ESD9L5.0ST5G-MS

www.msksemi.com ESD9L5.0ST5G-MS Semiconductor Compiance Features  Small Body Outline Dimensions: 0.039″x 0.024″(1.0 mm x 0.60 mm)  Protects one I/O or power line  Low Clamping Voltage  Ultra Low Capacitance:0.9pF  Working Voltage: 5 V  Low Leakage Current  Response Time is Typically < 1 ns SOD-882 IEC COMPATIBILITY (EN61000-4)  IEC 61000-4-2 (ESD) ±15kV (air), ±8kV (contact)  IEC 61000-4-4 (EFT) 40A (5/50ns) Mechanical Characteristics Applications   DFN1006  Laptop Computers Molding compound flammability rating:  Cellular Phones UL 94V-0  Digital Cameras  Marking: Marking Code  Personal Digital Assistants (PDAs)  Packaging: Tape and Reel per EIA 481  RoHS/WEEE Compliant ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) P/N ESD9L5.0ST5G-MS C (pF) VC (V) @ IPP = 1 A (Note 3) VC mA Max Max Per IEC61000−4−2 (Note 4) 1.0 0.9 12.9 VRWM (V) IR (µA) @ VRWM VBR (V) @ IT (Note 2) IT Max Max Min 5.0 1.0 5.4 Figures 1 and 2 See Below 2. VBR is measured with a pulse test current IT at an ambient temperature of 25C. 3. Surge current waveform per Figure 4. 4. For test procedure see Figures 3. www.msksemi.com ESD9L5.0ST5G-MS Semiconductor Compiance ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) Symbol Parameter IPP Maximum Reverse Peak Pulse Current VC Clamping Voltage @ IPP VRWM IR VBR I Working Peak Reverse Voltage Maximum Reverse Leakage Current @ VRWM Breakdown Voltage @ IT IT Test Current IF Forward Current VF Forward Voltage @ IF Ppk Peak Power Dissipation C IPP IT VC VBR VRWM IR IR VRWM VBR VC IT V IPP Bi−Directional TVS Capacitance @ VR = 0 and f = 1.0 MHz Figure 1. ESD Clamping Voltage Screenshot Positive 8 kV Contact per IEC61000−4−2 Figure 2. ESD Clamping Voltage Screenshot Negative 8 kV Contact per IEC61000−4−2 www.msksemi.com ESD9L5.0ST5G-MS Semiconductor IEC 61000−4−2 Spec. Ipeak Level Test Voltage (kV) First Peak Current (A) Current at 30 ns (A) Current at 60 ns (A) 1 2 7.5 4 2 2 4 15 8 4 3 6 22.5 12 6 4 8 30 16 8 Compiance IEC61000−4−2 Waveform 100% 90% I @ 30 ns I @ 60 ns 10% tP = 0.7 ns to 1 ns % OF PEAK PULSE CURRENT 100 tr 90 PEAK VALUE IRSM @ 8 µs PULSEWIDTH(tP) ISDEFINED ASTHATPOINT WHERETHE PEAK CURRENT DECAY= 8 µs 80 70 60 HALF VALUE IRSM /2 @ 20 µs 50 40 30 tP 20 10 0 0 20 40 t, TIME (µs) 60 80 Figure 4. 8 X 20 µs Pulse Waveform www.msksemi.com ESD9L5.0ST5G-MS Semiconductor Compiance PACKAGE MECHANICAL DATA Symbol A A1 D E D1 E1 b e e1 L1 L2 Dimensions In Millimeters Min. Max. 0.450 0.550 0.010 0.090 0.950 1.050 0.550 0.650 0.390REF. 0.400 0.500 0.420REF. 0.580 0.680 0.360REF. 0.050REF. 0.270 0.370 Dimensions In Inches Min. Max. 0.018 0.022 0.000 0.004 0.037 0.041 0.022 0.026 0.015REF. 0.016 0.020 0.017REF. 0.023 0.027 0.014REF. 0.002REF. 0.011 0.015 REEL SPECIFICATION P/N ESD9L5.0ST5G-MS PKG QTY SOD-882 10000 www.msksemi.com ESD9L5.0ST5G-MS Semiconductor Compiance PACKAGE MECHANICAL DATA A Dim B C R D E MIN Millimeters MAX MIN MAX A 0.0125 0.02 0.32 0.52 B 0.000 0.002 0.00 0.05 C 0.037 0.043 0.95 1.080 D 0.022 0.027 0.55 0.680 E 0.016 0.024 0.40 0.60 F 0.008 0.012 0.20 0.30 H R F Inches 0.015Typ. 0.001 0.40Typ. 0.005 0.05 0.15 H 1.20 0.50 0.60 0.70 NOTES: 1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES). 2. THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY. CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR COMPANY'S MANUFACTURING GUIDELINES ARE MET. REEL SPECIFICATION P/N ESD9L5.0ST5G-MS PKG SOD-882 QTY 10000 www.msksemi.com ESD9L5.0ST5G-MS Semiconductor Compiance Attention ■ Any and all MSKSEMI Semiconductor products described or contained herein do not have specifications that can handle applications that require extremely high levels of reliability, such as life-support systems, aircraft's control systems, or other applications whose failure can be reasonably expected to result in serious physical and/or material damage. 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