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SDXXC
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Compiance
FEATURES
IEC61000-4-2 (ESD) ±30kV (Contact)
±30kV (Air)
IEC61000-4-4 (EFT) 40A (5/50ηs)
350 Watts Peak Pulse Power per (tp=8/20μs)
Protects one I/O line (bidirectional)
PIN CONFIGURATION
Low clamping voltage
Working voltages:
3.3 V,5V,8V,12V,15V,18V,20V,24V,36V
Low leakage current
MACHANICAL DATA
SOD-323 package
Flammability Rating: UL 94V-0
Packaging: Tape and Reel
High temperature soldering guaranteed:
260℃/10s
Reel size: 7 inch
MSL 1
APPLICATIONS
Cell Phone Handsets and Accessories
Microprocessor based equipment
SOD-323
Personal Digital Assistants (PDA’s)
Notebooks, Desktops, and Servers
Portable Instrumentation
Networking and Telecom
Serial and Parallel Ports.
Peripherals
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ABSOLUTE MAXIMUM RATING
Symbol
Parameter
Value
Units
VESD
ESD per IEC 61000-4-2 (Contact)
ESD per IEC 61000-4-2 (Air)
±30
±30
kV
PPP
Peak Pulse Power (8/20μs)
350
W
TOPT
Operating Temperature
-55/+150
C
TSTG
Storage Temperature
-55/+150
C
260 (10 sec.)
C
TL
Lead Soldering Temperature
ELECTRICAL CHARACTERISTICS (Tamb=25C)
P/N
MARK
VRWM
(V)
(max.)
VB
(V)
(min.)
IT
(mA)
VC@1A
(V)
(max.)
VC
(V)
(max.) (@A)
IR
(µA)
(max.)
CT
(pF)
(max.)
SD03C
2A
3.3
4.0
1
7.5
16.0
20
40
450
SD05C
2B
5.0
6.0
1
9.8
18.0
17
10
200
SD08C
2C
8.0
8.5
1
13.4
24.0
15
2
120
SD12C
2D
12.0
13.3
1
19.0
32.0
11
1
75
SD15C
2J
15.0
16.7
1
24.0
38.0
10
1
68
SD18C
2K
18.0
20.0
1
29.0
45.0
9
1
57
SD20C
2L
20.0
22.3
1
35.0
50.0
8
1
52
SD24C
2H
24.0
26.7
1
43.0
52.0
7
1
50
SD36C
2N
36.0
40.0
1
60.0
75.0
4.5
1
35
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SDXXC
Semiconductor
Compiance
PACKAGE MECHANICAL DATA
REEL SPECIFICATION
P/N
SDXXC
PKG
SOD-323
QTY
3000
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SDXXC
Semiconductor
Compiance
Attention
■ Any and all MSKSEMI Semiconductor products described or contained herein do not have specifications
that can handle applications that require extremely high levels of reliability, such as life-support systems,
aircraft's control systems, or other applications whose failure can be reasonably expected to result in serious
physical and/or material damage. Consult with your MSKSEMI Semiconductor representative
nearest
you
before using any MSKSEMI Semiconductor products described or contained herein in such applications.
■ MSKSEMI Semiconductor assumes no responsibility for equipment failures that result from using products
at values that exceed, even momentarily, rated values (such as maximum ratings, operating condition ranges, or
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orcontained herein.
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performance, characteristics, and functions of the described products in the independent state, and are not
guarantees of the performance, characteristics, and functions of the described products as mounted in the
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guaranteed for volume production. MSKSEMI Semiconductor believes information herein is accurate and reliable,
but no guarantees are made or implied regarding its use or any infringementsof intellectual property rights or
other rightsof third parties.
■ Any and all information described or contained herein are subject to change without notice due to
product/technology improvement, etc. Whendesigning equipment, referto the "Delivery Specification" for the
MSKSEMI Semiconductor productthat you intend to use.
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