JK-SMD2920 Series
Surface Mountable PTC Resettable Fuse: JK-SMD2920 Series
Features:
RoHS Compliant & Halogen Free
faster tripping, 2920 Dimension, Surface mountable, Solid state
Operation Current: 0.30A~3.00A
Maximum Voltage: 6V~60Vdc
Operating Temperature:-40℃ TO 85℃
Agency recognition:UL、CSA
Product Dimensions
Terminal pad materials :Tin-Plated Nickle-copper
Terminal pad solderability : Meets EIA specification
RS 186-9E and ANSI/J-STD-002 Category 3.
Pig.1
Unit :mm
Model
Marking
JK-SMD030L
A
B
C
D
E
Min
Max
Min
Max
Min
Max
Min
Min
JK030L
6.73
7.98
4.80
5.44
0.60
1.15
0.30
0.15
JK-SMD050L
JK050L
6.73
7.98
4.80
5.44
0.60
1.15
0.30
0.15
JK-SMD075L
JK075L
6.73
7.98
4.80
5.44
0.60
1.15
0.30
0.15
JK-SMD100L
JK100L
6.73
7.98
4.80
5.44
0.60
1.00
0.30
0.15
JK-SMD125L
JK125L
6.73
7.98
4.80
5.44
0.60
1.00
0.30
0.15
JK-SMD150L
JK150L
6.73
7.98
4.80
5.44
0.60
1.20
0.30
0.15
JK-SMD185L
JK185L
6.73
7.98
4.80
5.44
0.60
1.20
0.30
0.15
JK-SMD200L
JK200L
6.73
7.98
4.80
5.44
0.40
0.80
0.30
0.15
JK-SMD200L-24
JK200L
6.73
7.98
4.80
5.44
0.60
1.00
0.30
0.15
JK-SMD250L
JK250L
6.73
7.98
4.80
5.44
0.40
0.80
0.30
0.15
JK-SMD260L
JK260L
6.73
7.98
4.80
5.44
0.40
0.80
0.30
0.15
JK-SMD300L-6
JK300L
6.73
7.98
4.80
5.44
0.40
0.80
0.30
0.15
JK-SMD300L-16
JK300L
6.73
7.98
4.80
5.44
0.60
1.20
0.30
0.15
Page 1 of 6
JK-SMD2920 Series
Thermal Derating Chart-IH(A)
Maximum ambient operating temperatures(℃)
Model
-40
-20
0
25
40
50
60
70
85
JK-SMD030L
0.44
0.37
0.35
0.30
0.28
0.23
0.20
0.18
0.14
JK-SMD050L
0.73
0.62
0.59
0.50
0.47
0.38
0.34
0.30
0.24
JK-SMD075L
1.09
0.92
0.88
0.75
0.70
0.56
0.50
0.45
0.36
JK-SMD100L
1.45
1.23
1.17
1.00
0.93
0.75
0.67
0.60
0.48
JK-SMD125L
1.81
1.54
1.46
1.25
1.16
0.94
0.84
0.75
0.60
JK-SMD150L
2.18
1.85
1.76
1.50
1.40
1.13
1.01
0.90
0.72
JK-SMD185L
2.68
2.28
2.16
1.85
1.72
1.39
1.24
1.11
0.89
JK-SMD200L
2.90
2.46
2.34
2.00
1.86
1.50
1.34
1.20
0.96
JK-SMD200L-24
2.90
2.46
2.34
2.00
1.86
1.50
1.34
1.20
0.96
JK-SMD250L
3.63
3.08
2.93
2.50
2.33
1.88
1.68
1.50
1.20
JK-SMD260L
3.77
3.20
3.04
2.60
2.42
1.95
1.74
1.56
1.25
JK-SMD300L-6
4.35
3.69
3.51
3.00
2.79
2.25
2.01
1.80
1.44
JK-SMD300L-16
4.35
3.69
3.51
3.00
2.79
2.25
2.01
1.80
1.44
Electrical Characteristic
Vmax
Imax
Ihold
Itrip
Pd
(Vdc)
(A)
(A)
(A)
Max.
(W)
Current
Time
Rimin
R1max
(A)
(Sec)
()
()
SMD030L
60
100
0.30
0.60
1.5
1.5
3.0
0.60
4.80
SMD050L
60
100
0.50
1.00
1.5
2.5
4.0
0.18
1.40
SMD075L
33
100
0.75
1.50
1.5
8.0
0.3
0.10
1.00
SMD100L
33
100
1.00
2.20
1.5
8.0
0.5
0.065
0.41
SMD125L
33
100
1.25
2.50
1.5
8.0
2.0
0.05
0.25
SMD150L
33
100
1.50
3.00
1.5
8.0
2.0
0.035
0.23
SMD185L
33
100
1.85
3.70
1.5
8.0
2.5
0.030
0.15
SMD200L
16
100
2.00
4.00
1.5
8.0
4.5
0.020
0.12
SMD200L-24
24
100
2.00
4.00
1.5
8.0
4.5
0.020
0.12
SMD250L
16
100
2.50
5.00
1.5
8.0
16.0
0.020
0.085
SMD260L
16
100
2.60
5.20
1.5
8.0
10.0
0.014
0.075
SMD300L-6
6
100
3.00
6.00
1.5
8.0
20.0
0.012
0.048
SMD300L-16
16
100
3.00
6.00
1.5
8.0
20.0
0.012
0.050
Model
Page 2 of 6
Maximum time to trip
Resistence
JK-SMD2920 Series
Modeling System
JK- SMD - □□□
L
2920 Dimension
Holding current Rating
Surface Mount Device
JK mark
Test Procedures And Requirements
Test
Test Conditions
Accept/Reject Criteria
Resistance
In still air @ 25℃
Rmin≤R≤Rmax
Time to Trip
Specified current,Vmax,25℃
Tmaximum Time to Trip
Hold Current
30min,at IH
No trip
Trip Cycle Life
Vmax,Imax,100cycles
No arcing or burning
Trip Endurance
Vmax,1 hours
No arcing or burning
Physical Characteristics and Environmental Specifications
Physical Characteristics
Terminal materials :
Tin-Plated Nickle-copper
Soldering
Meets EIA specification RS 186-9E and ANSI/J-STD-002 Category 3.
