RY2334AT6

RY2334 30V High Side Over Voltage Protector Features • • • • 30V standoff voltage Fixed 6.0V protection voltage Integrated OTP Environment Temperature: -40℃~85℃ • • • • Maximum load Current 2A Typical equivalent on-resistance 110mΩ Input OVP with 0.1us reaction time SOT-23-3, SOT23-6 package • • Car Camera Cellphone Applications • • All electronic devices with input DC power plug E-Cigarette General Description RY2334 is a high voltage 30V over voltage protector (OVP) which has a low on resistance, by only change the external connecting. It can be used as an OVP device or a high voltage switch. RY2334 consists of a charge pump, a configurable power MOSFET, a voltage reference, a gate driver and some logics and protection modules. RY2334 can react to an input surge very fast and shut off the switch in less than 0.1us. RY2334 is available in SOT-23-3, SOT23-6 package. Typical Application Circuit VOUT VIN OUT IN COUT 10μF CIN 10μF GND RY2334 fixed version application circuit Email: support@rychip.com ©RYCHIP Semiconductor Inc. http://www.rychip.com Page 1 / 7 RY2334 30V High Side Over Voltage Protector Pin Description Pin Configuration TOP VIEW GND TOP VIEW 1 2 VIN OUT 3 GND 1 6 GND GND 2 5 GND VIN 3 4 OUT SOT23-3 SOT23-6 RY2334AT3 Top Marking: mAYLL [ device code: mA, Y=year code, LL= lot number code) RY2334AT6 Top Marking: mBYLL [ device code: mB, Y=year code, LL= lot number code) Pin Description SOT23-3 Pin No. SOT23-6 Pin No. Name 2 4 OUT Output voltage (VOUT) pin for the regulator 3 3 VIN Input voltage (VIN) pin for the regulator. 1 1/2/5/6 GND Ground pin Function Order Information (1) Marking Part No. Model Description Package T/R Qty mAYLL 70702302 RY2334AT3 RY2334AT3 OVP IC, VIN 2.5-30V, OVP SOT23-3 fixed 6.0V, 2A, SOT23-3 3000PCS mBYLL 70702301 RY2334AT6 RY2334AT6 OVP IC, VIN 2.5-30V, OVP SOT23-6 fixed 6.0V, 2A, SOT23-6 3000PCS Note (1): All RYCHIP parts are Pb-Free and adhere to the RoHS directive. Email: support@rychip.com ©RYCHIP Semiconductor Inc. http://www.rychip.com Page 2 / 7 RY2334 30V High Side Over Voltage Protector Specifications Absolute Maximum Ratings (1) (2) Item Maximum VIN voltage Power dissipation (3) Min Max Unit -0.3 30 V 150 °C 150 °C 260 °C Internally Limited Operating junction temperature, TJ(MAX) Storage temperature, Tstg –65 Lead Temperature (Soldering, 10sec.) Note (1): Exceeding these ratings may damage the device. Note (2): The device is not guaranteed to function outside of its operating conditions. Note (3): The maximum allowable power dissipation is a function of the maximum junction temperature, TJ(MAX), the junction-to-ambient thermal resistance, RθJA, and the ambient temperature, TA. The maximum allowable power dissipation at any ambient temperature is calculated using: PD (MAX) = (TJ(MAX) − TA)/RθJA. Exceeding the maximum allowable power dissipation causes excessive die temperature, and the regulator goes into thermal shutdown. Internal thermal shutdown circuitry protects the device from permanent damage. Thermal shutdown engages at TJ=160°C (typical) and disengages at TJ= 130°C (typical). ESD Ratings Item Description Value Unit V(ESD-HBM) Human Body Model (HBM) ANSI/ESDA/JEDEC JS-001-2014 Classification, Class: 2 ±2000 V V(ESD-CDM) Charged Device Mode (CDM) ANSI/ESDA/JEDEC JS-002-2014 Classification, Class: C0b ±200 V ILATCH-UP JEDEC STANDARD NO.78E APRIL 2016 Temperature Classification, Class: I ±150 mA Min Max Unit -40 125 °C Operating temperature range -40 85 °C Input voltage VIN 2.5 6 V Recommended Operating Conditions Item Operating junction temperature (1) Note (1): All limits