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ESD5ZXXXT1G
Semiconductor
Compiance
Applications
Cellular phones
Portable devices
Digital cameras
Power supplies
Features
SOD-523
Small Body Outline Dimensions
Low Body Height
Stand−off Voltage: 2.5 V − 12 V
Peak Power up to 200 Watts @ 8 x 20 _s Pulse
Low Leakage
Response Time is Typically < 1 ns
ESD Rating of Class 3 (> 16 kV) per Human
Body Model
IEC61000−4−2 Level 4 ESD Protection
IEC61000−4−4 Level 4 EFT Protection
We declare that the material of product
compliance with RoHS requirements.
S- Prefix for Automotive and Other Applications
Requiring Unique Site and Control Change
Requirements; AEC-Q101 Qualified and PPAP Capable.
Absolute Ratings (Tamb=25°C )
Symbol
Parameter
Value
Units
PPP
Peak Pulse Power (tp = 8/20μs)
200
W
TL
Maximum lead temperature for soldering during 10s
260
°C
Tstg
Storage Temperature Range
-55 to +150
°C
Top
Operating Temperature Range
-40 to +125
°C
Tj
Maximum junction temperature
150
°C
±15
±8
KV
IEC61000-4-2 (ESD)
air discharge
contact discharge
IEC61000-4-4 (EFT)
ESD Voltage
40
Per Human Body Model
16
A
KV
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ESD5ZXXXT1G
Semiconductor
Electrical Parameter
Symbol
Parameter
IPP
Maximum Reverse Peak Pulse Current
VC
Clamping Voltage @ IPP
VRWM
Working Peak Reverse Voltage
IR
Maximum Reverse Leakage Current @ VRWM
IT
Test Current
VBR
Breakdown Voltage @ IT
IF
Forward Current
VF
Forward Voltage @ IF
Electrical Characteristics Ratings at 25°C ambient temperature unless otherwise specified.VF = 0.9V at IF = 10mA
P/N
Marking
VRWM
(V)
IR(uA)
VBR (V)@ IT
@ VRWM
(Note 1)
Max
Max
Min
mA
Typ
Max
IT
VC (V)
VC (V)
PPK
C
(W)*
(pF)
Max
Max
Typ
IPP
@ IPP=5 A* @ Max IPP* (A)*
ESD5Z2.5T1G
ESD5Z3.3T1G
ZD
2.5
6.0
4.0
1.0
6.5
10.9
11.0
120
145
ZE
3.3
1.0
5.0
1.0
8.4
14.1
11.2
158
105
ESD5Z5.0T1G
ZF
5.0
1.0
6.2
1.0
11.6
18.6
9.4
174
80
ESD5Z6.0T1G
ZG
6.0
1.0
6.8
1.0
12.4
20.5
8.8
181
70
ESD527.0T1G
ESD5Z12T1G
ZH
7.0
1.0
7.5
1.0
13.5
22.7
8.8
200
65
ZM
12
1.0
13.5
1.0
17
25
9.6
240
55
*Surge current waveform per Figure 1.
1. VBR is measured with a pluse test current IT at an ambient temperature of 25℃.
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ESD5ZXXXT1G
Semiconductor
PACKAGE MECHANICAL DATA
Symbol
A
A1
b
c
D
E
E1
E2
L
0
Dimensions In Millimeters
Min
Max
0.510
0.770
0.500
0.700
0.250
0.350
0.080
0.150
0.750
0.850
1.100
1.300
1.500
1.700
0.200 REF
0.010
0.070
7° REF
Dimensions In Inches
Min
Max
0.020
0.031
0.020
0.028
0.010
0.014
0.003
0.006
0.030
0.033
0.043
0.051
0.059
0.067
0.008 REF
0.001
0.003
7° REF
REEL SPECIFICATION
P/N
ESD5ZXXXT1G
PKG
SOD-523
QTY
3000
Compiance
ESD5ZXXXT1G
Semiconductor
Compiance
Attention
■ Any and all MSKSEMI Semiconductor products described or contained herein do not have specifications
that can handle applications that require extremely high levels of reliability, such as life-support systems,
aircraft's control systems, or other applications whose failure can be reasonably expected to result in serious
physical and/or material damage. Consult with your MSKSEMI Semiconductor representative
nearest
you
before using any MSKSEMI Semiconductor products described or contained herein in such applications.
■ MSKSEMI Semiconductor assumes no responsibility for equipment failures that result from using products
at values that exceed, even momentarily, rated values (such as maximum ratings, operating condition ranges, or
other parameters) listed in products specificationsof any andall MSKSEMI Semiconductor products described
orcontained herein.
■ Specifications of any and all MSKSEMI Semiconductor products described or contained herein stipulate the
performance, characteristics, and functions of the described products in the independent state, and are not
guarantees of the performance, characteristics, and functions of the described products as mounted in the
customer’s products or equipment. To verify symptoms and states that cannot be evaluated in an independent
device, the customer should always evaluate and test devices mounted in the customer’sproducts orequipment.
■ MSKSEMI Semiconductor. strives to supply high-quality high-reliability products. However, any and all
semiconductor products fail with someprobability. It is possiblethat these probabilistic failures could give rise to
accidents or events that could endanger human lives, that could give rise to smoke or fire, or that could cause
damage to other property. When designing equipment, adopt safety measures so that these kinds of accidents
or events cannot occur. Such measures include but are not limited to protective circuits anderror prevention
circuitsfor safedesign, redundant design, and structural design.
■ In the event that any or all MSKSEMI Semiconductor products(including technical data, services) described
or contained herein are controlled under any of applicable local export control laws and regulations, such
products must not be exported without obtaining the export license from theauthorities
concerned
in
accordance with the above law.
■ No part of this publication may be reproduced or transmitted in any form or by any means, electronic or
mechanical, including photocopying and recording, or any information storage or retrieval system, or otherwise,
without the prior written permission of MSKSEMI Semiconductor.
■ Information (including circuit diagrams and circuit parameters) herein is for example only ; it is not
guaranteed for volume production. MSKSEMI Semiconductor believes information herein is accurate and reliable,
but no guarantees are made or implied regarding its use or any infringementsof intellectual property rights or
other rightsof third parties.
■ Any and all information described or contained herein are subject to change without notice due to
product/technology improvement, etc. Whendesigning equipment, referto the "Delivery Specification" for the
MSKSEMI Semiconductor productthat you intend to use.
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