S2MF

S2AF THRU S2MF Surface Mount General Purpose Silicon Rectifiers Reverse Voltage -50 to 1000V Forward Current -2A PINNING PIN FEATURES • For surface mounted applications • Low profile package • Glass Passivated Chip Juntion • Easy to pick and place • Lead free in comply with EU RoHS 2011/65/EU directives DESCRIPTION 1 Cathode 2 Anode 1 2 Top View MECHANICAL DATA • Case: SMAF • Terminals: Solderable per MIL-STD-750, 750, Method 2026 • Approx. Weight: 27mg 0.00086oz Marking Code:S2A-S2M Simplified outline SMAF L and symbol Maximum Ratings and Electrical characteristics aracteristics Ratings at 25°C C ambient temperature unless otherwise specified.Single phase half-wave half wave 60 Hz, resistive or inductive load, for capacitive load current derate by 20 %. Symbols S2AF Maximum Repetitive Peak Reverse Voltage V RRM Maximum RMS voltage S2BF S2DF S2GF S2JF S2KF S2MF Units 50 100 200 400 600 800 1000 V V RMS 35 70 140 280 420 560 700 V Maximum DC Blocking Voltage V DC 50 100 200 400 600 800 1000 V Maximum Average Forward Rectified Current at Ta = 65 °C I F(AV) 2 A Peak Forward Surge Current 8.3 ms Single Half Sine Wave Superimposed on Rated Load (JEDEC Method) I FSM 60 A Maximum Instantaneous Forward Voltage at 2 A VF 1.1 V IR 5 50 μA Cj 30 pF RθJA 50 °C/W T j , T stg -55 ~ +150 °C Parameter Maximum DC Reverse Current at Rated DC Blocking Voltage Typical Junction Capacitance Typical Thermal Resistance Ta = 25 °C Ta =125 °C 1） 2） Operating and Storage Temperature Range 1) Measured at 1 MHz and applied reverse voltage of 4 V D.C 2）Thermal resistance from junction to ambient at 0.375" (9.5 mm) lead length, P.C.B. mounted REV.08 1 of 3 S2AF THRU S2MF Fig.2 Typical Instaneous Reverse Characteristics Instaneous Reverse Current ( μ A) Average Forward Current (A) Fig.1 Forward Current Derating Curve 2.5 100LFM 2.0 1.5 1.0 0.5 0.0 Single phase half-wave 60 Hz resistive or inductive load 25 50 75 100 125 150 175 100 T J =150°C T J =125°C 10 T J =100°C 1.0 T J =75°C T J =50°C 0.1 T J =25°C 0.01 0 Junction Capacitance ( pF) 2 5° C =1 TJ TJ = 00 50 °C °C 1.5 =1 800 Fig.4 Typical Junction Capacitance 2.0 TJ Instaneous Forward Current (A) Fig.3 Typical Forward Characteristic 1.0 100 10 T J =25°C 1 0.7 0.8 0.9 1.0 1.1 0.1 1.0 10 Reverse Voltage (V) Instaneous Forward Voltage (V) REV.08 600 Instaneous Reverse Voltage (V) Ambient Temperature (°C) 0.5 0.6 400 200 2 of 3 100 S2AF THRU S2MF PACKAGE OUTLINE Plastic surface mounted package; 2 leads SMAF ∠ALL ROUND C A ∠ALL ROUND HE VM g Top View mil Bottom View A C D E e g HE max 1.1 0.20 3.7 2.7 1.6 1.2 4.9 min 0.9 0.12 3.3 2.4 1.3 0.8 4.4 max 43 7.9 146 106 63 47 193 min 35 4.7 130 94 51 31 173 UNIT mm g pad e E A pad D E A 7° The recommended mounting pad size 2.2 (86 ) 1.6 (63 ) 1.8 (71 ) 1.6 (63 ) Unit： mm (mil) REV.08 ∠ 3 of 3