SM4007PL

www.msksemi.com SM4001PL THRU SM4007PL Semiconductor FEATURES Compiance MECHANICAL DATA Glass passivated device Ideal for surface mouted applications Low reverse leakage Metallurgically bonded construction High temperature soldering guaranteed: 250 C/10 seconds,0.375”(9.5mm) lead length, 5 lbs. (2.3kg) tension Case: JEDEC SOD-123FL molded plastic body over passivated chip Terminals: Solderable per MIL-STD-750, Method 2026 Polarity: Color band denotes cathode end Mounting Position: Any Weight:0.0007 ounce, 0.02 grams MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS Ratings at 25 C ambient temperature unless otherwise specified. Single phase half-wave 60Hz,resistive or inductive load,for capacitive load current derate by 20%. P/N MARK Maximum repetitive peak reverse voltage VRRM Maximum RMS voltage Maximum DC blocking voltage Maximum average forward rectified current at TA=65 C (NOTE 1) Peak forward surge current 8.3ms single half sine-wave superimposed on rated load (JEDEC Method) TL=25 C Maximum instantaneous forward voltage at 1.0A Maximum DC reverse current TA=25 C at rated DC blocking voltage TA=125 C Typical junction capacitance (NOTE 2) Typical thermal resistance (NOTE 3) Operating junction and storage temperature range SM4001 SM4002 PL PL A2 A1 SM4003 SM4004 PL PL A3 A4 SM4005 PL A5 SM4006 PL A6 SM4007 PL A7 UNITS 50 100 200 400 600 800 1000 VOLTS VRMS 35 70 140 280 420 560 700 VOLTS VDC 50 100 200 400 600 800 1000 VOLTS I(AV) 1.0 Amp IFSM 25.0 Amps VF 1.0 Volts IR 10.0 50.0 A 4 180 -55 to +150 pF K/W C CJ RJA TJ,TSTG Note: 1.Averaged over any 20ms period. 2. Measured at 1MHz and applied reverse voltage of 4.0V D.C. 3. Thermal resistance from junction to ambient at 0.375” (9.5mm)lead length,P.C.B. mounted www.msksemi.com SM4001PL THRU SM4007PL Semiconductor FIG.2-- TYPICALJUNCTIONCAPACITANCE 1000 10 TJ = 150°C CAPACITANCE, pF 9 TJ = 25°C m AMPERES INSTANTANEOUS FORWARDCURRENT FIG.1 --TYPICALFORWARDCHARACTERISTIC TJ = 100°C 8 7 6 5 4 3 2 1 100 600 700 800 900 1000 0 1100 INSTANTANEOUSFORWARDVOLTAGE,mV TJ = 150C 10 TJ = 125C TJ =100C 1 TJ = 75C TJ =50C 0.1 TJ =25C 0.01 0 100 200 300 400 500 600 700 800 900 INSTANTANEOUSREVERSEVOLTAGE,V 5 10 15 20 25 30 35 40 FIG.4 -- FORWARDDERATINGCURVE AVERAGE FORWARD CURRENT, AMPERES 100 0 REVERSEVOLTAGE,VOLTS FIG.3 --TYPICAL INSTANTANEOUS REVERSE CHARACTERISTICS  AMPERES INSTANTANEOUS REVERSECURRENT Compiance 1.2 Resistive or Inductive Load 1.0 0.8 0.6 0.4 0.2 0 3.0 x 3.0mm 40 µm Thick Copper Pad Areas 0 20 40 60 80 100 120 140 160 AMBIENT TEMPERATEU,R www.msksemi.com SM4001PL THRU SM4007PL Semiconductor Compiance 1.8± 0.3 0.95 ±0.25 PACKAGE MECHANICAL DATA 1.15±0.25 0.05-0.30 2.75 ±0.25 0.6±0.3 3.7 ±0.30 Dimensions in millimeters 1.4 2.85 1.2 REEL SPECIFICATION P/N SM4001PL THRU SM4007PL PKG SOD-123FL QTY 3000 www.msksemi.com SM4001PL THRU SM4007PL Semiconductor Compiance Attention ■ Any and all MSKSEMI Semiconductor products described or contained herein do not have specifications that can handle applications that require extremely high levels of reliability, such as life-support systems, aircraft's control systems, or other applications whose failure can be reasonably expected to result in serious physical and/or material damage. 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