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PESD5V0L1BA

PESD5V0L1BA

  • 厂商:

    MSKSEMI(美森科)

  • 封装:

    SOD323

  • 描述:

    ESD抑制器/TVS二极管 SOD323 Ppk=500W Vrwm=5V VC=15V Ipp=34A CJ=180pF

  • 数据手册
  • 价格&库存
PESD5V0L1BA 数据手册
www.msksemi.com PESDXXXL1BA Semiconductor Compiance Mechanical Characteristics  Package: SOD-323   Lead Finish: Matte Tin Case Material: “Green” Molding Compound.   UL Flammability Classification Rating 94V-0 Moisture Sensitivity: Level 3 per J-STD-020   Terminal Connections: See Diagram Below Marking Information: See Below Applications SOT-23   Cellular Handsets and Accessories Personal Digital Assistants   Notebooks and Handhelds Portable Instrumentation  Peripherals   Pagers Peripherals Desktop and Servers Features  500W peak pulse power (8/20µs) Protects one data or power line  Ultra low leakage: nA level   Operating voltage:3.3V, 5V, 12V,15, 24V Ultra low clamping voltage  Complies with following standards: – IEC 61000-4-2 (ESD) immunity test Air discharge: ±30kV Contact discharge: ±30kV – IEC61000-4-4 (EFT) 40A (5/50ns)  RoHS Compliant  Absolute Maximum Ratings (TA=25°C unless otherwise specified) Parameter Peak Pulse Power (8/20µs) ESD per IEC 61000−4−2 (Air) ESD per IEC 61000−4−2 (Contact) Operating Temperature Range Storage Temperature Range Symbol Value Unit Ppk 500 W VESD ±30 ±30 kV TJ −55 to +125 °C Tstg −55 to +150 °C www.msksemi.com PESDXXXL1BA Semiconductor Compiance Electrical Characteristics (TA=25°C unless otherwise specified) PESD3V3L1BA Parameter Reverse Working Voltage Breakdown Voltage Symbol Min Typ 3.3 VRWM VBR Max 4 Unit Test Condition V V IT = 1mA Reverse Leakage Current IR Clamping Voltage VC 5 V IPP = 5A (8 x 20µs pulse) Clamping Voltage VC 10 V IPP = 36A (8 x 20µs pulse) Peak Pulse Current Ipp 18 A tp = 8/20µs Junction Capacitance CJ 200 pF VR = 0V, f = 1MHz Max Unit Test Condition 5 V 0.5 µA VRWM = 5V PESD5V0L1BA Parameter Reverse Working Voltage Breakdown Voltage Symbol Min VRWM VBR Typ 8.5 V IT = 1mA Reverse Leakage Current IR 1 µA VRWM = 8V Clamping Voltage VC 11 V IPP = 5A (8 x 20µs pulse) Clamping Voltage VC 15 V IPP = 34A (8 x 20µs pulse) Peak Pulse Current Ipp 15 A tp = 8/20µs Junction Capacitance CJ 180 pF VR = 0V, f = 1MHz www.msksemi.com PESDXXXL1BA Semiconductor Compiance PESD12VL1BA Parameter Reverse Working Voltage Breakdown Voltage Symbol Min Typ VRWM VBR Max Unit 12 V 13.3 Test Condition V IT = 1mA Reverse Leakage Current IR 0.5 µA VRWM = 12V Clamping Voltage VC 19 V IPP = 5A (8 x 20µs pulse) Clamping Voltage VC 28 V IPP = 18A (8 x 20µs pulse) Peak Pulse Current Ipp 10 A tp = 8/20µs Junction Capacitance CJ 100 pF VR = 0V, f = 1MHz Max Unit 15 V PESD15VL1BA Parameter Reverse Working Voltage Breakdown Voltage Symbol Min VRWM VBR Typ 16.7 Test Condition V IT = 1mA Reverse Leakage Current IR 0.5 µA VRWM = 12V Clamping Voltage VC 19 V IPP = 5A (8 x 20µs pulse) Clamping Voltage VC 28 V IPP = 18A (8 x 20µs pulse) Peak Pulse Current Ipp 10 A tp = 8/20µs Junction Capacitance CJ 100 pF VR = 0V, f = 1MHz www.msksemi.com PESDXXXL1BA Semiconductor Compiance PESD24VL1BA Parameter Symbol Reverse Working Voltage Breakdown Voltage Min Typ VRWM VBR Max Unit 24 V 27 Test Condition V IT = 1mA Reverse Leakage Current IR 0.2 µA VRWM = 24V Clamping Voltage VC 40 V IPP = 1A (8 x 20µs pulse) Clamping Voltage VC 62 V IPP = 8A (8 x 20µs pulse) Peak Pulse Current Ipp 5 A tp = 8/20µs Junction Capacitance CJ 50 pF VR = 0V, f = 1MHz Typical Performance Characteristics (TA=25°C unless otherwise Specified) 120 10 % of Rated Power Peak Power_Ppp(W) 100 1 0.1 80 60 40 20 0 0.01 0.1 1 10 100 1000 Pulse Duration_tp(uS) 0 25 50 75 100 125 Ambient Temperature_Ta(℃) 150 Power Derating Curve Peak Pulse Power