BZT52C13

BZT52C2V0 THRU BZT52C75 Silicon Planar Zener Diodes PINNING FEATURES PIN • Total power dissipation: Max. 500mW. • Wide zener reverse voltage range 2.0V to 75V. • Small plastic package suitable for surface mounted design. • Tolerance approximately±5% DESCRIPTION 1 Cathode 2 Anode 2 MECHANICAL DATA ▪Case: SOD-123 ▪Terminals: Solderable per MIL-STD-750, Method 2026 1 Simplified outline SOD-123 and symbol Absolute Maximum Ratings And Characteristics （Ta = 25 °C） Symbol Value Unit Power Dissipation P tot 500 mW Forward Voltage at I F = 10 mA VF 0.9 V RθJA 340 °C/W T j , T stg -55 ~ +150 °C Parameter Typical thermal resistance juncting to ambient (1) Operating and Storage Temperature Range (1) Thermal resistance from junction to ambient at P.C.B. mounted with 2 .0" X 2.0" (5 X 5 cm) copper areas pads. Transient Thermal Impedance（ °C /W） Fig.1 Maximum Continuous Power Derating 0.6 Power Dissipation ( W ) 0.5 0.4 0.3 0.2 0.1 0.0 25 50 75 100 125 150 175 T c ,Case Temperature (°C) REV.08 Fig.2 Typical Transient Thermal Impedance 2000 1000 100 10 0.01 0.1 1 10 t, Pulse Duration（sec） 1 of 3 100 Characteristics at Ta = 25°C Dynamic Impedance Zener Voltage Range （1） Type Marking V ZT（at I ZT） Min（V） Reverse Current I ZT Z ZT（at I ZT） IR at V R Max（μA） （V） Nom（V） Max（V） (mA) Max (Ω) BZT52C2V0 W10 1.8 2.0 2.15 5 100 120 0.5 BZT52C 2V2 W11 2.08 2.2 2.33 5 100 120 0.7 BZT52C2V4 WX 2.28 2.4 2.56 5 100 120 1 BZT52C 2V7 W1 2.5 2.7 2.9 5 110 120 1 BZT52C 3V0 W2 2.8 3.0 3.2 5 120 50 1 BZT52C 3V3 W3 3.1 3.3 3.5 5 130 20 1 BZT52C 3V6 W4 3.4 3.6 3.8 5 130 10 1 BZT52C 3V9 W5 3.7 3.9 4.1 5 130 5 1 BZT52C 4V3 W6 4 4.3 4.6 5 130 5 1 BZT52C 4V7 W7 4.4 4.7 5 5 130 2 1 BZT52C 5V1 W8 4.8 5.1 5.4 5 130 2 1.5 BZT52C 5V6 W9 5.2 5.6 6 5 80 1 2.5 BZT52C 6V2 WA 5.8 6.2 6.6 5 50 1 3 BZT52C 6V8 WB 6.4 6.8 7.2 5 30 0.5 3.5 BZT52C 7V5 WC 7 7.5 7.9 5 30 0.5 4 BZT52C 8V2 WD 7.7 8.2 8.7 5 30 0.5 5 BZT52C 9V1 WE 8.5 9.1 9.6 5 30 0.5 6 BZT52C 10 WF 9.4 10 10.6 5 30 0.1 7 BZT52C 11 WG 10.4 11 11.6 5 30 0.1 8 BZT52C 12 WH 11.4 12 12.7 5 35 0.1 9 BZT52C 13 WI 12.4 13 14.1 5 35 0.1 10 BZT52C 15 WJ 13.8 15 15.6 5 40 0.1 11 BZT52C 16 WK 15.3 16 17.1 5 40 0.1 12 BZT52C 18 WL 16.8 18 19.1 5 45 0.1 13 BZT52C 20 WM 18.8 20 21.2 5 50 0.1 15 BZT52C 22 WN 20.8 22 23.3 5 55 0.1 17 BZT52C 24 WO 22.8 24 25.6 5 60 0.1 19 BZT52C 27 WP 25.1 27 28.9 5 70 0.1 21 BZT52C 30 WQ 28 30 32 5 80 0.1 23 BZT52C 33 WR 31 33 35 5 80 0.1 25 BZT52C 36 WS 34 36 38 5 90 0.1 27 BZT52C 39 WT 37 39 41 2.5 100 2 30 BZT52C 43 WU 40 43 46 2.5 130 2 33 BZT52C 47 WV 44 47 50 2.5 150 2 36 BZT52C 51 WW 48 51 54 2.5 180 1 39 BZT52C 56 WX1 52 56 60 2.5 180 1 43 BZT52C 62 WY 58 62 66 2.5 200 0.2 47 BZT52C 68 WZ 64 68 72 2.5 250 0.2 52 BZT52C 75 WZ1 70 75 79 2.5 300 0.2 57 （1） V ZT is tested with pulses (20 ms) REV.08 2 of 3 BZT52C2V0 THRU BZT52C75 PACKAGE OUTLINE Plastic surface mounted package; 2 leads SOD-123 A D b E A1 C ∠ALL ROUND L1 E1 SOD-123 mechanical data A C D E E1 L1 b A1 max 1.3 0.22 1.8 2.8 3.9 0.45 0.7 0.2 min 0.9 0.09 1.5 2.5 3.6 0.25 0.5 max 51 8.7 71 110 154 18 28 min 35 3.5 59 98 142 10 20 UNIT ∠ mm 9° mil The recommended mounting pad size 2.0 (79) 1.2 (47) 1.2 (47) 1.2 (47) Unit： mm (mil) REV.08 3 of 3 8