ORH-G37A

PLCC LED Series Datasheet ORH-G37A(IF=20mA) 1. Features:          Chip material: AlInGaN. Emitted Color: Super Green. Lens Appearance: Water Clear. Mono-color type. 3.2x1.6x1.1mm (1206) standard package. Suitable for all SMT assembly methods. Compatible with infrared and vapor phase reflow solder process. Compatible with automatic placement equipment. This product doesn’t contain restriction substance, comply ROHS standard. 2. Applications:  Aftermark: Accessary application. Ver, A0 SHENZHEN ORIENT ELECTRONICS CO. ,LTD. ORH-G37A 3.Package Dimensions: SOLDERING TERMINAL 0.8±0.05 CATHODE 0.45±0.05 3.2±0.1 LED DICE MOLDING BODY (LENS) POLARITY 2.06±0.1 0.05 0.8± 0.8±0.05 1.6±0.1 P.C BOARD For reflow soldering(propose) 3.2 1.6 0.5±0.05 1.1±0.1 1.6 0.8±0.05 NOTES: 1).All dimensions are in millimeters (inches). 2).Tolerance is ± 0.10mm (0.004”) unless otherwise specified. 3).Specifications are subject to change without notice. 2 Copyright© 2019 Orient Tech Corporation,All rights Reserved. Ver, A0 SHENZHEN ORIENT ELECTRONICS CO. ,LTD. ORH-G37A 4. Absolute Maximum Ratings(Ta=25℃) Parameter Symbol Rating Unit Power Dissipation Pd 120 mW Forward Current IF 30 mA Peak Forward Current ＊1 IFP 100 mA Operating Temperature Topr -40℃~85℃ - Storage Temperature Tstg -40℃~85℃ - Soldering Temperature Tsol 260℃ for 10 seconds - ＊1 Condition for IFP is pulse of 1/10 duty and 0.1msec width. 5. Electrical and optical characteristics(Ta=25℃) Parameter Symbol Condition Min. Typ. Max. Unit Forward Voltage Vf IF=20mA - 3.0 - V Luminous Intensity Iv IF=20mA - 1000 - mcd Peak Wave Length λp IF=20mA - 525 - nm Dominant Wave Length λd IF=20mA - 525 - nm Spectral Line Half-width Δλ IF=20mA - 30 - nm Veiwing Angle 2θ1/2 IF=20mA - 120 - deg 3 Copyright© 2019 Orient Tech Corporation,All rights Reserved. Ver, A0 SHENZHEN ORIENT ELECTRONICS CO. ,LTD. ORH-G37A 6.Typical Electro-Optical Characteristics Curves Fig.2 Forward current derating curve Fig.1 Relative intensity vs. wavelength vs. ambient temperature 1.0 60 Forward current (mA) Relative radiant intensity 50 0.5 40 30 20 10 0 475 525 0 575 20 Wavelength (nm) 50 100 2.5 Relative Luminous intensity (Normalized @20mA) Forward current (mA) 80 3.0 40 30 20 10 2.0 1.5 1.0 0.5 1 2 3 4 0 -40 5 -20 0 20 40 60 Ambient temperature Ta( C) Forward voltage(V) Fig.5 Relative luminous intensity vs. forward current Fig.6 Radiation diagram 0 2.0 10 20 30 1.5 Relative radiant intensity Relative luminous intensity (@20mA) 60 Fig.4 Relative luminous intensity vs. ambient temperature Fig.3 Forward current vs. forward voltage 0 40 Ambient temperature Ta( C) 1.0 0.5 1.0 40 0.9 50 0.8 60 70 0.7 80 90 0 10 20 30 40 50 0.5 0.3 0.1 0.2 0.4 0.6 Forward current (mA) 4 Copyright© 2019 Orient Tech Corporation,All rights Reserved. Ver, A0 SHENZHEN ORIENT ELECTRONICS CO. ,LTD. ORH-G37A 7. Judgment criteria of failure for the reliability Measuring items Symbol Measuring conditions Judgement criteria for failure Forward voltage VF ( V) IF=20mA Over Ux1.2 Reverse current IR(uA) VR=5V Over Ux2 Luminous intensity Iv ( mcd ) IF=20mA Below SX0.5 Note: 1).U means the upper limit of specified characteristics. S means initial value. 2).Measurment shall be taken between 2 hours and after the test pieces have been returned to normal ambient conditions after completion of each test. 8. Bin Limits In t e n s i t y Bi n Li m i t s (A t 20 mA ) BI N CO D E Mi n . (m c d ) Ma x . (m c d ) Q 800 900 W 900 1000 E 1000 11 0 0 To l e r a n c e fo r ea c h Bi n li m i t is ± 15 % . Co l o r Bi n Li m i t s (A t 20 mA ) BI N CO D E Mi n . ( v ) Ma x . ( v ) 1 522 52 5 2 525 52 8 3 528 53 1 To l e r a n c e fo r ea c h Bi n li m i t is ± 1n m . 5 Copyright© 2019 Orient Tech Corporation,All rights Reserved. Ver, A0 SHENZHEN ORIENT ELECTRONICS CO. ,LTD. ORH-G37A V F Bi n Li m i t s (A t 20 mA ) BI N CO D E Mi n . ( v ) Ma x . ( v ) S 2.8 2.9 D 2.9 3.0 F 3.0 3.1 G 3.1 3.2 H 3.2 3.3 To l e r a n c e fo r ea c h Bi n li m i t is ± 0. 