AP6212

正基科技股份有限公司 產品規格書 SPECIFICATION PRODUCT NAME： AP6212 (HF) SPEC. NO.： REV： DATE： PREPARED 保存期限:最新版本 2.3 10.08. 2018 REVIEW PM QA APPROVED DCC ISSUE From NO.:C-RD-047B AMPAK AP6212 WiFi + Bluetooth 4.1 + FM SIP Module Spec Sheet AMPAK Technology Inc. Doc. NO: www.ampak.com.tw Proprietary & Confidential Information Revision History Date Revision Content Revised Version By 2017/04/28 Refer to the earlier release for detailed revision history. Richard 1.9 2017/06/14 - Modify FM spec. - Add BT modulation 8DPSK Richard 2.0 2017/09/07 - Modify Recommended Reflow Profile Richard 2.1 2017/09/29 - Add Packing Dimension photo Beth 2.2 2018/10/08 - Modify Operating Temperature. Richard 2.3 AMPAK Technology Inc. Doc. NO: www.ampak.com.tw Proprietary & Confidential Information 1 AP6212 Datasheet Contents 1. Introduction .......................................................................................................... 3 2. Features ................................................................................................................ 4 3. Deliverables .......................................................................................................... 5 3.1 Deliverables .................................................................................................... 5 3.2 Regulatory certifications ................................................................................. 5 4. General Specification .......................................................................................... 6 4.1 General Specification ...................................................................................... 6 4.2 Voltages .......................................................................................................... 6 4.2.1 Absolute Maximum Ratings .................................................................... 6 4.2.2 Recommended Operating Rating ........................................................... 6 5. WiFi RF Specification ......................................................................................... 7 5.1 2.4GHz RF Specification................................................................................. 7 6. Bluetooth Specification...................................................................................... 9 6.1 Bluetooth Specification ................................................................................... 9 7. FM Specification ............................................................................................... 10 7.1 FM Specification ........................................................................................... 10 8. Pin Assignments ............................................................................................... 11 8.1 Pin Outline .................................................................................................... 11 8.2 Pin Definition ................................................................................................ 11 9. Dimensions ....................................................................................................... 13 9.1 Physical Dimensions..................................................................................... 13 9.2 Layout Recommendation .............................................................................. 14 10. External clock reference .................................................................................. 15 10.1 SDIO Pin Description .................................................................................. 15 11. Host Interface Timing Diagram ........................................................................ 16 11.1 Power-up Sequence Timing Diagram ......................................................... 16 11.2 SDIO Default Mode Timing Diagram ........................................................... 18 11.3 SDIO High Speed Mode Timing Diagram.................................................... 19 12. Recommended Reflow Profile ......................................................................... 20 13. Package Information ........................................................................................ 23 13.1 Label ........................................................................................................... 23 13.2 Dimension................................................................................................... 24 13.3 MSL Level / Storage Condition ................................................................... 