MEM2307XG
P-Channel MOSFET MEM2307XG
General Description
Features
MEM2307XG Series P-channel enhancement
-30V/-4.1A
mode field-effect transistor ,produced with high cell
RDS(ON)<88mΩ@ VGS=-10V,ID=-4.1A
density DMOS trench technology, which is especially
RDS(ON)<108mΩ@ VGS=-4.5V,ID=-3A
used to minimize on-state resistance. This device
High Density Cell Design For Ultra Low On-Resistance
particularly suits low voltage applications, and low
Subminiature surface mount package: SOT23
power dissipation, and low power dissipation in a
very small outline surface mount package.
Pin Configuration
Typical Application
Power management
Load switch
Battery protection
Absolute Maximum Ratings
Parameter
Symbol
Ratings
Unit
Drain-Source Voltage
VDSS
-30V
V
Gate-Source Voltage
VGSS
±20
V
Drain
Current
TA=25℃
TA=70℃
Pulsed Drain Current1,2
Total Power
Dissipation
TA=25℃
TA=70℃
ID
IDM
Pd
-4.1
-3.5
-20
1.4
1
A
A
W
Operating Temperature Range
TOpr
150
℃
Storage Temperature Range
Tstg
-55/150
℃
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MEM2307XG
Thermal Characteristics
Parameter
Symbol
TYP.
MAX.
Unit
Thermal Resistance,
Junction-to-Ambient
t≤10s
RθJA
65
90
℃/W
Thermal Resistance,
Junction-to-Ambient
Steady-State
RθJA
85
125
℃/W
Thermal Resistance,
Junction-to-Lead
Steady-State
RθJL
43
60
℃/W
Electrical Characteristics
Parameter
Symbol
Test Condition
Min
Type
Max
Unit
Static Characteristics
Drain-Source Breakdown Voltage
V(BR)DSS
VGS=0V, ID=-250uA
-30
Gate Threshold Voltage
VGS(th)
VDS= VGS, ID=-250uA
-1
Gate-Body Leakage
IGSS
Zero Gate Voltage Drain Current
Static Drain-Source
On-Resistance
V
-2
V
VDS=0V,VGS=20V
100
nA
VDS=0V,VGS=-20V
-100
nA
IDSS
VDS=-24V VGS=0V
-1000
nA
RDS(ON)1
VGS=-10V,ID=-4.1A
88
mΩ
RDS(ON)2
VGS=-4.5V,ID=-3A
108
mΩ
VDS = –5 V, ID = –4A
Forward Transconductance
gFS
Maximum Body-Diode Continuous
Current
Is
Source-drain (diode forward)
voltage
VSD
5.5
VGS=0V,IS=-1A
-1.3
8.2
S
-2.2
A
0.77
-1.0
V
700
840
Dynamic Characteristics
Input Capacitance
Ciss
Output Capacitance
Coss
Reverse Transfer Capacitance
Crss
Gate resistance
Rg
VGS=0V, VDS=-15V,
f=1MHz
VGS=0V, VDS=0V,
f=1MHz
120
pF
75
10
15
Ω
Switching Characteristics
Turn-On Delay Time
td(on)
Rise Time
tr
Turn-Off Delay Time
td(off)
Fall-Time
tf
Total Gate Charge
Qg
Gate-Source Charge
Qgs
Gate-Drain Charge
Qgd
8.6
VGS=-10V,VDS=-15V,
RL=3.6Ω,RGEN=6Ω
5
28.2
ns
13.5
VDS = -15 V,
VGS = -4.5 V,
ID = -4A
14.3
3.1
nc
3
1、Repetitive rating, pulse width limited by junction temperature.
2、The static characteristics are obtained using 80 µs pulses, duty cycle 0.5% max.
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MEM2307XG
Typical Performance Characteristics
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MEM2307XG
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MEM2307XG
Package Information
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MEM2307XG
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The information described herein is subject to change without notice.
Nanjing Micro One Electronics Inc is not responsible for any problems caused by circuits or diagrams
described herein whose related industrial properties, patents, or other rights belong to third parties.
The application circuit examples explain typical applications of the products, and do not guarantee the
success of any specific mass-production design.
Use of the information described herein for other purposes and/or reproduction or copying without the
express permission of Nanjing Micro One Electronics Inc is strictly prohibited.
The products described herein cannot be used as part of any device or equipment affecting the human
body, such as exercise equipment, medical equipment, security systems, gas equipment, or any
apparatus installed in airplanes and other vehicles, without prior written permission of Nanjing Micro
One Electronics Inc.
Although Nanjing Micro One Electronics Inc exerts the greatest possible effort to ensure high quality
and reliability, the failure or malfunction of semiconductor products may occur. The user of these
products should therefore give thorough consideration to safety design, including redundancy,
fire-prevention measures, and malfunction prevention, to prevent any accidents, fires, or community
damage that may ensue.
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