LAD8C05L01

LAD8C05L01 Electrostatic Discharged Protection Devices (ESD) Data Sheet Description The LAD8C05L01 of Transient Voltage Suppressors are designed to replace multilayer varistors (MLVs) in portable applications such as cell phones, notebook computer, and PDAs. They offer superior electrical characteristics such as lower clamping voltage and no device degradation when compared to MLVs. They are designed to protect sensitive semiconductor components from damage or upset due to electrostatic discharge (ESD), lightning, electrical fast transients (EFT), and cable discharge events (CDE). Features ● ● ● ● ● ● ● ● ● ● ● IEC61000-4-2 ESD 15KV Air, 8KV contact compliance SOD882 surface mount package Working voltage: 5V Low leakage current Low operating and clamping voltages Solid-state silicon avalanche technology RoHS compliant Solder reflow temperature: Pure Tin-Sn, 260~270℃ Flammability rating UL 94V-0 Meets MSL level 1, per J-STD-020 Marking: BB 1 2 Pin Configuration Applications ● Cellular Handsets & Accessories ● Notebooks & Handhelds ● Digital Cameras ● Personal Digital Assistants (PDAs) ● Portable Instrumentation Maximum Ratings Rating Peak Pulse Current(tp=8/20μs) Symbol Value Unit IPP 4 A ESD voltage (Contact discharge) ±8 VESD ESD voltage (Air discharge) Storage & operating temperature range Revision: ESD-LAD8C05L01-001(A1) kV ±15 TSTG ,TJ 1/4 -55~+150 ℃ http://brightking.pulseelectronics.com LAD8C05L01 Electrical Characteristics (TJ=25℃) Parameter Symbol Reverse stand-off voltage Condition Min. Typ. VRWM Reverse breakdown voltage Max. Unit 5 V VBR IBR=1mA 5.5 V Reverse leakage current IR VR=5V 1 μA Clamping voltage (tp=8/20μs) VC IPP=1A 8.5 V Clamping voltage (tp=8/20μs) VC IPP=4A 12 V Off state junction capacitance CJ 0Vdc,f=1MHz 10 pF Typical Characteristics Curves Figure 1. Pulse Waveforms tr 25 Peak value Ipp Waveform Parameters: tr=8µs td=20µs 90 80 Clamping Voltage (V) % of Peak Power Current 110 100 Figure 2. Clamping Voltage vs. Peak Pulse Current 70 60 50 40 30 td=t|IPP/2 20 20 15 10 Waveform Parameters: tr=8µs tb=20µs 5 10 0 0 0 5 10 15 20 25 30 t-Time (μs) 0 1 2 3 4 5 6 IPP-Peak Pulse Current (A) Figure 3. Capacitance vs. Reverse Voltage 25 Junction Capacitance (pF) F=1MHz 20 15 10 5 0 0 1 2 3 4 5 Reverse Voltage (V) Revision: ESD-LAD8C05L01-001(A1) 2/4 http://brightking.pulseelectronics.com LAD8C05L01 Recommended Soldering Conditions Reflow Soldering Critical Zone TL to TP tP TP Ramp-up TL tL Temperature TS max TS min Ramp-down tS Preheat 25 t 25℃ to Peak Time Recommended Conditions Profile Feature Pb-Free Assembly Average ramp-up rate (TL to TP) 3℃/second max. Preheat -Temperature Min (TS min) -Temperature Max (TS max) -Time (min to max) (ts) 150℃ 200℃ 60-180 seconds TS max to TL -Ramp-up Rate 3℃/second max. Time maintained above: -Temperature (TL) -Time (tL) 217℃ 60-150 seconds Peak Temperature (TP) 260℃ Time within 5℃ of actual Peak Temperature (tP) Ramp-down Rate 6℃/second max. Time 25℃ to Peak Temperature Revision: ESD-LAD8C05L01-001(A1) 20-40 seconds 8 minutes max. 3/4 http://brightking.pulseelectronics.com LAD8C05L01 Dimensions (SOD882) Dimension (mm) A Symbol B C Side View Top View D E 0.30 0.60 0.05 Recommended Soldering Pad Layout Bottom View Min. Max. Min. Max. A 0.95 1.05 0.037 0.041 B 0.55 0.65 0.022 0.026 C 0.32 0.55 0.013 0.022 D 1.40 0.125 Inches 0.55 F 45° Millimeters 0.45 0.018 E 0.20 0.30 0.008 0.012 F 0.45 0.55 0.018 0.022 Packaging Tape P0 P1 P2 K B W F E øD0 øD1 t A Reel D2 D Revision: ESD-LAD8C05L01-001(A1) W1 4/4 Symbol Dimension (mm) W 8.00±0.30 P0 4.00±0.10 P1 2.00±0.10 P2 2.00±0.10 D0 Φ1.55±0.10 D1 Φ0.40±0.05 E 1.75±0.10 F 3.50±0.10 A 0.75±0.10 B 1.15±0.10 K 0.60±0.05 t 0.20±0.05 D Φ328.0±2.0 D2 Φ14.4 W1 10.0 Quantity: 40000PCS http://brightking.pulseelectronics.com