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GBLC12C-MS

GBLC12C-MS

  • 厂商:

    MSKSEMI(美森科)

  • 封装:

    SOD323

  • 描述:

    双向TVS二极管 SOD323-2 VC:25V 1pF

  • 数据手册
  • 价格&库存
GBLC12C-MS 数据手册
www.msksemi.com GBLCXXC-MS Semiconductor Compiance Features  350W peak pulse power (8/20μs)  Ultra low capacitance :1.0pF typical  Ultra low leakage:nA level  Low Operating:3.3V,5V,8V,12V,15V,24V  Low clamping voltage  Protects one power line or data line  Complies with following standards: – IEC 61000-4-2 (ESD) immunity test Air discharge: ±30kV Contact discharge: ±30kV – IEC61000-4-4 (EFT) 40A (5/50ns)  RoHS Compliant Mechanical Characteristics        Package: SOD-323 Lead Finish: Matte Tin Case Material: “Green” Molding Compound. UL Flammability Classification Rating 94V-0 Moisture Sensitivity: Level 3 per J-STD-020 Terminal Connections: See Diagram Below Marking Information: See Below Circuit and Pin Schematic SOD-323 Applications     USB Ports Smart Phones Wireless Systems Ethernet 10/100/1000 Base T Absolute Maximum Ratings (T A=25°C unless otherwise specified) Parameter ESD per IEC 61000−4−2 (Air) ESD per IEC 61000−4−2 (Contact) Operating Temperature Range Storage Temperature Range Symbol VESD Value ±30 ±30 Unit kV TJ −40 to +85 °C Tstg −55 to +150 °C www.msksemi.com GBLCXXC-MS Semiconductor Compiance Electrical Characteristics (TA=25°C unless otherwise specified) GBLC03C-MS Parameter Reverse Working Voltage Breakdown Voltage Symbol Min Typ VRWM VBR Max Unit 3.3 V Test Condition V IT = 1mA 100 nA VRWM = 3.3V 4 Reverse Leakage Current IR Clamping Voltage VC 7 V IPP = 1A (8 x 20µs pulse) Clamping Voltage VC 16 V IPP = 20A (8 x 20µs pulse) Peak Pulse Current IPP 20 A tp=8/20µs Junction Capacitance CJ pF VR = 0V, f = 1MHz 1 1 GBLC05C-MS Parameter Reverse Working Voltage Breakdown Voltage Symbol Min Typ VRWM VBR Max Unit 5 V Test Condition V IT = 1mA 100 nA VRWM = 5V 6 Reverse Leakage Current IR Clamping Voltage VC 10 V IPP = 1A (8 x 20µs pulse) Clamping Voltage VC 18 V IPP = 18A (8 x 20µs pulse) Peak Pulse Current IPP 18 A tp=8/20µs Junction Capacitance CJ pF VR = 0V, f = 1MHz 1 1 www.msksemi.com GBLCXXC-MS Semiconductor Compiance GBLC08C-MS Parameter Reverse Working Voltage Breakdown Voltage Symbol Min Typ VRWM VBR Max Unit 8 V Test Condition V IT = 1mA 100 nA VRWM = 8V 8.5 Reverse Leakage Current IR Clamping Voltage VC 14 V IPP = 1A (8 x 20µs pulse) Clamping Voltage VC 19 V IPP = 13A (8 x 20µs pulse) Peak Pulse Current IPP 13 A tp=8/20µs Junction Capacitance CJ pF VR = 0V, f = 1MHz 1 1 GBLC12C-MS Parameter Reverse Working Voltage Breakdown Voltage Symbol Min Typ VRWM VBR Max Unit 12 V Test Condition V IT = 1mA 100 nA VRWM = 12V 13.3 Reverse Leakage Current IR Clamping Voltage VC 19 V IPP = 1A (8 x 20µs pulse) Clamping Voltage VC 25 V IPP = 10A (8 x 20µs pulse) Peak Pulse Current IPP 10 A tp=8/20µs Junction Capacitance CJ pF VR = 0V, f = 1MHz 1 1 www.msksemi.com GBLCXXC-MS Semiconductor Compiance GBLC15C-MS Parameter Reverse Working Voltage Breakdown Voltage Symbol Min Typ VRWM VBR Max Unit 15 V Test Condition V IT = 1mA 100 nA VRWM = 15V 16.7 Reverse Leakage Current IR Clamping Voltage VC 20 V IPP = 1A (8 x 20µs pulse) Clamping Voltage VC 31 V IPP = 8A (8 x 20µs pulse) Peak Pulse Current IPP 8 A tp=8/20µs Junction Capacitance CJ pF VR = 0V, f = 1MHz 1 1 GBLC24C-MS Parameter Reverse Working Voltage Breakdown Voltage Symbol Min Typ VRWM VBR Max Unit 24 V Test Condition V IT = 1mA 100 nA VRWM = 24V 26.7 Reverse Leakage Current IR Clamping Voltage VC 40 V IPP = 1A (8 x 20µs pulse) Clamping Voltage VC 71 V IPP = 3.5A (8 x 20µs pulse) Peak Pulse Current IPP 3.5 A tp=8/20µs