FCM2012KF-102T05

P1. TAI-TECH Ferrite Chip Bead(Lead Free) FCM2012KF-102T05 1.Features 1. Monolithic inorganic material construction. 2. Closed magnetic circuit avoids crosstalk. 3. S.M.T. type. 4. Suitable for reflow soldering. 5. Shapes and dimensions follow E.I.A. spec. Halogen Pb Halogen-free Pb-free 6. Available in various sizes. 7. Excellent solderability and heat resistance. 8. High reliability. 9. 100% Lead(Pb) & Halogen-Free and RoHS compliant. 2.Dimensions D Chip Size C A A 2.00±0.20 B 1.25±0.20 C 0.85±0.20 D 0.50±0.30 Units: mm B 3.Part Numbering FCM 2012 KF A B C A: Series B: Dimension C: Material D: Impedance E: Packaging F: Rated Current - 102 T 05 D E F LxW Lead Free Material 102=1000Ω T=Taping and Reel, B=Bulk(Bags) 05=500mA 4.Specification Tai-Tech Part Number Impedance (Ω) Test Frequency (Hz) DC Resistance (Ω) max. Rated Current (mA) max. FCM2012KF-102T05 1000±25% 60mV/100M 0.45 500 „ FCM2012KF-102T05 1600 IMPEDANCE(Ohm) Impedance-Frequency Characteristics 1200 Z 800 400 X R 0 1 10 100 FREQUENCY(MHz) www.tai-tech.com.tw 1000 P2. TAI-TECH 5. Reliability and Test Condition Item Series No. Operating Temperature Performance FCB FCM HCB GHB FCA FCI Test Condition FHI FCH HCI MGI -40~+125℃ (Including self-temperature rise) -40~+105℃ (Including self-temperature rise) -40~+125℃ -40~+105℃ Transportation Storage Temperature --Long storage conditions, please see the Application Notice Agilent4291 Impedance (Z) Agilent E4991 Inductance (Ls) Agilent4287 Q Factor Refer to standard electrical characteristics list Agilent16192 DC Resistance Agilent 4338 Rated Current DC Power Supply Over Rated Current requirements, there will be some risk 1. Applied the allowed DC current. 2. Temperature measured by digital surface thermometer. Rated Current < 1A ∆T 20℃Max Temperature Rise Test Rated Current ≧ 1A ∆T 40℃Max Appearance: No significant abnormality. Solder heat Resistance Impedance change: Within ± 30%. Inductance change:：within±10% Preheat: 150℃,60sec. Solder: Sn-Cu0.5 Solder tamperature: 260±5℃ Flux for lead free: ROL0 Dip time: 10±0.5sec. No mechanical damage. Preheating Dipping Natural cooling Remaining terminal electrode:75% min. 260°C 150°C 60 second More than 95% of the terminal Solderability Preheat: 150℃,60sec. Solder: Sn-Cu0.5 Solder tamperature: 245±5℃ Flux for lead free: ROL0 Dip time: 4±1sec. Preheating Dipping Natural cooling 245° C electrode should be covered 150° C with solder. 4±1 second 60 second W The terminal electrode and the dielectric must Terminal strength not be damaged by the forces applied on the right conditions. 10±0.5 second W For FCB FCM HCB GHB FCI FHI FCH HCI MGI: Size Force (Kgf) Time(sec) 1005 0.2 1608 0.5 2012 0.6 3216 1.0 >30 3225 1.0 4516 1.0 4532 1.5 For FCA: Size 3216 Force (Kgf) 0.5 Time(sec) >30 20(.787) Solder a chip on a test substrate, bend the The terminal electrode and the dielectric must Flexture strength not be damaged by the forces applied on the Bending 45(1.772) 45(1.772) right conditions. substrate by 2mm (0.079in)and return. The duration of the applied forces shall be 60 40(1.575) (+ 5) Sec. 100(3.937) R 0.5(0.02) Bending Strength The ferrite should not be damaged by Forces applied on the right condition. Appearance: Cracking, shipping and any other defects harmful to the Random Vibration Test characteristics should not be allowed. Impedance: within±30% www.tai-tech.com.tw Size mm(inches) P-Kgf 1608 2012 FCA3216 3216 3225 0.80(0.033) 1.40(0.055) 2.00(0.079) 0.3 1.0 1.5 2.00(0.079) 2.5 4516 4532 2.70(0.106) 2.5 Frequency: 10-55-10Hz for 15 min. Amplitude: 1.52mm Directions and times: X, Y, Z directions for 15 min.. This cycle shall be performed 12 times in each of three mutually perpendicular directions (Total 9hours). P3. TAI-TECH Item Performance Test Condition Temperature: 125±5℃(bead), 105±5℃(inductor) Applied current: rated current. Duration: 1008±12hrs. Measured at room temperature after placing for 2 to 3hrs. Life testing at High Appearance: no damage. Temperature Impedance: within±30%of initial value. Inductance: within±10%of initial value. Q: within±30%of initial value. (FCI FHI FCH) Q: within±20%of initial value. (HCI MGI ) Humidity Appearance: no damage. Thermal shock Low temperature storage Phase Humidity: 90~95%RH. Temperature: 40±2℃. Temperature: 60±2℃.