SS22 THRU SS2200
Forward Current - 2.0 Ampere
Reverse Voltage - 20 to 200 Volts
SURFACE MOUNT SCHOTTKY BARRIER RECTIFIER
Features
DO-214AC/SMA
The plastic package carries Underwriters Laboratory
Flammability Classification 94V-0
For surface mounted applications
Metal silicon junction,majority carrier conduction
Low power loss,high efficiency
0.110(2.80)
0.090(2.30)
0.067 (1.70)
0.051 (1.30)
Built-in strain relief,ideal for automated placement
High forward surge current capability
High temperature soldering guaranteed:
0.177(4.50)
0.150(3.80)
0.012(0.305)
0.006(0.152)
250 °C/10 seconds at terminals
0.097(2.45)
0.073(1.85)
0.061(1.55)
0.029(0.75)
0.008(0.20)
0.002(0.05)
Mechanical Data
0.209(5.30)
0.184(4.70)
Case: JEDEC DO-214AC/SMA molded plastic body
Terminals: Solderable per MIL-STD-750,Method 2026
Polarity: Color band denotes cathode end Mounting
Position: Any
Weight : 0.0021ounce, 0.06grams
Dimensions in inches and (millimeters)
Maximum Ratings And Electrical Characteristics
Ratings at 25 C ambient temperature unless otherwise specified.
Single phase half-wave 60Hz,resistive or inductive load,for capacitive load current derate by 20%.
Parameter
SYMBOLS
Marking Code
Maximum repetitive peak reverse voltage
VRMM
Maximum RMS voltage
Maximum DC blocking voltage
VRMS
VDC
MDD
SS22
MDD
SS23
MDD
SS24
MDD
SS25
MDD
SS26
MDD
SS28
MDD
SS210
MDD
SS2150
MDD
SS2200
UNITS
20
14
20
30
21
30
40
28
40
50
35
50
60
42
60
80
56
80
100
70
100
150
105
150
200
140
200
V
V
V
Maximum average forward rectified current
I(AV)
2.0
A
Peak forward surge current
8.3ms single half sine-wave
superimposed onrated load (JEDEC Method)
IFSM
50
A
Maximum instantaneous forward voltage at 2.0A
VF
Maximum DC reverse current
at rated DCblocking voltage
TA=25℃
TA=100℃
Typical junction capacitance (NOTE 1)
0.55
IR
CJ
RJA
220
Typical thermal resistance (NOTE 2)
Operating junction temperature range
TJ
-55 to +125
Storage temperature range
TSTG
0.70
0.85
0.5
5
0.95
0.3
3
mA
pF
80
80.0
℃/W
-55 to +150
℃
-55 to +150
℃
Note:1.Measured at 1MHz and applied reverse voltage of 4.0V D.C.
2.P.C.B. mounted with 2.0"x2.0”(5.0x5.0cm) copper pad areas
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Rev:2025A5
Page :1
SS22 THRU SS2200
Reverse Voltage - 20 to 200 Volts
Forward Current - 2.0 Ampere
Typical Characterisitics
Fig.2 Typical Reverse Characteristics
3.0
SS22~SS24
SS25~SS2200
2.5
Average Forward Current (A)
Instaneous Reverse C urrent ( μ A)
Fig.1 Forward Current Derating Curve
2.0
1.5
1.0
0.5
0.0
Single phase half-wave 60 Hz
resistive or inductive load
25
50
75
100
125
150
10
4
10
3
10
2
TJ=100°C
TJ=75°C
SS22~SS26
SS28~SS2200
101
TJ=25°C
10
0
0
Case Temperature (°C)
20
40
60
80
100
Percent of Rated Peak Reverse Voltage（%）
Fig.3 Typical Forward Characteristic
Fig.4 Typical Junction Capacitance
500
20
TJ=25°C
200
1.0
Junction Capacitance (pF)
Instaneous Forward Current (A)
10
SS22-SS24
SS25~SS26
SS28~SS210
SS2150~SS2200
0.1
0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
100
50
SS22~SS24
20
SS25~SS2200
10
0.1
Fig.5 Maximum Non-Repetitive Peak
Forward Surage Current
100
100
50
40
30
20
10
8.3 ms Single Half Sine Wave (JEDEC
Method)
1
10
Number of Cycles at 60Hz
100
Transient Thermal Impedance（°C/W）
Peak Forward Surage Current (A)
10
Fig.6- Typical Transient Thermal Impedance
60
00
1
Reverse Voltage (V)
Instaneous Forward Voltage (V)
10
1
0.01
0.1
1
10
100
t, Pulse Duration（sec）
The curve above is for reference only.
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Rev:2025A5
Page :2
SS22 THRU SS2200
Reverse Voltage - 20 to 200 Volts
Forward Current - 2.0 Ampere
Packing information
unit:mm
P0
Item
P1
Symbol
Tolerance
SMA
A
B
C
d
D
D1
D
D1
D2
E
F
P
P0
P1
T
W
W1
0.1
0.1
0.1
0.05
2.0
min
2.0
min
0.5
0.1
0.1
0.1
0.1
0.1
0.1
0.3
1.0
2.80
5.33
2.36
1.50
330.00
50.00
178.00
62.00
13.00
1.75
5.50
4.00
4.00
2.00
0.28
12.00
18.00
d
E
F
B
A
W
P
D2
T
D1
C
W1
D
Carrier width
Carrier length
Carrier depth
Sprocket hole
13" Reel outside diameter
13" Reel inner diameter
7" Reel outside diameter
7" Reel inner diameter
Feed hole diameter
Sprocket hole position
Punch hole position
Punch hole pitch
Sprocket hole pitch
Embossment center
Overall tape thickness
Tape width
Reel width
Note:Devices are packed in accor dance with EIA standar RS-481-A and specifications listed above.
Reel packing
PACKAGE
S MA
REEL SIZE
REEL
(pcs)
COMPONENT
SPACING
(m/ m)
BOX
(p cs)
IN NER BOX
(m/m)
REEL DIA,
(m/m)
CARTON SIZ E
(m/m)
13"
5,000
4. 0
1 0,000
340* 350*40
330
370*370* 370
CARTON
(p cs)
80, 000
Suggested Pad Layout
Symbol
A
Unit (mm)
1.68
Unit (inch)
0.066
B
1.52
0.060
C
3.93
0.154
D
2.41
0.095
E
5.45
0.215
Important Notice and Disclaimer
Microdiode Electronics (Shenzhen) reserves the right to make changes to this document and its products and specifications
at any time without notice. Customers should obtain and confirm the latest product information and specifications before final
design,purchase or use.
Microdiode Electronics (Shenzhen) makes no warranty, representation or guarantee regarding the suitability of its products
for any particular purpose, not does Microdiode Electronics (Shenzhen) assume any liability for application assistance or
customer product design. Microdiode Electronics (Shenzhen) does not warrant or accept any liability with products which are
purchased or used for any unintended or unauthorized application.
No license is granted by implication or otherwise under any intellectual property rights of Microdiode Electronics (Shenzhen).
Microdiode Electronics (Shenzhen) products are not authorized for use as critical components in life support devices or
systems without express written approval of Microdiode Electronics (Shenzhen).
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Rev:2025A5
Page :3
