6N139

6N138,6N139 Series Darlington High Speed Transistor Photo Coupler SCHEMATIC Description The 6N138 and 6N139 series combine an AlGaAs infrared emitting diode as the emitter which is optically coupled to a silicon high speed photo darlington transistor in a plastic DIP8 package with different lead forming options. 1 8 2 7 3 6 4 5 A separate design between photodiode and darlington transistor reduces the base-collector capacitance of the input transistor which PIN DEFINITION improves the speed by several orders of magnitude over conventional phototransistor optocouplers. 1.NC 2.Anode 8.VCC 7.VB Features 3.Cathode 4.NC 6.VO 5.GND  High isolation 5000 VRMS  DC input with transistor output  Operating temperature range - 55 °C to OUTLINE 100 °C  REACH compliance  Halogen free (Optional)  MSL class 1  Regulatory Approvals  UL - UL1577  VDE - EN60747-5-5(VDE0884-5)  CQC - GB4943.1, GB8898  cUL- CSA Component Acceptance Service Notice No. 5A Applications  Low current line receivers  Current loop receivers  Out interface to CMOS-LSTTL-TTL  Pulse transformer replacement  Computer-peripheral interface www.slkormicro.com 1 6N138,6N139 Series ABSOLUTE MAXIMUM RATINGS PARAMETER SYMBOL VALUE UNIT Note Forward Current IF 25 mA Peak Forward Current IFP 50 mA 1 Peak Transient Current IF(trans) 1 A 2 Reverse Voltage VR 5 V Input Power Dissipation PI 100 mW Supply Voltage VCC -0.5~18 V Output Voltage VO -0.5~18 V Output Current IO 60 mA Emitter-Base Reverse Voltage VEBR 0.5 V Output Power Dissipation PO 100 mW Total Power Dissipation Ptot 200 mW Isolation Voltage Viso 5000 Vrms Operating Temperature Topr -55~100 °C Storage Temperature Tstg -55~150 °C Soldering Temperature Tsol 260 °C INPUT OUTPUT COMMON Note 1. 50% duty, 1ms P.W Note 2. ≤1μs P.W,300pps Note 3. AC For 1 Minute, R.H. = 40 ~ 60% Note 4. For 10 seconds www.slkormicro.com 2 3 4 6N138,6N139 Series ELECTRICAL OPTICAL CHARACTERISTICS PARAMETER SYMBOL MIN TYP MAX UNIT TEST CONDITION INPUT(at Ta=0 to 70°C , unless specified otherwise) Forward Voltage VF - 1.28 1.7 V IF=1.6mA Reverse Current IR - - 10 μA VR=5V Input Capacitance Cin - 60 - pF V=0, f=1MHz OUTPUT(at Ta=0 to 70°C , unless specified otherwise) High Level Supply Current ICCH - 0.05 10 μA IF=0mA, VO=Open, VCC=18V Low Level Supply Current ICCL - 0.6 1.5 mA IF=1.6mA, VO=Open, VCC=18V - 0.01 100 μA Logic High Output Current 6N138 IOH 6N139 IF=0mA, VO=VCC=18V, - - 250 μA TRANSFER CHARACTERISTICS(at Ta=0 to 70°C , unless specified otherwise) Current Transfer Ratio Logic Low Output Voltage 6N139 CTR 6N138 6N138 Isolation Resistance Riso Floating Capacitance CIO www.slkormicro.com 2500 - 500 2600 - 300 2600 - VCC=4.5V - 0.04 0.4 IF = 0.5mA ,IO = 2mA, VCC=4.5V - 0.07 0.4 IF = 1.6mA ,IO = 8mA, VCC=4.5V - 0.11 0.4 - 0.15 0.4 IF = 12mA ,IO = 24mA, VCC=4.5V - 0.05 0.4 IF = 1.6mA ,IO = 4.8mA, VCC=4.5V % 6N139 VOL IF = 0.5mA ,VO = 0.4V, VCC=4.5V 400 10^12 10^14 - 0.3 3 V IF = 1.6mA ,VO = 0.4V, IF = 5mA ,IO = 15mA, VCC=4.5V - Ω DC500V, 40 ~ 60% R.H. 1 pF V=0, f=1MHz NOTE 6N138,6N139 Series ELECTRICAL OPTICAL CHARACTERISTICS PARAMETER SYMBOL MIN TYP MAX UNIT TEST CONDITION TRANSFER CHARACTERISTICS(at Ta=0 to 70°C , unless specified otherwise) Current Transfer Ratio Logic Low 6N139 CTR 6N138 6N139 Output Voltage VOL 6N138 Isolation Resistance Riso Floating Capacitance CIO www.slkormicro.com IF = 0.5mA ,VO = 0.4V, VCC=4.5V 400 2500 - 500 2600 - 300 2600 - IF = 1.6mA ,VO = 0.4V, VCC=4.5V % - 0.04 0.4 IF = 0.5mA ,IO = 2mA, VCC=5V - 0.07 0.4 IF = 1.6mA ,IO = 8mA, VCC=4.5V - 0.11 0.4 IF = 5mA ,IO = 15mA, VCC=4.5V - 0.15 0.4 IF = 12mA ,IO = 24mA, VCC=4.5V - 0.05 0.4 IF = 1.6mA ,IO = 4.8mA, VCC=4.5V 10^12 10^14 - 0.3 4 V - Ω DC500V, 40 ~ 60% R.H. 1 