(HCI MGI) Duration: 504±8hrs. Measured at room temperature after placing for 2 to 3hrs. Temperature(℃) Time(min.) 1 -40±2℃ Impedance: within±30%of initial value. 2 room temp. Inductance: within±10%of initial value. 3 +105±2℃ Q: within±30%of initial value. Measured: 500 times (FCI FHI FCH) Q: within±20%of initial value. (HCI MGI) 30±5 ≦0.5 30±5 Temperature: -40±2℃. Duration: 500±8hrs. Measured at room temperature after placing for 2 to 3hrs. test No mechanical damage Drop 10 times on a concrete floor from a height of 75cm Impedance change: ±30% Drop Condition for 1 cycle Step1: -40±2℃ 30±5 min. Step2: +105±2℃ 30±5min. Number of cycles: 500 Measured at room temperature after placing for 2 to 3 hrs. Inductance change:：within±10% Derating **Derating Curve For the ferrite chip bead which withstanding current over 1.5A, as the operating temperature over 85℃, the derating current information is necessary to consider with. For the detail derating of current, please refer to the Derated Current vs. Operating Temperature curve. Derated Current(A) 6 5 4 3 2 1 6A 5A 4A 3A 2A 1.5A 1A 0 6.Soldering and Mounting 85 125 Operating Temperature(°C) 6-1. Recommended PC Board Pattern Land Patterns For Reflow Soldering Chip Size FCB 0603 0.6±0.03 0.30±0.03 0.30±0.03 0.15±0.05 0.80 0.30 0.30 FCM 1005 1.0±0.10 0.50±0.10 0.50±0.10 0.25±0.10 1.50 0.40 0.55 HCB 1608 1.6±0.15 0.80±0.15 0.80±0.15 0.30±0.20 2.60 0.60 0.80 2.0±0.20 1.25±0.20 0.85±0.20 0.50±0.30 2.0±0.20 1.25±0.20 1.25±0.20 0.50±0.30 3.00 1.00 1.00 GHB 2012 FCI FCA3216 A(mm) B(mm) C(mm) D(mm) L(mm) G(mm) H(mm) FHI 3216 3.2±0.20 1.60±0.20 1.10±0.20 0.50±0.30 4.40 2.20 1.40 FCH 3225 3.2±0.20 2.50±0.20 1.30±0.20 0.50±0.30 4.40 2.20 3.40 HCI 4516 4.5±0.20 1.60±0.20 1.60±0.20 0.50±0.30 5.70 2.70 1.40 MGI 4532 4.5±0.20 3.20±0.20 1.50±0.20 0.50±0.30 5.90 2.57 4.22 Land Solder Resist 2.8 0.8 Type 2.2-2.6 Series 0.8 Pitch 0.4 H L PC board should be designed so that products are not sufficient under mechanical stress as warping the board. Products shall be positioned in the sideway direction against the mechanical stress to prevent failure. G www.tai-tech.com.tw P4. TAI-TECH 6-2. Soldering Mildly activated rosin fluxes are preferred. The minimum amount of solder can lead to damage from the stresses caused by the difference in coefficients of expansion between solder, chip and substrate. The terminations are suitable for re-flow soldering systems. If hand soldering cannot be avoided, the preferred technique is the utilization of hot air soldering tools. Note. If Use Wave soldering is there will be some risk. Re-flow soldering temperatures below 240 degrees, there will be unwitting risk 6-2.1 Lead Free Solder re-flow: Recommended temperature profiles for lead free re-flow soldering in Figure 1. 