vs. Pulse Time 100 % of Peak Pulse Current 90 80 70 60 50 40 30 20 10 0 0 20 40 Time_t(uS) 60 80 8 X 20uS Pulse Waveform www.msksemi.com PESDXXXL1BA Semiconductor Compiance PACKAGE MECHANICAL DATA REEL SPECIFICATION P/N PESDXXXL1BA PKG SOD-323 QTY 3000 www.msksemi.com PESDXXXL1BA Semiconductor Compiance Attention ■ Any and all MSKSEMI Semiconductor products described or contained herein do not have specifications that can handle applications that require extremely high levels of reliability, such as life-support systems, aircraft's control systems, or other applications whose failure can be reasonably expected to result in serious physical and/or material damage. Consult with your MSKSEMI Semiconductor representative nearest you before using any MSKSEMI Semiconductor products described or contained herein in such applications. ■ MSKSEMI Semiconductor assumes no responsibility for equipment failures that result from using products at values that exceed, even momentarily, rated values (such as maximum ratings, operating condition ranges, or other parameters) listed in products specificationsof any andall MSKSEMI Semiconductor products described orcontained herein. ■ Specifications of any and all MSKSEMI Semiconductor products described or contained herein stipulate the performance, characteristics, and functions of the described products in the independent state, and are not guarantees of the performance, characteristics, and functions of the described products as mounted in the customer’s products or equipment. To verify symptoms and states that cannot be evaluated in an independent device, the customer should always evaluate and test devices mounted in the customer’sproducts orequipment. ■ MSKSEMI Semiconductor. strives to supply high-quality high-reliability products. However, any and all semiconductor products fail with someprobability. It is possiblethat these probabilistic failures could give rise to accidents or events that could endanger human lives, that could give rise to smoke or fire, or that could cause damage to other property. When designing equipment, adopt safety measures so that these kinds of accidents or events cannot occur. Such measures include but are not limited to protective circuits anderror prevention circuitsfor safedesign, redundant design, and structural design. ■ In the event that any or all MSKSEMI Semiconductor products(including technical data, services) described or contained herein are controlled under any of applicable local export control laws and regulations, products must not be exported without obtaining the export license from theauthorities such concerned in accordance with the above law. ■ No part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopying and recording, or any information storage or retrieval system, or otherwise, without the prior written permission of MSKSEMI Semiconductor. ■ Information (including circuit diagrams and circuit parameters) herein is for example only ; it is not guaranteed for volume production. MSKSEMI Semiconductor believes information herein is accurate and reliable, but no guarantees are made or implied regarding its use or any infringementsof intellectual property rights or other rightsof third parties. ■ Any and all information described or contained herein are subject to change without notice due to product/technology improvement, etc. Whendesigning equipment, referto the "Delivery Specification" for the MSKSEMI Semiconductor productthat you intend to use. www.msksemi.com
PESD5V0L1BA 价格&库存

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PESD5V0L1BA
  •  国内价格
  • 1+0.19950
  • 30+0.19237
  • 100+0.18525
  • 500+0.17100
  • 1000+0.16387
  • 2000+0.15960

库存:725