ESD5B5.0ST1G

www.msksemi.com ESD5B5.0ST1G Semiconductor Compiance FEATURES  IEC61000-4-2 (ESD) ±30kV (Contact), ±30kV (Air)  IEC61000-4-4 (EFT) 40A (5/50ηs)  Peak power dissipation: 75W (8/20μs)  Protects one I/O line  Low clamping voltage  Working voltages : 5V  Low leakage current MACHANICAL DATA  SOD-523 package  Terminals: Tin plated, solderable per MIL-STD-750, method 2026  Packaging: Tape and Reel  Reel size: 7 inch  MSL3 SOD-523 APPLICATIONS  High Speed Line :USB1.0/2.0, VGA, DVI, SDI,  Serial and Parallel Ports  Notebooks, Desktops, Servers  Projection TV  Cellular handsets and accessories  Portable instrumentation  Peripherals ABSOLUTE MAXIMUM RATING Symbol Parameter Value Units VESD ESD per IEC 61000-4-2 (Contact) ESD per IEC 61000-4-2 (Air) ±30 ±30 kV PPP Peak Pulse Power (8/20μs) 75 W TOPT Operating Temperature -40~150 C TSTG Storage Temperature -40~150 C www.msksemi.com ESD5B5.0ST1G Semiconductor Compiance Typ Max Units 5.0 V 9.0 V ELECTRICAL CHARACTERISTICS (Tamb=25C) Symbol Parameter Test Condition Min VRWM Reverse Working Voltage VBR Reverse Breakdown Voltage IT = 1mA IR Reverse Leakage Current VRWM = 5V 1.0 μA VC Clamping Voltage IPP = 1A, tp = 8/20μs 9.5 V VC Clamping Voltage IPPmax = 5A , tp = 8/20μs 15.0 V CJ Junction Capacitance VR = 0V, f = 1MHz 15 pF 5.6 ELECTRICAL CHARACTERISTICS CURVE www.msksemi.com ESD5B5.0ST1G Semiconductor PACKAGE MECHANICAL DATA 6\PERO A A1 b c D E E1 E2 L  'LPHQVLRQV,Q0LOOLPHWHUV 0LQ 0D[ 0.510 0.770 0.500 0.700 0.250 0.350 0.080 0.150 0.750 0.850 1.100 1.300 1.500 1.700 0.200 REF 0.010 0.070 7° REF 'LPHQVLRQV,Q,QFKHV 0LQ 0D[ 0.020 0.031 0.020 0.028 0.010 0.014 0.003 0.006 0.030 0.033 0.043 0.051 0.059 0.067 0.008 REF 0.001 0.003 7° REF REEL SPECIFICATION P/N ESD5B5.0ST1G PKG SOD-523 QTY 3000 Compiance ESD5B5.0ST1G Semiconductor Compiance Attention ■ Any and all MSKSEMI Semiconductor products described or contained herein do not have specifications that can handle applications that require extremely high levels of reliability, such as life-support systems, aircraft's control systems, or other applications whose failure can be reasonably expected to result in serious physical and/or material damage. 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