specified at room temperature (TA = 25°C) unless otherwise specified. All room temperature limits are 100% production tested. All limits at temperature extremes are ensured through correlation using standard Statistical Quality Control (SQC) methods. All limits are used to calculate Average Outgoing Quality Level (AOQL). Email: support@rychip.com ©RYCHIP Semiconductor Inc. http://www.rychip.com Page 3 / 7 RY2334 30V High Side Over Voltage Protector Thermal Information Item Description SOT23 3 Pin SOT23 6 Pin Unit RθJA Junction-to-ambient thermal resistance (1)(2) 208 180 °C/W RθJC(top) Junction-to-case (top) thermal resistance 112 130 °C/W RθJB Junction-to-board thermal resistance 56 45 °C/W ψJT Junction-to-top characterization parameter 9.2 35 °C/W ψJB Junction-to-board characterization parameter 52 45 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance N/A N/A °C/W Note (1): The package thermal impedance is calculated in accordance to JESD 51-7. Note (2): Thermal Resistances were simulated on a 4-layer, JEDEC board Electrical Characteristics VIN =5V, TA=25℃, unless otherwise noted. Parameter Test Conditions Input Voltage UVLO Min Typ. 2.5 Hys=260mV OVP OVP Range VCC=5V, Iout=1A Iq Units 5.9 V 2.4 V 6.0 V 30 2.5 Ron Max V 110 mΩ Standby current, IN and Vcc < OVP voltage 150 uA Isd Shutdown current 10 μA Thermal Shutdown Rising, Hys=50℃ 135 ℃ Email: support@rychip.com ©RYCHIP Semiconductor Inc. - http://www.rychip.com Page 4 / 7 RY2334 30V High Side Over Voltage Protector Block Diagram OUT VIN Charge Pump Gate Driver Logic Vref GND RY2334 Block Diagram Detailed Description RY2334 can disconnect the systems from its output pin (OUT) in case wrong input operating conditions are detected. The system is positive overvoltage protected up to 30V. The internal OVLO is 6.0V. RY2334 also has internal over temperature protect (OTP) function and it can monitor chip temperature to protect the device. Email: support@rychip.com ©RYCHIP Semiconductor Inc. http://www.rychip.com Page 5 / 7 RY2334 30V High Side Over Voltage Protector Package Description SOT23-3 1.90 BSC 2.80 3.00 0.60 TYP 1.20 TYP AAAAA 1.50 2.60 1.70 3.00 2.60 TYP PIN 1 TOP VIEW RECOMMENDED PAD LAYOUT 1.90 BSC GAUGE PLANE 0.25 BSC 0.90 1. 30 1.45 MAX SEATING PLANE 0.30 0.50 0.00 0.15 FRONT VIEW 0°~8° 0.30 0.55 0.09 0.20 SIDE VIEW NOTE: 1. CONTRO L DI MENSION IS IN INCHES. DIMENSION I N BRACKET IS IN MILLIMETERS. 2. PACKAG E LENGTH DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. 3. PACKAG E WIDTH DO ES NOT INCLUDE I NTERLEAD FLASH OR PROTRUSIONS. 4. LEAD COPLANARITY (BO TTO M O F LEADS AFTER FORMING) SHALL BE 0. 004" INCHES MAX. 5. DRAWING CONFORMS TO JEDEC MS-012, VARIATION BA. 6. DRAWING IS NOT TO SCALE. Email: support@rychip.com ©RYCHIP Semiconductor Inc. http://www.rychip.com Page 6 / 7 RY2334 30V High Side Over Voltage Protector Package Description SOT23-6 2.80 3.00 0.95 BSC 0.60 TYP 1.20 TYP EXAMPLE TOP MARK AAAAA 1.50 2.60 1.70 3.00 2.60 TYP PIN 1 TOP VIEW RECOMMENDED PAD LAYOUT GAUGE PLANE 0.25 BSC 0.90 1. 30 1.45 MAX SEATING PLANE 0.30 0.50 0.95 BSC FRONT VIEW 0.00 0.15 0°~8° 0.30 0.55 0.09 0.20 SIDE VIEW NOTE: 1. CONTRO L DI MENSION IS IN INCHES. DIMENSION I N BRACKET IS IN MILLIMETERS. 2. PACKAG E LENGTH DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. 3. PACKAG E WIDTH DO ES NOT INCLUDE I NTERLEAD FLASH OR PROTRUSIONS. 4. LEAD COPLANARITY (BO TTO M O F LEADS AFTER FORMING) SHALL BE 0. 004" INCHES MAX. 5. DRAWING CONFORMS TO JEDEC MS-012, VARIATION BA. 6. DRAWING IS NOT TO SCALE. Email: support@rychip.com ©RYCHIP Semiconductor Inc. http://www.rychip.com Page 7 / 7