26 AMPAK Technology Inc. Doc. NO: www.ampak.com.tw Proprietary & Confidential Information 2 AP6212 Datasheet 1. Introduction AMPAK Technology would like to announce a low-cost and low-power consumption module which has all of the WiFi, Bluetooth functionalities. The highly integrated module makes the possibilities of web browsing, VoIP, Bluetooth headsets and other applications. With seamless roaming capabilities and advanced security, also could interact with different vendors’ 802.11b/g/n Access Points in the wireless LAN. The wireless module complies with IEEE 802.11 b/g/n standard and it can achieve up to a speed of 72.2Mbps with single stream in 802.11n draft, 54Mbps as specified in IEEE 802.11g, or 11Mbps for IEEE 802.11b to connect to the wireless LAN. The integrated module provides SDIO interface for WiFi, UART / I2S / PCM interface for Bluetooth. This compact module is a total solution for a combination of WiFi + BT technologies. The module is specifically developed for Smart phones and Portable devices. AMPAK Technology Inc. Doc. NO: www.ampak.com.tw Proprietary & Confidential Information 3 AP6212 Datasheet 2. Features         802.11b/g/n single-band radio Bluetooth V4.1 with integrated Class 1.5 PA and Low Energy (BLE) support Concurrent Bluetooth and WLAN operation Simultaneous BT/WLAN receive with single antenna WLAN host interface options: - SDIO v2.0 — up to 50 MHz clock rate BT host digital interface: - UART (up to 4 Mbps) IEEE Co-existence technologies are integrated die solution ECI — enhanced coexistence support, ability to coordinate BT SCO transmissions around WLAN receives A simplified block diagram of the module is depicted in the figure below. AMPAK Technology Inc. Doc. NO: www.ampak.com.tw Proprietary & Confidential Information 4 AP6212 Datasheet 3. Deliverables 3.1 Deliverables The following products and software will be part of the product.  Module with packaging  Evaluation Kits  Software utility for integration, performance test.  Product Datasheet.  Agency certified pre-tested report with the adapter board. 3.2 Regulatory certifications The product delivery is a pre-tested module, without the module level certification. For module approval, the platform’s antennas are required for the certification. AMPAK Technology Inc. Doc. NO: www.ampak.com.tw Proprietary & Confidential Information 5 AP6212 Datasheet 4. General Specification 4.1 General Specification Model Name AP6212 Product Description Support WiFi/Bluetooth functionalities Dimension L x W x H: 12 x 12 x 1.5 (typical) mm WiFi Interface SDIOV 2.0 BT Interface UART / PCM Operating temperature a,b -30°C to 85°C Storage temperature -40°C to 85°C Humidity Operating Humidity 10% to 95% Non-Condensing Storage Humidity 5% to 95% Non-Condensing a. Operating temperature 65 to 85°C is fesable at condictional environment. Please examine the reliability on final product. b. Functionality is guaranteed across this range of temperature. Optimal RF performance as specified in the data sheet, however, is guaranteed only for –10°C to 55°C. 4.2 Voltages 4.2.1 Absolute Maximum Ratings Symbol VBAT VDDIO Description Min. Max. Unit Input supply Voltage -0.5 5.5 V Digital/Bluetooth/SDIO/ I/O Voltage -0.5 3.6 V 4.2.2 Recommended Operating Rating The module requires two power supplies: VBAT and VDDIO. Min. Typ. Max. Unit -30 25 85 VBAT 3.0 3.3 3.8 deg.C V VDDIO 1.7 3.3 3.6 V Operating Temperature AMPAK Technology Inc. Doc. NO: www.ampak.com.tw Proprietary & Confidential Information 6 AP6212 Datasheet 5. WiFi RF Specification 5.1 2.4GHz RF Specification Conditions : VBAT=3.3V ; VDDIO=3.3V ; Temp:25°C Feature Description WLAN Standard IEEE 802.11b/g/n, WiFi compliant Frequency Range 2.400 GHz ~ 2.4835 GHz (2.4 GHz ISM Band) Number of Channels 2.4GHz：Ch1 ~ Ch13 Modulation 802.11b : DQPSK, DBPSK, CCK 802.11 g/n : OFDM /64-QAM,16-QAM, QPSK, BPSK 802.11b /11Mbps : 16 dBm ± 1.5 dB @ EVM  -9dB Output Power 802.11g /54Mbps : 15 dBm ± 1.5 dB @ EVM  -25dB 802.11n /65Mbps : 14 dBm ± 1.5 dB @ EVM  -27dB - MCS=0 PER @ -85 dBm, +/- 2dB - MCS=1 PER @ -84 dBm, +/- 2dB - MCS=2 PER @ -82 dBm, +/- 2dB - MCS=3 PER @ -80 dBm, +/- 2dB - MCS=4 PER @ -77 dBm, +/- 2dB - MCS=5 PER @ -73 dBm, +/- 2dB - MCS=6 PER @ -71 dBm, +/- 2dB - MCS=7 PER @ -68 dBm, +/- 2dB - 6Mbps PER @ -86 dBm, +/- 2dB - 9Mbps PER @ -85 dBm, +/- 2dB - 12Mbps PER @ -85 dBm, +/- 2dB Receive Sensitivity (11g) @10% PER - 18Mbps PER @ -83 dBm, +/- 2dB 24Mbps PER @ -81 dBm, +/- 2dB - 36Mbps PER @ -78 dBm, +/- 2dB - 48Mbps PER @ -73 dBm, +/- 2dB - 54Mbps PER @ -71 dBm, +/- 2dB - 1Mbps PER @ -90 dBm, +/- 2dB Receive Sensitivity (11b) @8% PER - 2Mbps PER @ -88 dBm, +/- 2dB 5.5Mbps PER @ -87 dBm, +/- 2dB 11Mbps PER @ -84 dBm, +/- 2dB Receive Sensitivity (11n,20MHz) @10% PER Data Rate AMPAK Technology Inc. Doc. NO: 802.11b : 1, 2, 5.5, 11Mbps 802.11g : 6, 9, 12, 18, 24, 36, 48, 54Mbps