0 5 V. 9. BI N ： x x x VF BIN CO DE Co lor BIN CODE Intensity BIN CODE 6 Copyright© 2019 Orient Tech Corporation,All rights Reserved. Ver, A0 SHENZHEN ORIENT ELECTRONICS CO. ,LTD. ORH-G37A 10.Tapping and packaging specifications(Units: mm) 7 Copyright© 2019 Orient Tech Corporation,All rights Reserved. Ver, A0 SHENZHEN ORIENT ELECTRONICS CO. ,LTD. ORH-G37A 11.Package Method:(unit:mm) 12.Package and Label of Products: (1) Package: Products are packed in one bag of 3000 pcs (one taping reel) and a label is attached on each bag. (2) Label: ORIENT LOGO Part No. Quantity BIN Sealing Date 8 Copyright© 2019 Orient Tech Corporation,All rights Reserved. Ver, A0 SHENZHEN ORIENT ELECTRONICS CO. ,LTD. ORH-G37A 13.Reliability Test Classification Test Item Operation Life Endurance Test High Temperature High Humidity Storage High Temperature Storage Low Temperature Storage Temperature Cycling Reference Standard MIL-STD-750:1026 MIL-STD-883:1005 JIS-C-7021 :B-1 MIL-STD-202:103B JIS-C-7021 :B-11 MIL-STD-883:1008 JIS-C-7021 :B-10 JIS-C-7021 :B-12 MIL-STD-202:107D MIL-STD-750:1051 MIL-STD-883:1010 JIS-C-7021 :A-4 MIL-STD-202:107D Environmental Thermal Shock MIL-STD-750:1051 Test MIL-STD-883:1011 Solder Resistance MIL-STD-202:201A MIL-STD-750:2031 JIS-C-7021 :A-1 Test Conditions Connect with a power If=20mA Ta=Under room temperature Test time=1,000hrs Ta=+65℃±5℃ RH=90%-95% Test time=240hrs High Ta=+85℃±5℃ Test time=1,000hrs Low Ta=-40℃±5℃ Test time=1,000hrs -40℃ ~ +25℃ ~ +85℃ ~ +25℃ 60min 20min 60min 20min Test Time=5cycle -40℃±5℃ ~+85℃±5℃ 20min 20min Test Time=10cycle Preheating： 140℃-160℃,within 2 minutes. Operation heating： 260℃(Max.), within 10seconds. (Max.) 9 Copyright© 2019 Orient Tech Corporation,All rights Reserved. Result 0/20 0/20 0/20 0/20 0/20 0/20 0/20 Ver, A0 SHENZHEN ORIENT ELECTRONICS CO. ,LTD. ORH-G37A 14. Soldering : 1). Manual Of Soldering The temperature of the iron tip should not be higher than 300 ℃ (572 ℉ ) and Soldering within 3 seconds per solder-land is to be observed. 2). Reflow Soldering Preheating : 140℃~160℃±5℃,within 2 minutes. Operation heating : 260℃(Max.) within 10 seconds.(Max) Gradual Cooling (Avoid quenching). 10 SEC. MAX. Temperature 140~160℃ 260℃ MAX. 4℃ /SEC. MAX. 4℃ /SEC. MAX. OVER 2 MIN. Time 15. Handling : Care must be taken not to cause to the epoxy resin portion of ORIENTLEDs while it is exposed to high temperature. Care must be taken not rub the epoxy resin portion of ORIENT LEDs with hard or sharp article such as the sand blast and the metal hook. 16. Notes for designing: Care must be taken to provide the current limiting resistor in the circuit so as to drive the ORIENT LEDs within the rated figures. Also, caution should be taken not to overload ORIENT LEDs with instantaneous voltage at the turning ON and OFF of the circuit. When using the pulse drive care must be taken to keep the average current within the rated figures. Also, the circuit should be designed so as be subjected to reverse voltage when turning off the ORIENT LEDs. 10 Copyright© 2019 Orient Tech Corporation,All rights Reserved. Ver, A0 SHENZHEN ORIENT ELECTRONICS CO. ,LTD. ORH-G37A 17. Storage: In order to avoid the absorption of moisture, it is recommended to solder ORIENT LEDs as soon as possible after unpacking the sealed envelope. If the envelope is still packed, to store it in the environment as following: (1) Temperature : 5℃-30℃(41℉)Humidity : RH 60﹪Max. (2) After this bag is opened, devices that will be applied to infrared reflow, vapor-phase reflow, or equivalent soldering process must be: a....Completed within 24 hours. b....Stored at less than 30% RH. (3) Devices require baking before mounting, if: (2) a or (2) b is not met. (4) If baking is required, devices must be baked under below conditions: 12 hours at 60℃±3℃. 11 Copyright© 2019 Orient Tech Corporation,All rights Reserved. Ver, A0