ESD9N5BM
ESD9N5BM
1-Line, Bi-directional, Ultra-low Capacitance,
http//:www.sh-willsemi.com
Transient Voltage Suppressors
Descriptions
The ESD9N5BM is a transient voltage suppressors (TVS)
which provide a very high level protection for sensitive
electronic components that may be subjected to
electrostatic discharge (ESD). It is designed to replace
DFN1006-2L (Bottom View)
multiplayer varistors (MLV) in consumer equipments
applications such as mobile phone, notebook, PAD, STB,
LCD TV etc.
The ESD9N5BM was past ESD transient voltage up to
Pin1
±8KV (contact) according to IEC61000-4-2 and withstand
Pin2
peak current up to 2.5A for 8/20μs pulse according to
IEC61000-4-5.
Circuit Diagram
The ESD9N5BM is available in DFN1006 package.
Standard products are Pb-free and Halogen-free.
Features
Reverse stand-off voltage: ±5.0V max.
Transient protection for each line according to
IEC61000-4-2 (ESD)
: ±8kV (contact discharge)
: ±15kV (air discharge)
IEC61000-4-4 (EFT)
* .U
Pin1
Pin2
*
= Month (A~Z)
.U
= Device code
Marking (Top View)
:40A (5/50ns)
IEC61000-4-5 (surge) :2.5A (8/20μs)
Ultra-low capacitance
Low clamping voltage
Low leakage current
Small package
Order information
Device
Package
Shipping
ESD9N5BM-2/TR
DFN1006-2L
10000/Tape&Reel
Applications
Mobile phone
PAD
Notebook
STB
LCD TV
Digital camera
Other electronic equipment
Will Semiconductor Ltd.
1
Revision 1.3, 2016/01/21
ESD9N5BM
Absolute maximum ratings
Parameter
Symbol
Rating
Unit
Peak pulse power (tp=8/20μs)
Ppk
40
W
Peak pulse current (tp=8/20μs)
Ipp
2.5
A
ESD voltage IEC61000-4-2 air
±15
VESD
KV
ESD voltage IEC61000-4-2 contact
±8
TJ
125
o
Operating temperature
TOP
-40~85
o
Lead temperature
TL
260
o
TSTG
-55~150
o
Junction temperature
Storage temperature
C
C
C
C
Electronics characteristics (Ta=25 oC, unless otherwise noted)
Parameter
Symbol
Reverse stand-off voltage
VRWM
Reverse leakage current
IR
Reverse breakdown voltage
Condition
VBR
IT = 1mA
VCL
VESD = 8kV
Clamping voltage 2)
VC
Junction capacitance
CJ
Typ.
VRWM = 5V
1)
Clamping voltage
Min.
7.0
8.5
Max.
Unit
±5.0
V
1.0
μA
10.0
V
26
V
Ipp=1A tp=8/20μs
13
V
Ipp=2.5A tp=8/20μs
16
V
1.5
pF
F=1MHz, VR=0V
1.0
Notes:
1)
Contact discharge mode, according to IEC61000-4-2.
2)
Non-repetitive current pulse, according to IEC61000-4-5.
Will Semiconductor Ltd.
2
Revision 1.3, 2016/01/21
ESD9N5BM
o
100
90
Front time: T1= 1.25 T = 8μs
100
90
Time to half-value: T2= 20μs
Current (%)
Peak pulse current (%)
Typical characteristics (Ta=25 C, unless otherwise noted)
50
T2
10
0
0
10
T5
10
T1
15
Time (μs)
20
25
tr = 0.7~1ns
8/20μs waveform per IEC61000-4-5
16
12
8
1.5
2.0
1.4
C - Junction capacitance (pF)
VC - Clamping voltage (V)
Pulse waveform: tp=8/20μs
1.0
Time (ns)
Contact discharge current waveform per IEC61000-4-2
20
4
0.5
t
60ns
30ns
30
2.5
f = 1MHz
VAC = 50mV
1.2
1.0
0.8
0.6
3.0
0
1
Ipp - Peak pulse current (A)
2
3
4
5
VR - Reverse voltage (V)
Clamping voltage vs. Peak pulse current
Capacitance vs. Reverse voltage
1000
% of Rated power
Peak Pulse Power (W)
100
100
10
80
60
40
20
1
0
1
10
100
Pulse Duration(μs)
1000
25
50
75
100
125
150
o
TA - Ambient temperature ( C)
Non-repetitive peak pulse power vs. Pulse time
Will Semiconductor Ltd.
0
Power derating vs. Ambient temperature
3
Revision 1.3, 2016/01/21
ESD9N5BM
o
Typical characteristics (Ta=25 C, unless otherwise noted)
10V/div
10V/div
20ns/div
20ns/div
ESD clamping
ESD clamping
(+8kV contact discharge per IEC61000-4-2)
Will Semiconductor Ltd.
(-8kV contact discharge per IEC61000-4-2)
4
Revision 1.3, 2016/01/21
ESD9N5BM
Package outline dimensions
DFN1006-2L
b
CATHODE MARKING
(Ⅰ)
L
E
(Ⅱ)
D
e
Top View
Bottom View
(Ⅲ)
(Ⅰ)
A
(Ⅱ)
A3
A1
Side View
Symbol
Min.
Typ.
Max.
A
0.30
-
0. 50
A1
0.00
-
0.05
A3
Recommend land pattern (Unit: mm)
0.55
0.125 REF.
D
0.95
1.00
1.05
E
0.55
0.60
0.65
b
0.20
0.25
0.30
L
0.45
0.50
0.55
e
0.60
0.30
Dimensions In Millimeters
0.65 Typ.
Notes:
0.85
This recommended land pattern is for reference
purposes only. Please consult your manufacturing
1.40
Will Semiconductor Ltd.
group to ensure your PCB design guidelines are met.
5
Revision 1.3, 2016/01/21
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