www.ampak.com.tw Proprietary & Confidential Information 7 AP6212 Datasheet Data Rate (20MHz ,Long GI,800ns) 802.11n: 6.5, 13, 19.5, 26, 39, 52, 58.5, 65Mbps Data Rate (20MHz ,short GI,400ns) 802.11n : 7.2, 14.4, 21.7, 28.9, 43.3, 57.8, 65,72.2Mbps Maximum Input Level Antenna Reference AMPAK Technology Inc. Doc. NO: 802.11b : -10 dBm 802.11g/n : -20 dBm Small antennas with 0~2 dBi peak gain www.ampak.com.tw Proprietary & Confidential Information 8 AP6212 Datasheet 6. Bluetooth Specification 6.1 Bluetooth Specification Conditions : VBAT=3.3V ; VDDIO=3.3V ; Temp:25°C Feature Description General Specification Bluetooth Standard Bluetooth V4.1 of 1, 2 and 3 Mbps. Host Interface UART Antenna Reference Small antennas with 0~2 dBi peak gain Frequency Band 2402MHz ~ 2480MHz Number of Channels 79 channels Modulation FHSS, GFSK, DPSK, DQPSK, 8DPSK RF Specification Min. Typical. Max. 7 Sensitivity @ BER=0.1% for GFSK (1Mbps) -86 dBm Sensitivity @ BER=0.01% for π/4-DQPSK (2Mbps) -86 dBm Sensitivity @ BER=0.01% for 8DPSK (3Mbps) -80 dBm GFSK (1Mbps):-20dBm Maximum Input Level π/4-DQPSK (2Mbps) :-20dBm 8DPSK (3Mbps) :-20dBm ：Output power can be configured by HCD firmware. AMPAK Technology Inc. Doc. NO: www.ampak.com.tw Proprietary & Confidential Information 9 AP6212 Datasheet 7. FM Specification 7.1 FM Specification Conditions : VBAT=3.3V ; VDDIO=3.3V ; Temp:25°C Feature Description General Specification Frequency Band 65MHz-108MHz Host Interface HCI UART, I2S/PCM Frequency step Minimum 10 KHz Analog Audio output load RL>30KΩ, CL>20pF Characteristics Condition MIN FM only, Sensitivity, SNR ≧ 26dB Receiver Spec. Audio harmonic distortion, mono (Vin=2Mv EMF, △f=75KHz) Maximum SNR (fmod=1KHz,△f=22.5KHz, BW=300Hz to 15KHz) Maximum input level, SNR > 26dB AMPAK Technology Inc. Doc. NO: www.ampak.com.tw TYP MAX UNIT -5 dBuV fmod= 1KHz 0.8 fmod= 3KHz 0.8 mono % 69 dB Stereo 64 107 dBuV Proprietary & Confidential Information 10 AP6212 Datasheet 8. Pin Assignments 8.1 Pin Outline < TOP VIEW > 8.2 Pin Definition NO Name Type Description 1 GND － Ground connections 2 WL_BT_ANT I/O RF I/O port 3 GND － Ground connections 4 FM_RX I FM radio RF input antenna port 5 NC － Floating (Don’t connected to ground) 6 BT_WAKE I HOST wake-up Bluetooth device 7 BT_HOST_WAKE O Bluetooth device to wake-up HOST 8 NC － Floating (Don’t connected to ground) 9 VBAT P Main power voltage source input 10 XTAL_IN I Crystal input 11 XTAL_OUT O Crystal output 12 WL_REG_ON I Internal regulators power enable/disable 13 WL_HOST_WAKE O WLAN to wake-up HOST AMPAK Technology Inc. Doc. NO: www.ampak.com.tw Proprietary & Confidential Information 11 AP6212 Datasheet 14 SDIO_DATA_2 I/O SDIO data line 2 15 SDIO_DATA_3 I/O SDIO data line 3 16 SDIO_DATA_CMD I/O SDIO command line 17 SDIO_DATA_CLK I/O SDIO clock line 18 SDIO_DATA_0 I/O SDIO data line 0 19 SDIO_DATA_1 I/O SDIO data line 1 20 GND － Ground connections 21 VIN_LDO_OUT P Internal Buck voltage generation pin 22 VDDIO P I/O Voltage supply input 23 VIN_LDO P Internal Buck voltage generation pin 24 LPO I External Low Power Clock input (32.768KHz) 25 PCM_OUT O PCM Data output 26 PCM_CLK I/O PCM clock 27 PCM_IN I PCM data input 28 PCM_SYNC I/O PCM sync signal 29 NC － Floating (Don’t connected to ground) 30 NC － Floating (Don’t connected to ground) 31 GND － Ground connections 32 NC － Floating (Don’t connected to ground) 33 GND － Ground connections 34 BT_RST_N I Low asserting reset for Bluetooth core 35 NC － Floating (Don’t connected to ground) 36 GND － Ground connections 37 NC － Floating (Don’t connected to ground) 38 NC － Floating (Don’t connected to ground) 39 GPIO2 I/O WiFi Co-existence pin with LTE 40 GPIO1 I/O WiFi Co-existence pin with LTE 41 UART_RTS_N O Bluetooth/FM UART interface 42 UART_TXD O Bluetooth/FM UART interface 43 UART_RXD I Bluetooth/FM UART interface 44 UART_CTS_N I Bluetooth/FM UART interface 45 TP1 O FM Analog AUDIO left output 46 TP2 O FM Analog AUDIO right output 47 TP3 (NC) － Floating (Don’t connected to ground) AMPAK Technology Inc. Doc. NO: www.ampak.com.tw Proprietary & Confidential Information 12 AP6212 Datasheet 9. Dimensions 9.1 Physical Dimensions (Unit: mm) < TOP VIEW > < Side View > < TOP VIEW > AMPAK Technology Inc. Doc. NO: www.ampak.com.tw Proprietary & Confidential Information 13 AP6212 Datasheet 9.2 Layout Recommendation (Unit: mm) < TOP VIEW > AMPAK Technology Inc. Doc. NO: www.ampak.com.tw Proprietary & Confidential Information 14 AP6212 Datasheet 10. External clock reference External LPO signal characteristics Parameter Specification Units kHz Frequency accuracy 32.768  30 ppm Duty cycle 30 - 70 % 400~3300 mV, p-p Square-wave - Nominal input frequency Module input Signal Level Signal type Input impedance >100k