6-2.2 Soldering Iron: Products attachment with a soldering iron is discouraged due to the inherent process control limitations. In the event that a soldering iron must be employed the following precautions are recommended. for Iron Soldering in Figure 2. •Preheat circuit and products to 150℃ •350℃ tip temperature (max) •Never contact the ceramic with the iron tip •1.0mm tip diameter (max) •Use a 20 watt soldering iron with tip diameter of 1.0mm •Limit soldering time to 4~5sec. Iron Soldering Reflow Soldering PRE-HEATING SOLDERING within 4~5s TEMPERATURE(° C) ( ) TP(260° C / 40s max.) 217 60~150s 200 150 NATURAL COOLING SOLDERING PRE-HEATING NATURAL COOLING 20~40s 60~180s 350 150 Gradual cooling Over 60s 480s max. 25 TIME(sec.) TIME( sec.) Reflow times: 3 times max Fig.1 Iron Soldering times：1 times max Fig.2 6-2.3 Solder Volume: Upper limit Recommendable Accordingly increasing the solder volume, the mechanical stress to product is also increased. Exceeding solder volume may cause the failure of mechanical or electrical performance. Solder shall be used not to be exceed as shown in right side: Minimum fillet height = soldering thickness + 25% product height t 7.Packaging Information 7-1. Reel Dimension A ±0 . .5 13 C B 0 R1 .5 7"x8mm B(mm) C(mm) D(mm) 7”x8mm 9.0±0.5 60±2 13.5±0.5 178±2 7”x12mm 13.5±0.5 60±2 13.5±0.5 178±2 R0.5 120° 7"x12mm 7-2.1 Tape Dimension / 8mm ■Material of taping is paper .0 -0 .1 +0 .5 1 D: F:3.5±0.05 B0 t Size Bo(mm) Ao(mm) Ko(mm) P(mm) t(mm) D1(mm) 0.50max 2.0±0.05 0.50max none Size Bo(mm) Ao(mm) Ko(mm) P(mm) t(mm) D1(mm) 100505 1.12±0.03 0.62±0.03 0.60±0.03 2.0±0.10 0.60±0.03 none 160808 1.85±0.05 1.05±0.05 0.95±0.05 4.0±0.10 0.95±0.05 none 201209 2.30±0.05 1.50±0.05 0.95±0.05 4.0±0.10 0.95±0.05 none 060303 P P0:4±0.1 05 0. 10. + 56 1. D: t B0 P 0.68±0.05 0.38±0.05 Ko A0 A0 W:8.0±0.1 P2:2±0.1 F:3.5±0.1 W:8.0±0.3 E:1.75±0.1 P0:4±0.1 E:1.75±0.1 D R1 .9 A(mm) 5 Type 2±0.5 Ko www.tai-tech.com.tw P5. TAI-TECH ■Material of taping is plastic Po:4±0.1 1 0. 5+ 1. : D t A P ± :1 D1 F:3.5±0.05 A Bo W:8.0±0.1 E:1.75±0.1 P2:2±0.05 Ko 1 0. Ao SECTION A-A Size Bo(mm) Ao(mm) Ko(mm) P(mm) t(mm) D1(mm) 160808 1.95±0.10 1.05±0.10 1.05±0.10 4.0±0.10 0.23±0.05 none 201209 2.25±0.10 1.42±0.10 1.04±0.10 4.0±0.10 0.22±0.05 1.0±0.10 201212 2.35±0.10 1.50±0.10 1.45±0.10 4.0±0.10 0.22±0.05 1.0±0.10 321611 3.50±0.10 1.88±0.10 1.27±0.10 4.0±0.10 0.22±0.05 1.0±0.10 322513 3.42±0.10 2.77±0.10 1.55±0.10 4.0±0.10 0.22±0.05 1.0±0.10 321609 3.40±0.10 1.77±0.10 1.04±0.10 4.0±0.10 0.22±0.05 1.0±0.10 Size Bo(mm) Ao(mm) Ko(mm) P(mm) 7-2.2 Tape Dimension / 12mm 1.75±0.1 Po:4±0.1 P2:2.0±0.05 t D1:1.5±0.1 Bo W:12.0±0.1 5.5±0.05 D:1.5+0.1 t(mm) D1(mm) 451616 4.95±0.1 1.93±0.1 1.93±0.1 4.0±0.1 0.24±0.05 1.5±0.1 453215 4.95±0.1 3.66±0.1 1.85±0.1 8.0±0.1 0.24±0.05 1.5±0.1 Ko P Ao 7-3. Packaging Quantity Chip Size 453215 451616 322513 321611 321609 201212 201209 160808 100505 060303 Chip / Reel 1000 2000 2500 3000 3000 2000 4000 4000 10000 15000 Inner box 4000 8000 12500 15000 15000 10000 20000 20000 50000 75000 Middle box 20000 40000 62500 75000 75000 50000 100000 100000 250000 375000 Carton 40000 80000 125000 150000 150000 100000 200000 200000 500000 750000 Bulk (Bags) 12000 20000 30000 50000 50000 100000 150000 200000 300000 -- 7-4. Tearing Off Force F Top cover tape The force for tearing off cover tape is 15 to 60 grams in the arrow direction under the following conditions. 165° to180° Base tape Room Temp. Room Humidity Room atm Tearing Speed (℃) (%) (hPa) mm/min 5~35 45~85 860~1060 300 Application Notice •Storage Conditions To maintain the solderability of terminal electrodes: 1. TAI-TECH products meet IPC/JEDEC J-STD-020D standard-MSL, level 1. 2. Temperature and humidity conditions: -10~ 40℃ and 30~70% RH. 3. Recommended products should be used within 6 months from the time of delivery. 4. The packaging material should be kept where no chlorine or sulfur exists in the air. •Transportation 1.Products should be handled with care to avoid damage or contamination from perspiration and skin oils. 2. The use of tweezers or vacuum pick up is strongly recommended for individual components. 3. Bulk handling should ensure that abrasion and mechanical shock are minimized. www.tai-tech.com.tw