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SLO1350H150MTT

SLO1350H150MTT

  • 厂商:

    SUNLTECH(顺磁)

  • 封装:

    SMD

  • 描述:

    功率电感 15µH ±20% 26mΩ IND_14.4X12.8MM_SM

  • 数据手册
  • 价格&库存
SLO1350H150MTT 数据手册
SLO1350H150MTT 1. Features 1. Magnetic metal powder inductor. 2. Compact design. 3. High current,low DCR,high efficiency. 4. Very low acoustic noise and very low leakage flux noise. 5. High reliability. 6. 100% Lead(Pb)-Free and RoHS compliant. 2. Dimensions 150 编号 A B C D E 尺寸(mm) 14.40Max. 12.80 0.30 ± 4.00 0.50 ± 5.00Max. 0 0.15 ~ F ± 2.50 0.50 3. Recommend Land Pattern Dimensions(推荐焊盘) (推荐焊盘) A B C 4.50 3.40 14.10 Unit : mm Rev.01 Page 1 of 7 www.Sunltech.com SLO1350H150MTT 4.Specifications DCR ( mΩ) L0 Inductance Part Number ( µH ) @ (0A) SLO1350H150MTT 15 Typ. Max 26 32 NOTES: 1. Idc : DC current (A) that will cause an approximate Heat Rating Current Saturation Current DC Amps. Idc ( A ) DC Amps. Isat ( A ) 5 9 △T of 40℃, 2. 2. Isat : DC current (A) that will cause Lo to drop approximately 35% ℃ ambient 4. Operating Temperature Range -55℃ to +125℃ 3. All test data is referenced to 25 5. The part temperature (ambient + temp rise) should not exceed 125 ℃under the worst operating conditions. Circuit design, component placement, PWB trace size and thickness, airflow and other cooling provisions all affect the part temperature. Part temperature should be verified in the end application. 6. TEST FREQUENCY:100KHz,1.0V 7. TESTING INSTRUMENT L :Agilent4284A,WK4235,CH3302/G LCR METER CH1320,CH1320S BIAS CURRENT SOURCE Rdc :CH502BC MICRO OHMMETER Rev.01 Page 2 of 7 www.Sunltech.com SLO1350H150MTT 5. TEST REPORT TEST REPORT L0A 15uH ±20% 14.71 14.65 14.44 14.39 14.69 15.01 15.12 14.77 14.81 14.91 Specification Tolerance 1 2 3 4 5 6 7 8 9 10 X Specification Tolerance 1 2 3 4 5 6 7 8 9 10 X Rev.01 Electrical Characteristic Item DCR 32mΩ Max 14.750 A B 14.3 12.8 Max (mm) 25.91 25.94 25.91 25.92 25.92 25.93 26.01 25.94 26.02 25.93 25.943 External Dimensions Item C 5Amps △T≦40℃ I sat 9Amps L≧65% 39.4℃ 75.31% I rms D F 4.0 5.0 2.5 ± 0.3(mm) ± 0.5(mm) Max (mm) ± 0.5(mm) 14.10 12.75 4.03 4.79 2.64 14.09 12.75 4.03 4.81 2.61 14.11 12.75 4.04 4.81 2.59 14.04 12.75 4.04 4.82 2.62 14.06 12.74 4.03 4.81 2.56 14.08 12.75 4.05 4.84 2.61 14.04 12.74 4.03 4.75 2.61 14.08 12.74 4.05 4.79 2.55 14.06 12.74 4.03 2.62 14.08 12.75 4.06 4.76 4.79 14.074 12.746 4.039 4.797 2.604 Page 3 of 7 2.63 www.Sunltech.com SLO1350H150MTT 6. INDUCTANCE VS DC CURRENT 7.TEMPERATURE RISE VS DC CURRENT Rev.01 Page 4 of 7 www.Sunltech.com SLO1350H150MTT 8. Reliability and Test Condition Item Performance Test Condition ℃ -10~+40℃,50~60%RH (Product without taping) Operating temperature -40~+125 Storage temperature Electrical Performance Test HP4284A,CH11025,CH3302,CH1320,CH1320S Inductance Refer to standard electrical characteristics list. DCR CH16502,Agilent33420A Micro-Ohm Meter. Saturation Current (Isat) △L30% typical. Saturation DC Current (Isat) will cause L0 to drop L(%)(keep quickly). △ Heat Rated Current (Irms) Heat Rated Current (Irms) Heat Rated Current (Irms) will cause the coil Approximately △T≦40℃ △T(℃) without core loss. temperature rise Reliability Test ℃ Temperature:125±2 . Duration:1000±12hrs . High Temperature Exposure Test ℃ Low Temperature Life Test Temperature:-40±2 Low Temperature Life Test . Humidity:85±3%RH. Temperature:85±2 . Duration:1000±12hr s. ℃ Biased Humidity Test Condition for 1 cycle Step1:-40+0 / -2 Thermal shock test Electric specifications should be satisfied ℃ 15±1 min. Step2:Room temperature within ℃ ≦0.2 min. Step3:+125+2 / -0 Frequency: 10-2000-10Hz for15±1min. 20 min. Amplitude: Parts mounted within 2" from any secure Vibration test point. Directions and times: X, Y, Z directions for 20 min. Reflow test Reflow test Solder test Terminals should be covered by over 95% solder on visual inspection Solder test Terminals should be covered by over 95% solder on visual inspection Rev.01 Page 5 of 7 : ±℃ : : ± ℃, , ± ℃, ± Pre-heat 150 5 Duration 5 minutes 20~40 Temperature 260 5 seconds (IPC/JEDEC J-STD-020C) After dip into flux dip into solder 235 5 4 1seconds Flux solder for lead free (ANSI /J-STD-002C Method B) 、 www.Sunltech.com SLO1350H150MTT 9. SOLDERING CONDITION RECOMMENDED 回流焊 9.1 器件焊接方式: 9.1.1 回流焊焊接方式及推荐炉温曲线 9.1.2 高温耐热性描述(在 265℃的熔融铅料中,停留时间不少于 10 秒,3 次最少,无 质量问题。) O 9.1.3 返修温度和时间 (温度:400 C;时间:不少于 5 秒。) 9.1.4 焊接次数 (元器件能承受的焊接次数不少于 3 次。) Rev.01 Page 6 of 7 www.Sunltech.com SLO1350H150MTT 10. Packaging Information F TYPE A B A B C D E F C D 24mm 330 100 21.0 ±0.8 + 0 .5 13 − 0.2 16±0.3 26.4 E Q’TY (PCS) A0 B0 KO W P T 400 14.3±0.1 12.9±0.1 ±0.1 5.2±0.1 24.0±0.3 16.0±0.1 .0±0.1 0.40±0.05 101 一卷包装:500Pcs; ①一卷包装 ② 小箱装两卷:一共 1000Pcs; 00Pcs; ③ 大箱装三小箱: 大箱装三小箱 一共 3000Pcs. 00Pcs. Rev.01 Page 7 of 7 www.Sunltech.com
SLO1350H150MTT 价格&库存

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SLO1350H150MTT
  •  国内价格
  • 1+1.76800
  • 30+1.70300
  • 100+1.57300
  • 500+1.44300
  • 1000+1.37800

库存:298