2 minutes. 3. Measured at room temperature after placing for 24±2 hours Humidity Resistance Inductance change: 1.Reflow 2 times, Within ± 10% Without distinct damage 2.85 in appearance 3.Measured at room temperature after placing for ℃,85%RH,1000 hours 24±2 hours Low temperature storage High temperature storage Rev.01 ： ℃ Inductance change: 1. Temperature -55 ± 2 Within ± 10% Without distinct damage 2. Time 1000 hours in appearance 3. Measured at room temperature after placing for ： 24±2 hours ：+125 ± 2℃ Inductance change: 1. Temperature Within ± 10% Without distinct damage 2. Time 1000 hours in appearance 3. Measured at room temperature after placing for ： 24±2 hours Page 3 of 7 www.sunltech.com SLO1050H Series Inductance change: 、 ； 2、Place the 100mm X 40mm board into a fixture 1 Run through IR reflow for 2 times Within ± 10% Without distinct damage in appearance similar to the one shown in below Figure with the component facing down 、 3 The apparatus shall consist of mechanical means to apply a force which will bend the board (D) x = 2 mm minimum. 、 4 The duration of the applied forces shall be 60±5 sec. The force is to be applied only once to the oard. Board Flex No removal or split of the termination or other defects shall occur. 、 2、Push the product vertically from the side of the 1 The test samples shall be soldered to the board sample using the thrust tester. 、 3 Automotive electronics ：17.7N，60S±1s，X ， Ydirect. Terminal Strength Rev.01 Page 4 of 7 www.sunltech.com SLO1050H Series ◆ Recommended Soldering Technologies (1) Re-flowing Profile Preheat condition: 150 ~200℃/60~180sec. Allowed time above 217℃: 80~120sec. Max temp: 260℃ Max time at max temp: 10 sec. Solder paste: Sn/3.0Ag/0.5Cu Allowed Reflow time: 2x max (2) Iron Soldering Profile Iron soldering power: Max. 30W Pre-heating: 150℃/60sec. Soldering time: 3sec. Max. Solder paste: Sn/3.0Ag/0.5Cu Max.1 times for iron soldering Rev.01 Page 5 of 7 www.sunltech.com SLO1050H Series ◆Packaging Information （Unit：mm） (1) Tape Packaging Dimensions Tape dimensions (mm) Type SLO1050 W P P0 P2 D0 D1 T A0 B0 K0 E F 24 16 4 2 1.5 1.5 0.4 10.4 11.6 5.4 1.75 11.5 ±0.3 ±0.1 ±0.1 ±0.05 ±0.1 ±0.1 ±0.05 ±0.1 ±0.1 ±0.1 ±0.1 ±0.1 Taping Drawings (UNIT:mm) Rev.01 Page 6 of 7 www.sunltech.com SLO1050H Series （Unit：mm） (2) Reel Dimensions B D N A C W A W N B 330+2.0 24 0.5 ± 97 0.5 ± 2.2+0.5 C 13.0 D ±0.2 ± 10.75 0.25 (3) Packaging Quantity(PCS) Standard Quantity Type Reel SLO1050 Inner box 500 pcs / reel 2Reel / box (1000 pcs) Carton box 4 Middle boxes, (4000 pcs) (4) Peel force of top cover tape The peel speed shall be about 300mm/minute The peel force of top cover tape shall be between 0.1 to 1.3 N Rev.01 Page 7 of 7 www.sunltech.com