ESD56201DXX
ESD56201DXX
1-Line, Uni-directional, Transient Voltage Suppressor
Descriptions
The ESD56201DXX is a transient voltage suppressor
designed to protect power interfaces. It is suitable to replace
multiple discrete components in portable electronics.
The ESD56201DXX is specifically designed to protect power
lines.
The ESD56201DXX is available in DFN1610-2L package.
DFN1610-2L (Bottom View)
Standard products are Pb-free and Halogen-free.
Features
Pin1
Reverse stand-off voltage: 4.85V ~ 24V
Surge protection according to IEC61000-4-5
see Table 4
Pin2
Circuit diagram
ESD protection according to IEC61000-4-2
±30kV (contact and air discharge)
Low clamping voltage
Solid-state silicon technology
Pin1
Applications
Power supply protection
Power management
x*
Pin2
X= Device code (H I J K L S N M)
* = Month code
Marking (Top View)
Order information
Table 1.
Device
Package
Shipping
Marking
ESD56201D04-2/TR
DFN1610-2L 10000/Tape&Reel
H*
ESD56201D05-2/TR
DFN1610-2L 10000/Tape&Reel
I*
ESD56201D10-2/TR DFN1610-2L 10000/Tape&Reel
J*
ESD56201D12-2/TR DFN1610-2L 10000/Tape&Reel
K*
ESD56201D15-2/TR DFN1610-2L 10000/Tape&Reel
L*
ESD56201D18-2/TR DFN1610-2L 10000/Tape&Reel
S*
ESD56201D20-2/TR DFN1610-2L 10000/Tape&Reel
N*
ESD56201D24-2/TR DFN1610-2L 10000/Tape&Reel
M*
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ESD56201DXX
Absolute maximum ratings
Table 2.
Parameter
Peak pulse power (tp = 8/20μs)
ESD according to IEC61000-4-2 air discharge
Symbol
Rating
Unit
Ppk
1600
W
±30
VESD
ESD according to IEC61000-4-2 contact discharge
±30
kV
TJ
125
oC
Operating temperature
TOP
-40~85
oC
Lead temperature
TL
260
oC
TSTG
-55~150
oC
Junction temperature
Storage temperature
Electrical characteristics (TA = 25oC, unless otherwise noted)
I
IPP
VF
Forward voltage
VRWM Reverse stand-off voltage
IF
Forward current
IR
Reverse leakage current
VFC
Forward clamping voltage
VBR
Reverse breakdown voltage
IPP
Peak pulse current
VCL
Clamping voltage
IPP
Peak pulse current
VFC VF
IBR
IR
VRWM VBR VCL
V
IF
IPP
Definitions of electrical characteristics
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ESD56201DXX
Electrical characteristics (TA = 25oC, unless otherwise noted)
Table 3.
Reverse
Stand-off
Voltage
Type number
Breakdown voltage
VBR(V)
IBR = 1mA
VRWM (V)
Junction
Reverse
leakage current
IRM(μA) at VRWM
Forward voltage
capacitance
VF(V) IF = 20mA
F = 1MHz,
VR=0V (pF)
Max.
Min.
Typ.
Max.
Type.
Max.
Min.
Max.
Typ.
Max.
ESD56201D04
4.85
5.2
5.7
6.2
-
5.0
0.45
1.25
1100
1300
ESD56201D05
5.0
6.6
7.1
7.6
-
2.0
0.45
1.25
1050
1250
ESD56201D10
10.0
10.7
11.3
12.3
-
0.1
0.45
1.25
545
650
ESD56201D12
12.0
12.7
13.7
14.6
-
0.1
0.45
1.25
425
510
ESD56201D15
15.0
16.0
17.5
19.0
-
0.1
0.45
1.25
325
350
ESD56201D18
18.0
19.2
21.1
23.0
-
0.1
0.45
1.25
270
300
ESD56201D20
20.0
21.4
23.2
25.0
-
0.1
0.45
1.25
250
275
ESD56201D24
24.0
25.6
27.5
30.0
-
0.1
0.45
1.25
210
250
Table 4.
Rated peak pulse current IPP (A)1)2)
Clamping voltage
VCL(V) at IPP(A)1)2)
Type number
Max.
Typ.
Max.
ESD56201D04
120
10.5
12.0
ESD56201D05
100
11.0
13.0
ESD56201D10
86
17.5
20.0
ESD56201D12
75
19.5
22.0
ESD56201D15
60
27.0
30.0
ESD56201D18
50
32.0
35.0
ESD56201D20
45
35.0
38.0
ESD56201D24
40
39.0
42.0
Notes:
1)
Non-repetitive current pulse, according to IEC61000-4-5. (8/20μs current waveform)
2)
Measured from pin 1 to pin 2.
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ESD56201DXX
100
90
Front time: T1= 1.25 T = 8μs
100
90
Time to half-value: T2= 20μs
Current (%)
Peak pulse current (%)
Electrical characteristics (TA = 25oC, unless otherwise noted)
50
T2
10
10
0
0
T
5
10
T1
15
Time (μs)
20
25
Pulse waveform: tp = 8/20s
10
ESD56201D20
35
ESD56201D18
Peak pulse power (kW)
VC - Clamping voltage (V)
ESD56201D24
30
ESD56201D15
25
ESD56201D12
20
Time (ns)
Contact discharge current waveform per IEC61000-4-2
8/20μs waveform per IEC61000-4-5
40
tr = 0.7~1ns
t
60ns
30ns
30
ESD56201D10
15
ESD56201D05
1
10
ESD56201D04
5
0
50
25
75
100
0.1
125
1
10
100
Pulse time (s)
IPP - Peak pulse current (A)
Clamping voltage vs. Peak pulse current
1000
Non-repetitive peak pulse power vs. Pulse time
2400
IR -Leakage current (nA)
% of Rated power
100
80
60
40
20
0
2000
ESD56201D04
1600
1200
800
ESD56201D05
400
0
0
25
50
75
100
125
150
-20
0
20
40
60
80
o
TA - Ambient temperature ( C)
o
TA - Ambient temperature ( C)
Power derating vs. Ambient temperature
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Leakage current vs. Ambient temperature
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ESD56201DXX
PACKAGE OUTLINE DIMENSIONS
DFN1610-2L
L
h
b
E
D
e
TOP VIEW
h
A3
A1
A
BOTTOM VIEW
SIDE VIEW
Dimensions in Millimeters
Symbol
Min.
Typ.
Max.
A
0.45
0.50
0.55
A1
0.00
0.02
0.05
c
0.15 Ref.
b
0.75
0.80
0.85
L
0.35
0.40
0.45
D
1.55
1.60
1.65
E
0.95
1.00
1.05
e
1.10 BSC
h
0.20 Ref.
Recommended PCB Layout (Unit: mm)
0.625
1.000
0.600
Notes:
This recommended land pattern is for reference
1.225
purposes only. Please consult your manufacturing
1.850
group to ensure your PCB design guidelines are met.
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ESD56201DXX
TAPE AND REEL INFORMATION
Reel Dimensions
RD
Reel Dimensions
W
Tape Dimensions
P1
Quadrant Assignments For PIN1 Orientation In Tape
Q1
Q2
Q1
Q2
Q3
Q4
Q3
Q4
User Direction of Feed
RD
Reel Dimension
7inch
13inch
W
Overall width of the carrier tape
8mm
12mm
16mm
P1
Pitch between successive cavity centers
2mm
4mm
8mm
Pin1 Quadrant
Q1
Q2
Q3
Pin1
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Q4
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