WST8205A
Dual N-Ch MOSFET
General Description
Product Summery
The WST8205A is the highest performance trench
N-ch MOSFET with extreme high cell density ,
which provide excellent RDSON and gate charge
for most of the small power switching and load
switch applications.
BVDSS
RDSON
ID
20V
32mΩ
5.3A
Applications
The WST8205A meet the RoHS and Green
Product requirement with full function reliability
approved.
z High Frequency Point-of-Load Synchronous
Small power switching for MB/NB/UMPC/VGA
z Networking DC-DC Power System
Features
SOT-23-6L Pin Configuration
z Advanced high cell density Trench technology
z Super Low Gate Charge
z Excellent Cdv/dt effect decline
z Green Device Available
Absolute Maximum Ratings
Symbol
Parameter
VDS
VGS
ID@Tc=25℃
ID@Tc=70℃
IDM
Rating
Units
Drain-Source Voltage
20
V
Gate-Source Voltage
±12
V
1
5.8
A
1
3.8
A
16
A
Continuous Drain Current, VGS @ 4.5V
Continuous Drain Current, VGS @ 4.5V
Pulsed Drain Current
2
3
PD@TA=25℃
Total Power Dissipation
2.1
W
TSTG
Storage Temperature Range
-55 to 150
℃
TJ
Operating Junction Temperature Range
-55 to 150
℃
Thermal Data
Symbol
Parameter
RθJA
Thermal Resistance Junction-ambient
RθJC
1
www.winsok.tw
1
Thermal Resistance Junction-Case
Page 1
Typ.
Max.
Unit
---
125
℃/W
---
70
℃/W
Rev 1: May.2019
WST8205A
Dual N-Ch MOSFET
Electrical Characteristics (TJ=25 ℃, unless otherwise noted)
Symbol
BVDSS
Parameter
Conditions
Drain-Source Breakdown Voltage
△BVDSS/△TJ BVDSS Temperature Coefficient
RDS(ON)
VGS(th)
Static Drain-Source On-Resistance2
Gate Threshold Voltage
Min.
Typ.
Max.
Unit
VGS=0V , ID=250uA
20
---
---
V
Reference to 25℃ , ID=1mA
---
0.022
---
V/℃
VGS=4.5V , ID=5.5A
---
32
40
---
46
50
0.5
0.7
1.2
V
---
-2.33
---
mV/℃
VDS=16V , VGS=0V , TJ=25℃
---
---
1
VDS=16V , VGS=0V , TJ=55℃
---
---
5
VGS=2.5V , ID=3.5A
VGS=VDS , ID =250uA
mΩ
△VGS(th)
VGS(th) Temperature Coefficient
IDSS
Drain-Source Leakage Current
IGSS
Gate-Source Leakage Current
VGS=±12V , VDS=0V
---
---
±100
nA
gfs
Forward Transconductance
VDS=5V , ID=5A
---
25
---
S
Rg
Gate Resistance
VDS=0V , VGS=0V , f=1MHz
---
1.5
3
Ω
Qg
Total Gate Charge (4.5V)
---
8.3
11.9
Qgs
Gate-Source Charge
---
1.4
2.0
Qgd
Gate-Drain Charge
---
2.2
3.2
VDS=10V , VGS=4.5V , ID=5.5A
uA
nC
---
5.7
11.6
Rise Time
VDD=10V , VGEN=4.5V , RG=6Ω
---
34
63
Turn-Off Delay Time
ID=5A, RL=10Ω
---
22
46
Fall Time
---
9.0
18.4
Ciss
Input Capacitance
---
625
889
Coss
Output Capacitance
---
69
98
Crss
Reverse Transfer Capacitance
---
61
88
Min.
Typ.
Max.
Unit
---
---
1.5
A
---
---
16
A
---
---
1.2
V
---
7.1
---
nS
---
1.8
---
nC
Td(on)
Tr
Td(off)
Tf
Turn-On Delay Time
VDS=10V , VGS=0V , f=1MHz
ns
pF
Diode Characteristics
Symbol
Parameter
Conditions
1,4
IS
Continuous Source Current
ISM
Pulsed Source Current2,4
2
VSD
Diode Forward Voltage
trr
Reverse Recovery Time
Qrr
Reverse Recovery Charge
VG=VD=0V , Force Current
VGS=0V , IS=1A , TJ=25℃
IF=5A , dI/dt=100A/µs , TJ=25℃
Note :
2
1.The data tested by surface mounted on a 1 inch FR-4 board with 2OZ copper.
2.The data tested by pulsed , pulse width ≦ 300us , duty cycle ≦ 2%
3.The power dissipation is limited by 150℃ junction temperature
4.The data is theoretically the same as ID and IDM , in real applications , should be limited by total power dissipation.
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Page 2
Rev 1: May.2019
WST8205A
Dual N-Ch MOSFET
Typical Characteristics
58
20
VGS=5V
16
VGS=4.5V
14
VGS=3V
48
VGS=2.5V
12
10
8
ID=5.5A
53
RDSON (mΩ)
ID Drain Current (A)
18
VGS=1.8V
6
43
38
33
28
4
2
20
0
0
0.25
0.5
0.75
0
1
2
4
VDS , Drain-to-Source Voltage (V)
VGS (V)
6
8
10
Fig.2 On-Resistance vs. Gate-Source
Fig.1 Typical Output Characteristics
7
VDS=10V
ID=5.5A
IS Source Current(A)
6
5
4
3
2
TJ=150℃
TJ=25℃
1
0
0
0.2
0.4
0.6
0.8
1
VSD , Source-to-Drain Voltage (V)
Fig.4 Gate-Charge Characteristics
Fig.3 Forward Characteristics Of Reverse
1.8
Normalized On Resistance
1.8
1.4
Normalized VGS(th)
1.4
1.0
1
0.6
0.6
0.2
0.2
-50
0
50
100
150
-50
0
50
100
TJ ,Junction Temperature (℃ )
TJ , Junction Temperature (℃)
Fig.5 Normalized VGS(th) vs. TJ
Fig.6 Normalized RDSON vs. TJ
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Page 3
150
Rev 1: May.2019
WST8205A
Dual N-Ch MOSFET
1000
100.00
100us
10.00
1ms
100
ID (A)
Capacitance (pF)
Ciss
1.00
Coss
10ms
Crss
100ms
0.10
DC
o
TA=25 C
Single Pulse
F=1.0MHz
10
0
5
10
15
20
VDS , Drain to Source Voltage (V)
0.01
0.01
Fig.7 Capacitance
0.1
1
10
VDS (V)
100
Fig.8 Safe Operating Area
Normalized Thermal Response (RθJA)
1
DUTY=0.5
0.2
0.1
0.1
0.05
0.02
0.01
P DM
0.01
T ON
T
SINGLE
D = TON/T
TJpeak = TA+P DMXRθJA
0.001
0.0001
0.001
0.01
0.1
1
10
100
1000
t , Pulse Width (s)
Fig.9 Normalized Maximum Transient Thermal Impedance
Fig.10 Switching Time Waveform
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Fig.11 Gate Charge Waveform
Page 4
Rev 1: May.2019
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