RCLAMP0524P

RCLAMP0524P 4 Channel Ultra-Low Capacitance ESD Protection Diode 1. Features  Ultra-Low capacitance:0.5pF(typ.)  Reverse stand-off voltage:5V  IEC 61000-4-2 (Air): ±20KV 2. Pin Description 4. Schematic Diagram IEC 61000-4-2 (Contact): ±15KV 3. Applications  USB 3.0, USB 2.0  HDMI 1.3/1.4, Display Port 1.3, eSATA  Unified Display Interface (UDI)  Digital Visual Interface (DVI)  High speed serial interfaces Top View 5. 6. Order Information Type Package Size (mm) Delivery Form Delivery Quantity RCLAMP0524P DFN2510 2.50x1.00x0.50 7” T&R 3,000 Limiting Values(TA = 25 °C, unless otherwise specified) Symbol Parameter VESD Electrostatic Discharge Voltage IPPM Rated Peak Pulse Current Conditions Min Max Unit IEC 61000-4-2; Contact Discharge - ±15 kV IEC 61000-4-2; Air Discharge - ±20 kV tP = 8/20 µs - 5 A TA Ambient Temperature Range - -55 125 ℃ Tstg Storage Temperature Range - -55 150 ℃ www.slkormicro.com 1 RCLAMP0524P 7. Electrical Characteristics(TA = 25 °C unless otherwise specified) Symbol VRWM VBR IR Parameter Conditions Reverse Working Voltage Min Typ. Max Unit TA = 25 °C - - 5 V Breakdown Voltage IR = 1 mA; TA = 25 °C 6 - - V Reverse Leakage Current VRWM = 5V; TA = 25 °C - - 1 µA - 8.5 12 V - 12 16 V VR = 0V, f = 1 MHz,I/O to I/O - 0.3 0.4 pF VR = 0V, f = 1 MHz, I/O to GND - 0.5 0.8 pF IPP=1A,tP=8/20µs, Any I/O to VC Clamping Voltage GND , Positive IPP=5A,tP=8/20µs, Any I/O to GND , Positive CL 8. Junction Capacitance Typical Characteristics Fig.1 Peak Pulse Power Rating Curve Fig.2 Pulse Derating Curve Fig.3 Pulse Waveform-8/20μs Fig.4 Pulse Waveform-ESD(IEC61000-4-2) www.slkormicro.com 2 RCLAMP0524P 9. Package Dimension DFN2510 Package Outline Symbol A A1 b b1 b2 c D e Nd E L L1 L2 h R www.slkormicro.com Dimensions in millimeters Min Nom Max 0.45 0.15 0.35 0.20 0.10 2.45 0.50 0.02 0.20 0.40 0.25 0.15 2.50 0.50BSC 2.00 BSC 1.00 0.40 0.075 REF 0.05 REF 0.12 0.10 0.55 0.05 0.25 0.45 0.30 0.20 2.55 0.95 0.35 0.08 0.05 3 1.05 0.45 0.15 0.15 RCLAMP0524P 10. Soldering Parameters tp TP Critical Zone TL to TP Ramp-up TL tL Temperature TS(max) Ramp-down Preheat TS(min) ts 25 time to peak temperatue (t 25℃ to peak) Reflow Condition Pre-heat Time Pb-Free Assembly -Temperature Min (Ts(min)) +150°C -Temperature Max(Ts(max)) +200°C -Time (Min to Max) (ts) 60-180 secs. Average ramp up rate (Liquid us Temp (TL) to peak) 3°C/sec. Max Ts(max) to TL - Ramp-up Rate 3°C/sec. Max Reflow -Temperature(TL)(Liquid us) +217°C -Temperature(tL) 60-150 secs. Peak Temp (Tp) +260(+0/-5)°C Time within 5°C of actual Peak Temp (tp) 30 secs. Max Ramp-down Rate 6°C/sec. Max xTime 25°C to Peak Temp (TP) 8 min. Max Do not exceed +260°C www.slkormicro.com 4