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GBLCXXC-MS
Semiconductor
Compiance
Features
350W peak pulse power (8/20μs)
Ultra low capacitance :1.0pF typical
Ultra low leakage:nA level
Low Operating:3.3V,5V,8V,12V,15V,24V
Low clamping voltage
Protects one power line or data line
Complies with following standards:
– IEC 61000-4-2 (ESD) immunity test
Air discharge: ±30kV
Contact discharge: ±30kV
– IEC61000-4-4 (EFT) 40A (5/50ns)
RoHS Compliant
Mechanical Characteristics
Package: SOD-323
Lead Finish: Matte Tin
Case Material: “Green” Molding Compound.
UL Flammability Classification Rating 94V-0
Moisture Sensitivity: Level 3 per J-STD-020
Terminal Connections: See Diagram Below
Marking Information: See Below
Circuit and Pin Schematic
SOD-323
Applications
USB Ports
Smart Phones
Wireless Systems
Ethernet 10/100/1000 Base T
Absolute Maximum Ratings (T A=25°C unless otherwise specified)
Parameter
ESD per IEC 61000−4−2 (Air)
ESD per IEC 61000−4−2 (Contact)
Operating Temperature Range
Storage Temperature Range
Symbol
VESD
Value
±30
±30
Unit
kV
TJ
−40 to +85
°C
Tstg
−55 to +150
°C
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GBLCXXC-MS
Semiconductor
Compiance
Electrical Characteristics (TA=25°C unless otherwise specified)
GBLC03C-MS
Parameter
Reverse Working Voltage
Breakdown Voltage
Symbol
Min
Typ
VRWM
VBR
Max
Unit
3.3
V
Test Condition
V
IT = 1mA
100
nA
VRWM = 3.3V
4
Reverse Leakage Current
IR
Clamping Voltage
VC
7
V
IPP = 1A (8 x 20µs pulse)
Clamping Voltage
VC
16
V
IPP = 20A (8 x 20µs pulse)
Peak Pulse Current
IPP
20
A
tp=8/20µs
Junction Capacitance
CJ
pF
VR = 0V, f = 1MHz
1
1
GBLC05C-MS
Parameter
Reverse Working Voltage
Breakdown Voltage
Symbol
Min
Typ
VRWM
VBR
Max
Unit
5
V
Test Condition
V
IT = 1mA
100
nA
VRWM = 5V
6
Reverse Leakage Current
IR
Clamping Voltage
VC
10
V
IPP = 1A (8 x 20µs pulse)
Clamping Voltage
VC
18
V
IPP = 18A (8 x 20µs pulse)
Peak Pulse Current
IPP
18
A
tp=8/20µs
Junction Capacitance
CJ
pF
VR = 0V, f = 1MHz
1
1
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GBLCXXC-MS
Semiconductor
Compiance
GBLC08C-MS
Parameter
Reverse Working Voltage
Breakdown Voltage
Symbol
Min
Typ
VRWM
VBR
Max
Unit
8
V
Test Condition
V
IT = 1mA
100
nA
VRWM = 8V
8.5
Reverse Leakage Current
IR
Clamping Voltage
VC
14
V
IPP = 1A (8 x 20µs pulse)
Clamping Voltage
VC
19
V
IPP = 13A (8 x 20µs pulse)
Peak Pulse Current
IPP
13
A
tp=8/20µs
Junction Capacitance
CJ
pF
VR = 0V, f = 1MHz
1
1
GBLC12C-MS
Parameter
Reverse Working Voltage
Breakdown Voltage
Symbol
Min
Typ
VRWM
VBR
Max
Unit
12
V
Test Condition
V
IT = 1mA
100
nA
VRWM = 12V
13.3
Reverse Leakage Current
IR
Clamping Voltage
VC
19
V
IPP = 1A (8 x 20µs pulse)
Clamping Voltage
VC
25
V
IPP = 10A (8 x 20µs pulse)
Peak Pulse Current
IPP
10
A
tp=8/20µs
Junction Capacitance
CJ
pF
VR = 0V, f = 1MHz
1
1
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GBLCXXC-MS
Semiconductor
Compiance
GBLC15C-MS
Parameter
Reverse Working Voltage
Breakdown Voltage
Symbol
Min
Typ
VRWM
VBR
Max
Unit
15
V
Test Condition
V
IT = 1mA
100
nA
VRWM = 15V
16.7
Reverse Leakage Current
IR
Clamping Voltage
VC
20
V
IPP = 1A (8 x 20µs pulse)
Clamping Voltage
VC
31
V
IPP = 8A (8 x 20µs pulse)
Peak Pulse Current
IPP
8
A
tp=8/20µs
Junction Capacitance
CJ
pF
VR = 0V, f = 1MHz
1
1
GBLC24C-MS
Parameter
Reverse Working Voltage
Breakdown Voltage
Symbol
Min
Typ
VRWM
VBR
Max
Unit
24
V
Test Condition
V
IT = 1mA
100
nA
VRWM = 24V
26.7
Reverse Leakage Current
IR
Clamping Voltage
VC
40
V
IPP = 1A (8 x 20µs pulse)
Clamping Voltage
VC
71
V
IPP = 3.5A (8 x 20µs pulse)
Peak Pulse Current
IPP
3.5
A
tp=8/20µs
Junction Capacitance
CJ
pF
VR = 0V, f = 1MHz
1
1
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GBLCXXC-MS
Semiconductor
Compiance
PACKAGE MECHANICAL DATA
REEL SPECIFICATION
P/N
GBLCXXC-MS
PKG
SOD-323
QTY
3000
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GBLCXXC-MS
Semiconductor
Compiance
Attention
■ Any and all MSKSEMI Semiconductor products described or contained herein do not have specifications
that can handle applications that require extremely high levels of reliability, such as life-support systems,
aircraft's control systems, or other applications whose failure can be reasonably expected to result in serious
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nearest
you
before using any MSKSEMI Semiconductor products described or contained herein in such applications.
■ MSKSEMI Semiconductor assumes no responsibility for equipment failures that result from using products
at values that exceed, even momentarily, rated values (such as maximum ratings, operating condition ranges, or
other parameters) listed in products specificationsof any andall MSKSEMI Semiconductor products described
orcontained herein.
■ Specifications of any and all MSKSEMI Semiconductor products described or contained herein stipulate the
performance, characteristics, and functions of the described products in the independent state, and are not
guarantees of the performance, characteristics, and functions of the described products as mounted in the
customer’s products or equipment. To verify symptoms and states that cannot be evaluated in an independent
device, the customer should always evaluate and test devices mounted in the customer’sproducts orequipment.
■ MSKSEMI Semiconductor. strives to supply high-quality high-reliability products. However, any and all
semiconductor products fail with someprobability. It is possiblethat these probabilistic failures could give rise to
accidents or events that could endanger human lives, that could give rise to smoke or fire, or that could cause
damage to other property. When designing equipment, adopt safety measures so that these kinds of accidents
or events cannot occur. Such measures include but are not limited to protective circuits anderror prevention
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but no guarantees are made or implied regarding its use or any infringementsof intellectual property rights or
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■ Any and all information described or contained herein are subject to change without notice due to
product/technology improvement, etc. Whendesigning equipment, referto the "Delivery Specification" for the
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