zone
Environmental Specifications
Test
Conditions
Resistance Change
Passive aging
85℃,1000hours
±10%
Humidity aging
85℃/85%RH.1000 hours
±5%
Thermal shock
MIL-STD-202,Method 107G+85℃/-40℃,20times
-30% typical resistance change
Solvent Resistance
MIL-STD-202,Method 215
no change
Vibration
ML-STD-883C,Test Condition A
No chage
Page 3 of 6
JK-SMD2920 Series
Electrical Specifications:
Ihold = Hold Current. Maximum current device will not trip in 25°C still air.
Itrip = Trip Current. Minimum current at which the device will always trip in 25°C still air.
Vmax = Maximum operating voltage device can withstand without damage at rated current (Imax).
Imax = Maximum fault current device can withstand without damage at rated voltage (Vmax).
Pd=Maximum power dissipation when device is in the tripped state in 25°C still air environment at rated voltage.
Rimin/max = Minimum/Maximum device resistance prior to tripping at 25°C.
R1max = Maximum device resistance is measured one hour post reflow.
Recommended pad layout (mm)
Solder reflow conditions
● Recommended reflow methods: IR, vapor phase oven, hot air oven, N2 environment for lead-free.
● Devices are not designed to be wave soldered to the bottom side of the board.
● Recommended maximum paste thickness is 0.25mm (0.010inch).
● Devices can be cleaned using standard industry methods and solvents.
Page 4 of 6
JK-SMD2920 Series
● Soldering temprature profile meets RoHs leadfree process.
Notes: If reflow temperatures exceed the recommended profile, devices may not meet the performance requirements
Tape Specification And
Reel Dimensions
Coverning Specifications
EIA 481-1(Unit:mm)
W
16± 0.3
P0
4.0 ± 0.10
P1
8.0 ± 0.10
P2
2.0 ± 0.10
A0
5.74 ± 0.10
B0
8.02 ± 0.10
D0
1.55 ± 0.05
F
7.5± 0.10
E1
1.75 ± 0.10
T
0.20± 0.10
Leader min.
390
Trailer min.
160
Reel Dimensions
A
178± 1
N
58± 1
W1
16.9± 0.80
W2
19.3± 0.1
Packaging Quantity
Model
Quantity
Model
Quantity
SMD030L
2000
SMD200L
2000
SMD050L
2000
SMD200L-24
1500
SMD075L
2000
SMD250L
2000
SMD100L
2000
SMD260L
2000
SMD125L
2000
SMD300L
1500
SMD150L
2000
SMD300L-6
2000
SMD185L
1500
Page 5 of 6
JK-SMD2920 Series
Storage
The maximum ambient temperature shall not exceed 38℃. Storage temperatures higher than 38℃ could result in the
deformation of packaging materials. The maximum relative humidity recommended for storage is 60%. High humidity with
high temperature can accelerate the oxidation of the solder plating on the termination and reduce the solderability of the
components. Sealed plastic bags with desiccant shall be used to reduce the oxidation of the termination and shall only be
opened prior to use. The products shall not be stored in areas where harmful gases containing sulfur or chlorine are present
WARNING
• Use PPTC beyond the maximum ratings or improper use may result in device damage and possible electrical arcing and
flame.
• PPTC are intended for protection against occasional over current or over temperature fault conditions and should not be
used when repeated fault conditions or prolonged trip events are anticipated.
• Device performance can be impacted negatively if devices are handled in a manner inconsistent with recommended
electronic, thermal, and mechanical procedures for electronic components.
• Use PPTC with a large inductance in circuit will generate a circuit voltage (L di/dt) above the rated voltage of the PPTC.
• Avoid impact PPTC device its thermal expansion like placed under pressure or installed in limited space.
• Contamination of the PPTC material with certain silicon based oils or some aggressive solvents can adversely impact the
performance of the devices.PPTC SMD can be cleaned by standard methods.
• Requests that customers comply with our recommended solder pad layouts and recommended reflow profile. Improper
board layouts or reflow profilecould negatively impact solderability performance of our devices.
Notes:
The specification is intended to present application,product and technical data to assist the user in selecting PPTC circuit
production devices,However,users should imdependently evaluate and test the suitability of each product.JinRui makes on
warranties as to the acduracy or completeness of the information and disclaims any liatility resulting form its use,JinRui’s
only obligations are those im the JinRui Standard Rerms and Conditions of Sale and in no case will JinRui be liable for any
incidental,imdirect,or consequential damages arising from the sale,resale,or misues of its products. Jinrui reserves the right
to change of update, without notice, any information contained in this specification.
Page 6 of 6
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