UAD8C03L01

UAD8C03L01 ElectroStatic Discharged Protection Devices (ESD) Data Sheet Description The UAD8C03L01 includes back-to-back TVS diodes fabricated in a proprietary silicon avalanche technology to provide protection for electronic equipment that may experience destructive electrostatic discharge (ESD). These robust diodes can safely absorb repetitive ESD strikes up to the maximum level specified in the IEC61000-4-2 international standard without performance degradation. The back-to-back configuration provides symmetrical ESD protection for data lines when AC signals are present. Features ● ● ● ● ● ● ● ● ● IEC61000-4-2 ESD 15KV Air, 8KV contact compliance SOD882 surface mount package Working voltage: 3V Low leakage current Low operating and clamping voltages Lead Free/RoHS compliant Flammability rating UL 94V-0 Meets MSL level 1, per J-STD-020 Marking: A1 Applications ● ● ● ● ● ● ● ● Pin Configuration USB 3.0/USB 2.0 MHL/MIPI/MDDI HDMI, Video Port, eSATA Set Top Boxes, Game Consoles Smart Phones External Storage Ultrabooks, Notebooks Tablets, eReaders Maximum Ratings Rating Peak pulse current (tp=8/20μs) ESD voltage (Contact discharge) ESD voltage (Air discharge) Lead soldering temperature Storage & operating temperature range Revision 02-Jun -17 Symbol Value Unit IPP 3 A VESD ±8 ±15 kV TL 260 ℃ TSTG ,TJ -50~+150 ℃ www.brightking.com UAD8C03L01 Electrical Characteristics (TJ=25℃) Parameter Reverse stand-off voltage Reverse breakdown voltage Symbol Condition Min. Typ. VRWM Max. Unit 3 V VBR IBR=1mA 6 V Reverse leakage current IR VR=3V 1 μA Clamping voltage (tp=8/20μs) VC IPP=1A 9.2 V Clamping voltage (tp=8/20μs) VC IPP=3A 10.0 V Off state junction capacitance CJ 0Vdc,f=1MHz 0.5 pF Typical Characteristics Curves Figure 1. Capacitance vs. Bias Voltage Figure 2. Insertion Loss (S21) I/O to GND 5 0 -5 -10 -15 -20 -25 -30 -35 -40 100 1000 Frequency (MHz) Figure 4. Transmission Line Pulsing (TLP) Plot % of Peak Power Current Figure 3. Pulse Waveform 10 Revision 02-Jun -17 www.brightking.com UAD8C03L01 Recommended Soldering Conditions Reflow Soldering Recommended Conditions Profile Feature Pb-Free Assembly Average ramp-up rate (TL to TP) 3℃/second max. Preheat -Temperature Min (TS min) -Temperature Max (TS max) -Time (min to max) (ts) 150℃ 200℃ 60-180 seconds TS max to TL -Ramp-up Rate 3℃/second max. Time maintained above: -Temperature (TL) -Time (tL) 217℃ 60-150 seconds Peak Temperature (TP) 260℃ Time within 5℃ of actual Peak Temperature (tP) Ramp-down Rate Time 25℃ to Peak Temperature Revision 02-Jun -17 20-40 seconds 6℃/second max. 8 minutes max. www.brightking.com UAD8C03L01 Dimensions (SOD882) Dimension (mm) Symbol Millimeters Inches Min. Max. Min. Max. A 0.95 1.05 0.037 0.041 B 0.55 0.65 0.022 0.026 C 0.32 0.55 0.013 0.022 D 0.45 0.018 E 0.20 0.30 0.008 0.012 F 0.45 0.55 0.018 0.022 Packaging Tape Symbol Dimension (mm) W 8.00±0.30 P0 4.00±0.10 P1 2.00±0.10 P2 2.00±0.10 D0 Φ1.55±0.10 D1 Φ0.40±0.05 E 1.75±0.10 F 3.50±0.10 A 0.75±0.10 B 1.15±0.10 K 0.60±0.05 t 0.20±0.05 D Φ178.0±2.0 D2 Φ13.00. W1 9.50 Reel D2 D Revision 02-Jun -17 W1 Quantity: 10000PCS www.brightking.com