SOD4007-MS

www.msksemi.com SOD4001-MS THRU SOD4007-MS Semiconductor FEATURES Compiance MECHANICAL DATA Glass passivated device Ideal for surface mouted applications Low reverse leakage Metallurgically bonded construction High temperature soldering guaranteed: 250 C/10 seconds,0.375”(9.5mm) lead length, 5 lbs. (2.3kg) tension Case: JEDEC SOD-123FL molded plastic body over passivated chip Terminals: Solderable per MIL-STD-750, Method 2026 Polarity: Color band denotes cathode end Mounting Position: Any Weight:0.0007 ounce, 0.02 grams MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS Ratings at 25 C ambient temperature unless otherwise specified. Single phase half-wave 60Hz,resistive or inductive load,for capacitive load current derate by 20%. P/N SOD4001 SOD4002 SOD4003 SOD4004 SOD4005 SOD4006 SOD4007 UNITS -MS -MS -MS -MS -MS -MS -MS A3 A5 A6 A7 VRRM A1 1 A2 Maximum repetitive peak reverse voltage 50 100 200 400 600 800 1000 VOLTS Maximum RMS voltage VRMS 35 70 140 280 420 560 700 VOLTS Maximum DC blocking voltage VDC 50 100 200 400 600 800 1000 VOLTS MARK Maximum average forward rectified current I(AV) at TA=65 C (NOTE 1) Peak forward surge current IFSM 8.3ms single half sine-wave superimposed on rated load (JEDEC Method) TL=25 C VF Maximum instantaneous forward voltage at 1.0A Maximum DC reverse current TA=25 C IR at rated DC blocking voltage TA=125 C Typical junction capacitance (NOTE 2) CJ Typical thermal resistance (NOTE 3) RJA Operating junction and storage temperature range TJ,TSTG A4 1.0 Amp 25.0 Amps 1.0 Volts 10.0 50.0 A 4 180 -55 to +150 pF K/W C Note: 1.Averaged over any 20ms period. 2. Measured at 1MHz and applied reverse voltage of 4.0V D.C. 3. Thermal resistance from junction to ambient at 0.375” (9.5mm)lead length,P.C.B. mounted www.msksemi.com SOD4001-MS THRU SOD4007-MS Semiconductor FIG.2-- TYPICALJUNCTIONCAPACITANCE 1000 10 TJ = 150°C CAPACITANCE, pF 9 TJ = 25°C m AMPERES INSTANTANEOUS FORWARDCURRENT FIG.1 --TYPICALFORWARDCHARACTERISTIC TJ = 100°C 8 7 6 5 4 3 2 1 100 600 700 800 900 1000 0 1100 INSTANTANEOUSFORWARDVOLTAGE,mV TJ = 150C 10 TJ = 125C TJ =100C 1 TJ = 75C TJ =50C 0.1 TJ =25C 0.01 0 100 200 300 400 500 600 700 800 900 INSTANTANEOUSREVERSEVOLTAGE,V 5 10 15 20 25 30 35 40 FIG.4 -- FORWARDDERATINGCURVE AVERAGE FORWARD CURRENT, AMPERES 100 0 REVERSEVOLTAGE,VOLTS FIG.3 --TYPICAL INSTANTANEOUS REVERSE CHARACTERISTICS  AMPERES INSTANTANEOUS REVERSECURRENT Compiance 1.2 Resistive or Inductive Load 1.0 0.8 0.6 0.4 0.2 0 3.0 x 3.0mm 40 µm Thick Copper Pad Areas 0 20 40 60 80 100 120 140 160 AMBIENT TEMPERATEU,R www.msksemi.com SOD4001-MS THRU SOD4007-MS Semiconductor Compiance 1.8± 0.3 0.95 ±0.25 PACKAGE MECHANICAL DATA 1.15±0.25 0.05-0.30 2.75 ±0.25 0.6±0.3 3.7 ±0.30 Dimensions in millimeters 1.4 2.85 1.2 REEL SPECIFICATION P/N SOD4001-MS THRU SOD4007-MS PKG SOD-123FL QTY 3000 www.msksemi.com SOD4001-MS THRU SOD4007-MS Semiconductor Compiance Attention ■ Any and all MSKSEMI Semiconductor products described or contained herein do not have specifications that can handle applications that require extremely high levels of reliability, such as life-support systems, aircraft's control systems, or other applications whose failure can be reasonably expected to result in serious physical and/or material damage. 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