ESD3V3U4ULC-MS

www.msksemi.com ESD3V3U4ULC-MS Semiconductor  Solid-state silicon-avalanche technology  Low operating and clamping voltage  Up to four I/O Lines of Protection  Ultra low capacitance: 0.5pF typical(I/O to I/O)  Low Leakage  Low operating voltage:3.3V  Flow-Through design Compiance DFN10 10 9 8 7 6 1 2 3 4 5 IEC COMPATIBILITY (EN61000-4)  IEC 61000-4-2 (ESD) ±15kV (air), ±8kV (contact)  IEC 61000-4-4 (EFT) 40A (5/50ns)  IEC 61000-4-5 (Lightning) 5A (8/20μs) Schematic & PIN Configuration Mechanical Characteristics   Molding compound flammability rating: UL 94V-0  Marking: Marking Code  Packaging: Tape and Reel  RoHS/WEEE Compliant Pin Identificaion 1,2,4,5 Input Lines 6,7,9,10 Output Lines (No Internal Connection) 3,8 Ground Circuit Diagram Applications  Digital Visual Interface(DVI)  MDDI Ports  DisplayPortTM Interface  PCI Express  High Definition Multi-Media Interface(HDMI)  eSATA Interfaces Pin1 Pin 2 Pin 4 Pin 5 3 ,8 4-Line Protection www.msksemi.com ESD3V3U4ULC-MS Semiconductor Rating Compiance Symbol Value Units Peak Pulse Power ( tp =8/20μs ) PPP 150 Watts Peak Pulse Current ( tp =8/20μs ) Ipp 5 A ESD per IEC 61000-4-2(Air) +/-17 VESD ESD per IEC 61000-4-2(contact) Operating Temperature Storage Temperature kV +/-12 TJ -55 to + 125 °C TSTG -55 to +150 °C Electrical Parameters (T=25°C ) Symbol I Parameter IPP Maximum Reverse Peak Pulse Current VC Clamping Voltage @ IPP VRWM IR VBR IF Working Peak Reverse Voltage Maximum Reverse Leakage Current @ VRWM VCVBRVRWM Breakdown Voltage @ IT IT Test Current IF Forward Current VF Forward Voltage @ IF V IR V F IT IPP Electrical Characteristics Parameter Symbol Conditions Minimum Typical Maximum Units 3.3 V VRWM Any I/O pin to ground VBR It = 1mA Any I/O pin to ground Reverse Leakage Current IR VRWM = 5V, T=25°C Any I/O pin to ground 1 µA Clamping Voltage Vc Ipp=5A, tp=8/20µs Any I/O pin to ground 15 V VR = 0V, f = 1MHz I/O pin to GND 0.8 pF Reverse Stand-Off Voltage Reverse Breakdown Voltage Junction Capacitance Cj VR = 0V, f = 1MHz Between I/O pins 6.0 V 0.3 pF www.msksemi.com ESD3V3U4ULC-MS Semiconductor Compiance Typical Characteristics Non-Repetitive Peak Pulse Power vs. Pulse Time Power Derating curve 110 100 1 % of Rated Power or IPP Peak Pulse Power - Ppp (KW) 10 150W 8/20µs Waveform 0.1 90 80 70 60 50 40 30 20 10 0.01 0 0.1 1 100 10 25 0 1000 110 40 Waveform Parameters: tr=8us td=20us 90 80 35 Clamping Voltage - Vc(V) 100 Percent of Ipp 150 Clamping Voltage vs.Peak Pulse Current Pulse Waveform 70 e-t 60 50 40 30 Td＝IPP/2 20 10 0 5 125 100 Ambient Temperature - TA( ℃ ) Pulse Duration - tp (us) 0 75 50 10 25 20 15 30 Line to Line 25 Line to Gnd 20 15 Waveform parameters: tr=8us td=20us 10 5 30 0 0 1 2 Time (us) 3 4 5 6 Peak Pulse Current - Ipp (A) Normalized Capacitance vs. Reverse Voltage Insertion Loss S21 - I/O to GND C ( VR) / CJ ( VR = 0 ) CH1S21 LOG 6dB / REF 0 dB 1: -0.086 dB 1.5 1.4 1.3 1.2 1.1 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 900 MHz 3 0 - 6dB - 12dB - 18dB - 1 2 2: -0.0336dB 1.8 GHz 3: -0.126dB 2.5GHz 24dB F=1MHz 0 1 2 3 Reverse voltage - VR (V) 4 5 - 30dB - 36dB - 42dB - 48dB 1 MHz STAR .030MHz 10 MHz 100 MHz 1 3 GHz GHz STOP 3000.000000MHz www.msksemi.com ESD3V3U4ULC-MS Semiconductor Compiance PACKAGE MECHANICAL DATA A A b1xN bbb 1 E/2 C A1 R0.125 E C A B 2 DIMENSI LxN DIM 2X R0.075 PLACES 7 N bxN e B SEATING PLANE aaa C A2 D bbb D/2 C A B Dimensions in millimeters A A1 A2 b b1 D E e L N aaa bbb ONS INCHES MIN MILLIMETERS NOM MAX .020 .023 0.00 .001 (.005) .006 .008 .014 .016 .094 .098 .035 .039 .020 BSC .012 .015 8 .003 .004 .026 .002 .010 .018 .102 .043 .017 MIN NOM MAX 0.50 0.58 0.00 0.03 (0.13) 0.15 0.20 0.35 0.40 2.40 2.50 0.90 1.00 0.50 BSC 0.30 0.38 8 0.08 0.10 0.65 0.05 0.25 0.45 2.60 1.10 0.425 DIMENSIONS P1 P Y Z (C) (Y1) G X X1 DIM INCHES MILLIMETERS C (.034) (0.875) G .008 0.20 P .020 0.50 P1 .039 1.00 X .008 0.20 X1 .016 0.40 Y .027 0.675 Y1 (.061) (1.55) Z .061 1.55 NOTES: CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES). THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY. CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR COMPANY'S MANUFACTURING GUIDELINES ARE MET. REEL SPECIFICATION P/N PKG QTY ESD3V3U4ULC-MS TSLP-9-1 3000 www.msksemi.com ESD3V3U4ULC-MS Semiconductor Compiance Attention ■ Any and all MSKSEMI Semiconductor products described or contained herein do not have specifications that can handle applications that require extremely high levels of reliability, such as life-support systems, aircraft's control systems, or other applications whose failure can be reasonably expected to result in serious physical and/or material damage. 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