Junction Capacitance CJ pF VR = 0V, f = 1MHz 1 1 www.msksemi.com GBLCXXC-MS Semiconductor Compiance PACKAGE MECHANICAL DATA REEL SPECIFICATION P/N GBLCXXC-MS PKG SOD-323 QTY 3000 www.msksemi.com GBLCXXC-MS Semiconductor Compiance Attention ■ Any and all MSKSEMI Semiconductor products described or contained herein do not have specifications that can handle applications that require extremely high levels of reliability, such as life-support systems, aircraft's control systems, or other applications whose failure can be reasonably expected to result in serious physical and/or material damage. Consult with your MSKSEMI Semiconductor representative nearest you before using any MSKSEMI Semiconductor products described or contained herein in such applications. ■ MSKSEMI Semiconductor assumes no responsibility for equipment failures that result from using products at values that exceed, even momentarily, rated values (such as maximum ratings, operating condition ranges, or other parameters) listed in products specificationsof any andall MSKSEMI Semiconductor products described orcontained herein. ■ Specifications of any and all MSKSEMI Semiconductor products described or contained herein stipulate the performance, characteristics, and functions of the described products in the independent state, and are not guarantees of the performance, characteristics, and functions of the described products as mounted in the customer’s products or equipment. To verify symptoms and states that cannot be evaluated in an independent device, the customer should always evaluate and test devices mounted in the customer’sproducts orequipment. ■ MSKSEMI Semiconductor. strives to supply high-quality high-reliability products. However, any and all semiconductor products fail with someprobability. It is possiblethat these probabilistic failures could give rise to accidents or events that could endanger human lives, that could give rise to smoke or fire, or that could cause damage to other property. When designing equipment, adopt safety measures so that these kinds of accidents or events cannot occur. Such measures include but are not limited to protective circuits anderror prevention circuitsfor safedesign, redundant design, and structural design. ■ In the event that any or all MSKSEMI Semiconductor products(including technical data, services) described or contained herein are controlled under any of applicable local export control laws and regulations, such products must not be exported without obtaining the export license from theauthorities concerned in accordance with the above law. ■ No part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopying and recording, or any information storage or retrieval system, or otherwise, without the prior written permission of MSKSEMI Semiconductor. ■ Information (including circuit diagrams and circuit parameters) herein is for example only ; it is not guaranteed for volume production. MSKSEMI Semiconductor believes information herein is accurate and reliable, but no guarantees are made or implied regarding its use or any infringementsof intellectual property rights or other rightsof third parties. ■ Any and all information described or contained herein are subject to change without notice due to product/technology improvement, etc. Whendesigning equipment, referto the "Delivery Specification" for the MSKSEMI Semiconductor productthat you intend to use. www.msksemi.com
GBLC12C-MS 价格&库存

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GBLC12C-MS
  •  国内价格
  • 1+0.18200
  • 30+0.17550
  • 100+0.16900
  • 500+0.15600
  • 1000+0.14950
  • 2000+0.14560

库存:0