UCD32C05L01
Electrostatic Discharged Protection Devices (ESD) Data Sheet
Description
The UCD32C05L01 is an ultra low capacitance TVS array designed to protect
high speed data interfaces. This series has been specifically designed
to protect sensitive components which are connected to data an trans-mission lines from overvoltage caused by electrostatic discharge (ESD),
cable discharge events (CDE) and lightning.
The unique design incorporates surge rated, low capacitance steering
diodes and a TVS diode in a single package. During transient conditions,
the steering diodes direct the transient current to ground. The internal
TVS diode clamps the transient voltage to a safe level. The ultra low
capacitance array configuration allows the user to protect up to the high
speed data lines. These devices are in a signal package, RoHS/WEEE
compliant, SOD-323 package. It measures 2.5×1.25×1.0mm.
The series devices may be used to meet the immunity requirements of
IEC61000-4-2 (ESD), IEC61000-4-4 (EFT) and IEC61000-4-5 (Surge).
Features
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IEC61000-4-2 ESD 30KV Air, 30KV contact compliance
SOD-323 surface mount package
Protects one I/O line
Peak power dissipation of 250W under 8/20μs waveform
Working voltage: 5V
Low leakage current
Low operating and clamping voltages
Solid-state silicon avalanche technology
Lead Free/RoHS compliant
Solder reflow temperature: Pure Tin-Sn, 260~270℃
Flammability rating UL 94V-0
Meets MSL level 1, per J-STD-020
MARKING:BC
Pin Configuration
Applications
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USB 2.0 and USB 3.0 interface
10/100/1000 Ethernet
Personal digital assistants (PDA)
Serial ATA protection
Digital visual interface (DVI)
Revision:15-May -17
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Wireless system devices
Handhelds and notebooks
Digital cameras
RF interface
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UCD32C05L01
Maximum Ratings
Rating
Peak pulse power (tp=8/20μs waveform)
Symbol
Value
Unit
PPP
250
W
ESD voltage (Contact discharge)
±30
VESD
kV
ESD voltage (Air discharge)
±30
Lead soldering temperature
Storage & operating temperature range
TL
260
℃
TSTG ,TJ
-55~+150
℃
Electrical Characteristics (TA=25℃)
Parameter
Reverse stand-off voltage
Reverse breakdown voltage
Symbol
Condition
Min.
Typ.
VRWM
Max.
Unit
5
V
VBR
IBR=1mA
6.0
V
Reverse leakage current
IR
VR=5V
Clamping voltage (tp=8/20μs)
VC
IPP=1A
9.8
V
Clamping voltage (tp=8/20μs)
VC
IPP=12A
15
V
Off state junction capacitance
CJ
0Vdc,f=1MHz
1.5
500
2.0
nA
pF
Typical Characteristics Curves
Figure 1. Power Derating Curve
Revision:15-May -17
Figure 2. Pulse Waveform
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UCD32C05L01
Figure 3. Non-Repetitive Peak Pulse vs Pulse Time
Figure 4. ESD Clamping (8kV Contact IEC61000-4-2)
10000
1000
100
10
0.1
1
100
10
1000
10000
tp-Pulse Duration (μs)
Figure 5. Clamping Voltage vs. Peak Pulse Current
25
20
15
10
Waveform
Parameters:
tr=8µs
tb=20µs
5
0
0
3
6
9
12
15
18
IPP-Peak Pulse Current (A)
Revision:15-May -17
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UCD32C05L01
Recommended Soldering Conditions
Reflow Soldering
Recommended Condition
Profile Feature
Pb-Free Assembly
Average ramp-up rate (TL to TP)
3℃/second max.
Preheat
-Temperature Min (TS min)
-Temperature Max (TS max)
-Time (min to max) (ts)
150℃
200℃
60-180 seconds
TS max to TL
-Ramp-up Rate
3℃/second max.
Time maintained above:
-Temperature (TL)
-Time (tL)
217℃
60-150 seconds
Peak Temperature (TP)
260℃
Time within 5℃ of actual Peak Temperature (tP)
Ramp-down Rate
Time 25℃ to Peak Temperature
Revision:15-May -17
20-40 seconds
6℃/second max.
8 minutes max.
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UCD32C05L01
Dimensions (SOD-323)
Dimension
Symbol
Millimeters
Inches
Min.
Max.
Min.
Max.
A
0.80
1.10
0.031
0.043
B
-
0.10
-
0.004
C
0.20
-
0.008
-
D
0.11
0.20
0.004
0.008
E
1.15
1.35
0.045
0.053
F
-
0.35
-
0.014
G
1.60
1.80
0.063
0.071
H
2.40
2.60
0.094
0.102
Packaging
Tape
P0
P1
P2
K
F
B0
B
W
E
øD0
A0
øD1
t
A
Reel
D2
D
Revision:15-May -17
W1
Symbol
Dimension (mm)
W
8.00±0.30
P0
4.00±0.10
P1
4.00±0.10
P2
2.00±0.10
D0
Φ1.55±0.10
D1
Φ1.00±0.05
E
1.75±0.10
F
3.50±0.10
A
1.48±0.10
A0
0.80±0.10
B
3.00±0.10
B0
1.80±0.10
K
1.05±0.10
t
0.25±0.05
D
Φ178.0±2.0
D2
Φ13.0
W1
9.5
Quantity: 3000PCS
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