pF V=0, f=1MHz NOTE 6N138,6N139 Series ELECTRICAL OPTICAL CHARACTERISTICS PARAMETER SYMBOL MIN TYP MAX UNIT TEST CONDITION NOTE SWITCHING CHARACTERISTICS(at Ta=0 to 70°C,VCC=5V, unless specified otherwise) Propagation Delay Time to Logic Low 6N139 TPHL 6N138 Propagation Delay Time 6N139 TPLH to Logic High 6N138 Common Mode Transient Immunity at Logic High Common Mode Transient Immunity at Logic Low 6N139 6N138 CMH 6N139 6N138 www.slkormicro.com CML - 5 25 IF = 0.5mA,RL=4.7kΩ, TA=25oC - - 30 IF = 0.5mA,RL=4.7kΩ - 0.2 1 IF = 12mA,RL=270Ω, TA=25oC - - 2 - 1.4 10 IF = 1.6mA,RL=2.2kΩ, TA=25oC - - 15 IF = 1.6mA,RL=2.2kΩ - 22 60 IF = 0.5mA,RL=4.7kΩ, TA=25oC - - 90 IF = 0.5mA,RL=4.7kΩ - 2.1 7 IF = 12mA,RL=270Ω, TA=25oC - - 10 - 10.7 35 IF = 1.6mA,RL=2.2kΩ, TA=25oC - - 50 IF = 1.6mA,RL=2.2kΩ 1000 - - 1000 - - 1000 - - 1000 - - 5 μs μs IF = 12mA,RL=270Ω IF = 12mA,RL=270Ω Fig.13 Fig.13 V/μs IF = 0mA , VCM=10Vpp, RL=2.2kΩ, TA =25°C Fig.15 V/μs IF = 1.6mA , VCM=10Vpp, RL=2.2kΩ, TA =25°C Fig.15 6N138,6N139 Series CHARACTERISTIC CURVES Fig.1 Forward Current vs. Forward Voltage Fig.2 Current Transfer Ratio vs. Forward Current Fig.3 Normalized Current Transfer Ratio vs. Ambient Temperature Fig.4 Current Transfer Ratio vs. Base-Emitter Resistance Fig.5 Low Level Output Current vs. Output Voltage Fig.6 Low Level Output Current vs. Forward Current www.slkormicro.com 6 6N138,6N139 Series CHARACTERISTIC CURVES Fig.7 High Level Output Current vs. Ambient Temperature Fig.8 Propagation Delay vs. Pulse Width Fig.9 Rise and Fall Time vs. Load Resistance Fig.10 Propagation Delay vs. Ambient Temperature Fig.11 Propagation Delay vs. Forward Current Fig.12 Propagation Delay vs. Base-Emitter Resistance www.slkormicro.com 7 6N138,6N139 Series TEST CIRCUITS Fig.13 Test Circuits for TPHL, TPLH, tr, tf Fig.14 Waveforms of TPHL, TPLH, tr, tf www.slkormicro.com 8 6N138,6N139 Series TEST CIRCUITS Fig.15 Test Circuits for Common Mode Transient Immunity Fig.16 Waveforms of Common Mode Transient Immunity www.slkormicro.com 9 6N138,6N139 Series PACKAGE DIMENSIONS (Dimensions in mm unless otherwise stated) Standard DIP – Through Hole (DIP Type) Gullwing (400mil) Lead Forming – Through Hole (M Type) www.slkormicro.com 10 6N138,6N139 Series PACKAGE DIMENSIONS (Dimensions in mm unless otherwise stated) Surface Mount Lead Forming (S Type) Surface Mount (Low Profile) Lead Forming (SL Type) www.slkormicro.com 11 6N138,6N139 Series PACKAGE DIMENSIONS (Dimensions in mm unless otherwise stated) Surface Mount (Gullwing) Lead Forming (SLM Type) Recommended Solder Mask (Dimensions in mm unless otherwise stated) Surface Mount Lead Forming & Surface Mount (Low Profile) Lead Forming Surface Mount (Gullwing) Lead Forming www.slkormicro.com 12 6N138,6N139 Series Carrier Tape Specifications (Dimensions in mm unless otherwise stated) Option S(T1) & SL(T1) Option S(T2) & SL(T2) www.slkormicro.com 13 6N138,6N139 Series Carrier Tape Specifications (Dimensions in mm unless otherwise stated) Option SLM(T1) Option SLM(T2) www.slkormicro.com 14 6N138,6N139 Series REFLOW INFORMATION REFLOW PROFILE Profile Feature Sn-Pb Assembly Profile Pb-Free Assembly Profile Temperature Min. (Tsmin) 100 150°C Temperature Max. (Tsmax) 150 200°C Time (ts) from (Tsmin to Tsmax) 60-120 seconds 60-120 seconds Ramp-up Rate (tL to tP) 3°C/second max. 3°C/second max. Liquidous Temperature (TL) 183°C 217°C Time (tL) Maintained Above (TL) 60 – 150 seconds 60 – 150 seconds Peak Body Package Temperature 235°C +0°C / -5°C 260°C +0°C / -5°C Time (tP) within 5°C of 260°C 20 seconds 30 seconds Ramp-down Rate (TP to TL) 6°C/second max 6°C/second max Time 25°C to Peak Temperature 6 minutes max. 8 minutes max. www.slkormicro.com 15